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Engineer Engineering

San Jose, CA
45 per hour
December 29, 2020

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Resume and Personal Background

I have over ** years in writing visual basic desktop applications, and over 8 years writing powershell and C script IT applications 15 years of experience in management and working directly with management on the director and vice president levels. These are business and technology related management forums. See three technical writing samples below of two VBA and one powershell programs are written by copy writer by Mark L. Alberi applications. All rights are preserved, and the summaries for each below. Exercise a Non- Disclosure Agreement, NDA disclosure when reviewing the attached technical writing software help files. Software development and technical writing:

Have written top level reliability and ESD equipment’s SOPS, and burn-in board data sheets throughout my QA&R career. I am UNIX certified at Schlumberger. I was am applications engineer on semiconductor Sun Solaris diagnostics equipment of FIBS, and E-Beams for almost 2 years. I provided customer training and performed black box ne software release testing. Needed to understand UNIX command to perform job. Also, have 26 years of software development and technical writing experience. See additional summary below.

I have at least 26 years of various software API application development experience with VBA and VB script. I have 8 years of personnel IT development with Microsoft Powershell, which is a C based object script language and C#. I also have basic IT systems administration knowledge. I have setup clustered Microsoft servers, serving up both clients, the internet, and web mail using Lotus Domino and it all includes 26 years of technical writing of both corporate QA&R technology specifications, system burn-in board data sheets, and visual basic API applications, and C syntax powershell software applications. Semiconductor technology & Management:

I have 15 years of direct quality and reliability engineering and management semiconductor manufacturing of full and fabless semiconductor corporations. In particular, I set up from scratch and ran for over four years, Orbit Semiconductor’s wafer fab reliability group within corporate quality. I had one direct report. I setup real time SPC for both process engineering process improvement DOE experimentation and for SPC quality matrix reporting which I ran and held wafer fab process meetings on a monthly bases, when needed. I also purchased and ran Orbit’s Wafer Level Reliability equipment, failure analysis, new and changes to wafer fab processes, and end product monitor programs on Orbit’s ENCORE contracted gate arrays programs. I managed all of orbit’s reliability engineering subcontractors, and year over year projected and maintained without going over budget, reliability engineering group’s budget. I also have direct wafer fab and device assembly manufacturing QA&R experience. I have basic understanding of photo lithography photo print and photo etching tools, oxide deposition, and metal sputtering. I also have a basic understanding of injection molding and the glass transition curves and their effects on package junction temperature and stress relieve during IR and vapor phase board assembly soldering re-flows. Regards,



Mark L. Alberi

3770 Rosemar Are

San Jose, Ca 95127



To reestablish my technical career.


I have 15 years of face-to-face customer interfacing with a team oriented frame of mind, and a winning and leadership attitude. Customer interfacing has included answering customer questions through written and verbal forms, on site customer training, solving tough customer problems internally and on site, and communicating the results to all levels of management. Also, over the course of my career I have programmed managed all of the quality and reliability programs I have been responsible for with a get things done attitude. Managed component product monitor and qualification programs with budget responsibilities. Also used Failure Mode Effects Analysis (FMEA) to help improve product and process robustness. Managing of QA/R programs have included the overseeing of the test labs like IQL, and General Test Lab (GTL); failure analysis labs like ACCUREL. Have professional level knowledge of MS Office software packages. Have done some business travel internationally


1. Experience performing reliability testing including Static, Dynamic and Vector Driven Operating Life Test at 125C and 150C accelerated testing, Mechanical Stress Tests such as Temperature Cycle, and Thermal Shock, and Environmental Tests such as Temperature Humidity Bias (85C/85%RH), Highly Accelerated Stress Test (135C/85%RH), Non-Bias Pressure Pot (121C, 100%RH, 1Atm. 2. Human Body Model ESD testing at 2000V, and F.A. root cause of I/O cells. 3. Charge Device Model / Zero ohm ESD testing at 200V, and F.A. root cause of I/O cells. 4. Reliability Statistical Analysis using lognormal and Weibull with Chi2 distributions hand charting experience and hand calculations of standard distribution sigma, Weibull statistic, and hand calculations of activation energy based of reliability lognormal split matrix. Have direct SPC statistic experience with JMP. Familiar with accelerated test models such as Failure in Time (FITS) as a function of temperature and activation energy. Familiar with the power law failure rate distribution model of thermal stress. Familiar with failure rate model of humidity bias testing. It is a function of both the operating life failure rate, and an acceleration of electric corrosion of the lead frame, bond pad and unsealed pin whole passivation. 5. Familiar with Failure Analysis techniques (Optical Microscopy (EMI), X-ray/CT, Scanning Electron Microscopy

(SEM), focused ion Beam (FIB), and E-Beam analysis, and the ability to use failure analysis methodology to 3

derive a root cause of failure such as micro probing, fault isolation bench analysis, liquid crystal, parallel lap polishing, chemical etch back. Cross section, and potting cross section, and plasma etch back. 6. Completed official course work at National Semiconductor on Design of Experiments. Have experience with factorial analysis 22 and 23 factorial, and break down of 24. 7. Failure Modes and Effects Analysis is defined as the sum of all failure modes with the highest probabilities listed first, and are analyzed first, and all activation energies must be known. 8. Performed wafer level reliability testing of time dependent dielectric breakdown, hot carrier and electromigration (EM) reliability test matrix and calculated their reliability statistics using lognormal distribution analysis. Also, designed my own EM minimum geometry metal line width test structures. RELEVANT SKILLS:

Standardized companywide reliability test, reliability test hardware, ESD and Latch-up methodologies and requirements.

Written many reliability specs and reliability test hardware data sheet notes. 1. 25 years of visual basic API applications and IT client VBscript development. 2. 7+ years of Microsoft Powershell IT client development. 3. 25 years of visual basic EXCEL macro development 4. 4 years of general Microsoft server administration of DNS, DHCP and IIS web servers. 5. 8 years of Lotus notes development

6. 4 years of Lotus Domino Administrator experience on Windows NT OS platform in both network client and web administration

7. Have performed windows 7 migration to windows 10 by both the windows update and down loading the ISO, and updated all drivers afterword’s, and tested key apps to ensure they startup correctly. WORK EXPERIENCE:

07/12-Present Self Employed

Personal Software Development

San Jose, Ca

1. Developed personal visual basic and Microsoft Powershell client IT scripts as a leaning aid. Also have 25 years in developing visual basic applications and using VB APIs and 7 years with C script. Also, have written personal APIs to the windows API standards. I have written my own non published windows APIs and have written my own documents on how to use them.

02/17-09/19 Goodwill Silicon Valley

San Jose, Ca

E-Commerce Re-compute Technician

1. Refurbish personnel computers, laptops, cell phones, and tablets. 4

12/05-4/06 Frys Electronics

Sunnyvale, Ca

Computer Service Technician

1. Assisted customers with computer and software problems over the counter. 2. Repaired desktop and laptop computers by changing broken power connectors. 3. Cleaned store computers and printers.

09/05-11/05 Platinum Consultants

San Jose, Ca

Parts Specialist

Space Systems / Loral

1. Reviewed satellite parts list quality compliance, supported resolution of parts problems 2. Coordinated and resolved supplier issues, generated parts documents, and performed data review. 3. Development an Excel visual basic macro that supported database records extraction into Excel. 4. Development a curve tracer data EXCEL macro engineering analysis tool. 5. Perfumed system module level failure analysis.

01/03-12/01/05 Self Employed

Personal Software Development

San Jose, Ca

1. Developed personal visual basic and Microsoft Powershell client IT scripts as a leaning aid. Also have 25 years in developing visual basic applications and using VB APIs and 7 years with C script. Also, have written personal APIs to the windows API standards. I have written my own non published windows APIs and have written my own documents on how to use them.

01/01–11/02 Schlumberger

San Jose, Ca

Applications Engineer

1. Developed applications related to the company's SUN Solaris based e-beam, OptiFib, and Pico Second Circuit Analysis equipment.

2. Carried out customer related technical operations, including bug verification and new product release and validation testing. See Applications Engineering Cover letter. 3. Provided development support for the company’s Clear Quest bug tracking database. 4. Successfully represented new and existing business and existing business for Schlumberger as applications support.

1998-2000 C-Cube Microsystems

Milpitas, Ca

Senior Reliability Engineer

1. As a key member of the ESD task force team, successfully managed the testing and development of product level ESD and Latch-up improvement Programs.

2. Performed product qualifications and failure analysis on VCD, DVD, and Encoder products. 3. Wrote reliability requirements specification. Wrote an ESD requirements specification. 5

4. Managed subcontractor qualification failure analysis labs. 5. Developed a MS Access reliability engineering data bases. 6. Design reliability system level vector driven Operating Life test boards for asynchronous VLSI digital logic devices, and THBT boards, and wrote the data sheets. 1994-1998 Orbit Semiconductor

Sunnyvale, Ca

Senior Reliability Engineer

1. Successfully managed the company's Reliability Engineering Group, which oversaw the development of the Qualification, and Product Monitoring programs.

2. One direct report.

3. Successfully created and ran a real-time wafer fab manufacturing Statistical Process Control (SPC) program, subsequently maximizing the utilization of Orbit Semiconductors Work in Progress tracking system. Additionally replaced all SPC paper charts with online computer representations providing companywide availability.

4. Performed critical RMA problem resolutions.

5. Facilitated company meetings as SPC chair.

6. Acted as a customer sales liaison for reliability, by presenting them to potential customers, writing on demand reliability data analysis reports for wafer fab and ENCORE gate array products and corporate clients. 7. Wrote reliability requirements specification for wafer fab and ENCORE gate array products. 8. Designed a physical design degradable resistor and a current funnel interface layout for performing electromigration. Wrote a process monitor (PCM) statistical data analysis program by PCM module. 9. Developed a Lotus Notes reliability engineering database. 10. Ran Orbit’s Wafer Level Reliability Program. This included, WLR equipment procurement, on time and meaningful data reporting for wafer fab and business needs, designed a physical design degradable resistor electromigration test structure, WLR chip layout for efficient wire bonding, gate oxide testing, electormigration testing, and hot carrier testing.

11. Managed Orbit‘s reliability-engineering budgets for four years. 12. Successfully represented new business and existing business for Orbit Semiconductor. 13. Design reliability system level dynamic driven Operating Life test boards for asynchronous ENCORE gate array digital logic devices, and THBT boards, and wrote the data sheets. 1988-1994 National Semiconductor

Santa Clara, Ca

Senior Reliability Engineer

1. Conducted manufacturing qualifications on newly developed products. 2. Chemical lab certified and performed root cause failure analysis. 3. Led the ISO preparation team for the reliability department supported by familiar ISO9000 philosophies yielding operationally profitable results.

4. Design reliability system level vector driven Operating Life test boards for asynchronous VLSI digital logic devices, and THBT boards, and wrote the data sheets. EDUCATION:

1986 University of California Riverside Bachelor of Science, Physics REFERENCES AVAILABLE UPON REQUEST


10/1988-Present Cover Letters:

Management Cover:

In my 15 year semiconductor career I ran reliability engineering, defined its specification company goals, reliability requirements for new products and new manufacturing process to the highest industry standards for each of the market places which the products and process were sold, such as Military, AEROSPACE, Commercial, Office, Industrial, and contract. Managed suppliers, budgets, made Marketing and direct sales report, solved critical RMA business problems directly with customers and sales, on site and with customer visits. Regards,


Wafer Fab quality & Reliability Management:

I have a general B.S. physic degree. I worked as fab reliability engineer / manager at Orbit Semiconductor. I put real time SPC in their 4 inch 2um and 6 inch 0.8um CMOS fabs. They had the capability but could not implement it. The on-line SPC IBM medium frame software was missing necessary user interface script. I defined what it was and had the code written by the software supplier. It worked the first time. I rolled it out and trained the fey process engineers. I also, defined in spec process reliability, and monitoring requirements and managed product level fab FA and monitoring.




General Summary Cover:

While my direct experience resides primarily within semiconductor quality and reliability, I have worked directly with all aspects of semiconductor backend in wafer fab, and end product; such as product engineering, test, SPC, wafer level reliability (WLR), new and existing business customers, new business audits, new product introduction processes such as product definition, design phase, tape out phase, manufacturing phase (wafers out, and device assembly), and production test development (temperature testing, and test fixture development) etc. I also have experience with LAN and WAN networks, UNIX, C, SQL, Visual Basic, and HTML scripts. As an example of my technical and organizational skills, I created and ran Orbit’s reliability program for four years. The program included a real time SPC fab program, end product monitor program, new process and customer product qualification programs which supported sales and marketing QA/R issues. Orbit’s reliability program also included a comprehensive wafer level reliability program, which supported new process development for both new process technology nodes and major changes to existing fab processes, which I created and ran. For example, I purchased all necessary capital equipment, and designed my own minimum geometry aluminum alloyed based metal film electromigration structures, which I used to successfully evaluate and qualify new aluminum film based processes for Orbit Semiconductor. See image below. The elecromigration test structure is a copy writeable, possible patentable degradable parametric resister design. I look forward in hearing from you to discus a career move to your company.




Mechanical Engineering Cover:

I have a B.S. in general physics. I have a very good understanding of mechanical engineering principals, and structural design in general. For example, if you look at the EM image the attached resume, you can clearly see it was designed with stress relief in mind. Also, I have design and built my own R/C model airplanes, in which I have designed torsion strength braces for the fuselage between the wing training edge and the tail section to eliminate fuselage torque twist cause by centripetal forces caused by aircraft roll and yaw. Regards,


Package Engineering:

With my B.S. in general physics I have a solid background in materials, such as glass transition curves, molding compound junction temperature as function of thermodynamics and applied power. I also understand phase transition states which affect the flow of the raw mold compound when it is melted and flowed into the package molds, and how the control of the mold flow affects the lead frame, wire sweep wire bonding. I also understand compression ultrasonic gold wire bonding, and how the pad aluminum migrates into the gold wire ball material lattice. This is because the Al atom is much smaller than Au, and therefore it can migrate between two adjacent gold atoms if enough mechanical or electrical energy / force is applied at the Al to Au interface. Regards,


Applications Engineering Cover:

I was an applications engineer for 2 years at Schlumberger. I provided customer applications support for semiconductor diagnostic SUN UNIX platform FIBs and E-Beams. I also provided black box software quality testing of new releases system software. Prior to Schlumberger I no experience as an applications engineer, but I picked up on it quite quickly, and did customer onsite training and demos as well. Regards,



Electro Static Discharge (ESD) Quality & Failure Analysis Root Cause Cover: While my direct experience resides primarily within semiconductor quality and reliability, I have a successful track record in solving silicon ESD design problems. This is because of my physics background, and the fact that during the course of my QA/R career I have been involved with many ESD issues. Please get me an informational phone interview with the hiring manager so that I may talk about what I know about ESD and its solutions. As this letter will better describe what I have done to help solve silicon ESD problems and will augment my resume. The best example of my silicon ESD knowledge is when I worked at C-Cube Microsystems. At C-Cube I was part of a high profile ESD design (I represented all aspects operations engineering) team that was given the task to fix C- Cube’s product’s human body model (HBM) ESD sensitivity problems of less than 2000V. ESD Support Responsibilities:

1) Establish companywide HBM ESD requirements that adhered to both industry standards and meet C-Cube’s business needs.

2) Manage the ESD testing, and failure analysis of zapped parts. Provide ongoing technical reports of the ESD results to the ESD design team and to VP level management. This was a QA/R function and operations function. 3) Provide the technical interpretation of the FA results and physics for the physical defects due to the ESD test zap to physical design. Design then could make the necessary physical design changes to the failing I/O cell based on the correct physics analysis of the FA results. This was my technical contribution to the ESD design team. The physics analysis included poor current spreading through contacts, low parasitic capacitance of the I/O cell (some times this can not be helped due to I/O cell performance requirements such as speed), poor ESD event clamping of the bypass device, poor device isolation and layout considerations that must be given to mix signal power bussing over analog I/O cells etc.



Specification and Data Sheet Writing:

Written company technical specifics such as manufacturing qualification and reliability, and ESD specifications from scratch. Also, written reliability product system level test board data sheets from scratch. Regards,



Software Experience Cover:

I have over 25 years of visual basic application, API and VBscript experience. I have over 7 years of powershell development experience.



Software Development and Network Administration Cover While my direct experience resides primarily within semiconductor quality and reliability, I have experience with LAN and WAN networks, Lotus Notes, Lotus/Domino, UNIX, C, SQL, Windows Powershell IT script, Visual Basic, and HTML scripting. Based on what the internet technologies were in 1998 I decided to start my own ISP (Softglue) which offered IT network services to small businesses within the frame work of a small business model. This was possible because I chose to develop remote user interface software that was served up into a web browser; for purposes of modifying / creating their own web site across the internet, and for maintaining their own web site data bases. The customer could access their information across a secured socket layer (SSL) network, and their information was stored on Lotus Notes databases, and served up by a Lotus/Domino web server. Integrating Lotus SSL encryption with Microsoft 128 bit encryption provided the primary firewall protection. Based on what I have out said above, I have confidence in the fact that I can significantly add value to your organizational structure, and hence add value to your company growth. I look forward to speaking with you soon. Regards,


RBG Dynamic Color Palette Help


Copyright (c) 2019, 2020 by Mark L. Alberi

RBG Dynamic Color Palette application is a RGB color and legacy QB color codes picker application. RGB Dynamic Color Palette generates Red (R), Green (G), and Blue (B) visual color codes and visual graphics for the programmer and the graphics artist.

See the application image for details, Image 1 at end of the help document. Help:

Displays this file as a pdf or text file format.

RGB Slider Bars:

There are there slider bar; Red (R), Green (G), and Blue (B). These slider bars move independently, and each spans the entire RGB index range of 0 to 255 each. As the scroll bar moves for each, the resulting color is displayed in the RGB Raw Color boxes labeled R, G and B vertically in the application window with 11

their RGB indexes displayed at the end of the sliders, and the sum color of all three red, green and blue sliders is displayed in the RGB Color larger box.

Red (R), Green (G), & Blue (B) Boxes:

These color boxes displays the individual RGB colors of each RGB slider movement or RGB Index input. RGB Color:

The RGB Color box is a dynamic color pallet. The RGB Color is the result color of all three individual color RGB sliders or RGB Index user inputs, and changes dynamically as the Red, Green and Blue colors change.

QB Colors:

QB colors are legacy video display colors from 16-bit operating systems, and have indexes from 0 to 15. The QB colors are the prime colors of current 64-bit RGB colors within small pixel error differences. It is assumed by the RGB color Code Scale application that these pixel errors are small enough to ignore, and that the RBG colors are equivalent to the 16 RGB prime colors, and the RGB equivalent colors are displayed in the RGB color boxes, the RGB sliders are moved to the corresponding RGB index when the user clicks on a QB color code. The QB color code index is displayed in the QB color box when clicked. See Table 1 below for the QB colors, and the QB color code indexes to RGB color code indexes. 12

Table 1:

QB Color Codes to RGB Color Codes

Number Color RGB Code Number Color RGB Code

0 Black 0,0,0 8 Gray 128,128,128

1 Blue 0,0,128 9 Light Blue 0,255,0

2 Green 0,128,0 10 Light Green 0,255,0

3 Cyan 0,128,128 11 Light Cyan 0,255,255

4 Red 128,0,0 12 Light Red 255,0,0

5 Magenta 128,0,128 13 Light Magenta 255,0,255

6 Yellow 128,128,0 14 Light Yellow 255,255,0

7 White / Silver 192,192,192 15 Bright White 255,255,255 Options:

There are ten options; Enter Text, Red - White Text, Green - White, Blue - White Text, RGB Color – White Text, Regular, bold, Italic, Font Size, and Font. Enter Text:

This check box enables text input into the RCB color boxes, and enables all other options when checked. This check box deletes all text input into the color boxes and disables the other options when unchecked. For Example, “Help File” was entered in the RGB Color / Text box as font size 24 as Symbol text in Image 2.

Red, Green, Blue, RGB Color - White Text:

These check boxes changes the default black font fore color to white when checked for each single color, and the RGB result color boxes and restores the font fore color to black when unchecked for each RGB color box. For some RGB colors, it might be better to see the text, as white text, and vice versa. Font Face:

There are three font face check boxes; Regular, Bold, and Italic. Selecting each of these boxes changes the text face in the RGB color boxes accordingly. Selecting the Regular check box resets the RGB color boxes to the default of no face, or standard type font face. For Example, “Help File” was entered in the RGB Color / Text box as font size 24 and Symbol text in Image 2. RGB Index:

This check box enables user input RBG index boxes, as an option to the standard RBG Scroll Bar slider option described in this help file.

RGB Text:

This check box enables changing RGB text colors in the RGB Colors palette box, and sets its background to white. Moving the RGB scroll bars, or entering the index in the RGB Index boxes, or selecting a QB color from the QB color palette will change the text color in the RGB Colors box. If RBG Color is selected to adjust the desired background color, the RGB Color settings are displayed for user interface, as RBG Colors - RGB(133,169,143) for the demo Image 2 by switching from RGB Color to RGB Text.


Options (Continued):

RGB Color:

This checked enables changing text with the currently set background color. The check box acts like a toggle switch. Each time it is checked it sets the background color to the current RGB index colors, and initializes the text color to white if the RGB index is greater than RGB: 128,128,128, and black otherwise. If RBG Text is selected to adjust the desired text fore color, the RGB Text color settings are displayed for user interface, as RBG Text Colors - RGB(212,178,198) for the demo Image 2 by switching from RGB Text to RGB Color.

Reset RGB:

This check box resets the RGB Dynamic Color Pallet to its default startup window state.. RGB Color - Black:

This check box sets the background color of the RGB Color box to black when checked. This check box is enabled when the RGB Text check box is checked, and disabled when it is unchecked. Font Size:

This check box changes default 10 font size from 1 to 72 based on user input. Zero font, and text input are not allowed, and a run-time error will be generated for each, and default fore size of 10 will be restored to the RGB color boxes. For Example, “Help File” was entered in the RGB color / Text box as font size 24 and Symbol text in Image 2.


Selecting a font from the pull down menu will change the default font from Arial to the new selected font by the user. For Example, “Help File” was entered in the RGB Color / Text box as font size 24 and Symbol text in Image 2. See Table 2 below for a list of the supported fonts by RGB Color Code Scale application.

Table 2:

Font List

Agency FB


Arial Narrow


Bodoni MT


Calisto MT




Courier New

MS Serif



Times New Roman




RBG Dynamic Color Palette Window

Image 1:

Image 2:


API Treaded Demo Readme:

API Treaded Demo is a practical executable (exe) application demonstrating the API Tread Application Program Interface for passing user input properties between two different executables via a user input argument visual basic script (AppStartUp-Thread- Rev[N].vbs) executable. The user input parameters can also be passed directly to the API Tread by the programmer in their own script. The following, are instructions on how to pass user input properties from one executable to another via the AppStartUp- Thread-Rev[N].exe, and the API Tread Demo, and a short cut with administrator rights. Setup Window:

By setting Prop 2 to [False] will keep the Close API Thread Demo application open after the user application opens, and all the user passed threaded property arguments will be displayed in the API Thread Demo window without the user defined background picture. This allows the user to see how their short cut passed properties, were passed to the API Thread Demo application for debugging. Also, the Information pull down will be displayed showing the application “About” and this “Help” readme file. Where:

Prop1 = Window format: 0, 1, 2 integers. 0 = Basic Window, 1 = Border Window, 2 = Framed Window, 3 = Demo Mode Prop2 = Close API Thread Demo: Boolean: True / False Prop3 = Close Treaded App on Exit: Boolean: True / False Prop4 = Window Caption

Prop5 = User Defined Background: String: "[FilePath]\PictureName.bmp, jpg, etc Prop6 = Run External Application From API Treaded Demo: String: "[FilePath\[ExternalApp.exe]" Prop7 = Full File Name Path of the API Treaded Demo: String: "[FilePath]\ App Extension\AppExtns.exe" API Treaded Demo Instructions:

Create an AppStartUp-Thread-Rev[N].exe shortcut with “Run as administrator” right click and set the shortcut path as follows:

[FilePath]\AppStartUp-Thread-Rev[N].exe Prop1

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