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Engineer Manufacturing

Tracy, California, United States
June 12, 2019

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Muhammad Nasim

**** ******** **., *****, ** *****

Cell: 510-***-****


Experienced Manufacturing/Process engineer with over 15 years of high-tech, semi-conductor, micro- electronics manufacturing experience seeking an engineering position with a technology company Skills

• Process integration from R&D to high volume manufacturing

• Wafer fab experience

• Semiconductor Manufacturing

• Lean manufacturing

• Failure analysis

• Magnetic head manufacturing

• Training

• Equipment modifications,

• Thin film processes like Sputtering, PVD, CVD, ALD, Dry etch, RIE

• Project management


Western Digital, Fremont, CA 15 years 2004-2019

Principal Engineer

• Lean Manufacturing Methodologies

Head manufacturing cycle time/ cost reduction. Improvements in production line efficiency. Managed suppliers to improve their performance, reduce overall cost of manufacturing and logistics. Worked and several projects (power points available) to safe one million dollars in last 18 months. Collaborated as member of Lean manufacturing team, developing processes to reclaim test monitor. Introduced sub-merged vacuum wand usage- saved $50K/year

• Process Engineering

Qualification of Bottom Anti-Reflected Coating in Plasma Therm tool for photo litho-graphy required in head manufacturing. Ownership of tools and processes for thin films, di-electric alumina and precious metals deposition, including sputtering, RIE, CVD, PVD tools like Symetra, CVC, Comptech, Plasma Therm, Tegal. Familiar with metrology tools, like SEM, AFM, Nano, 4 point probe, BHlooper, XRD and use of microscope. Sustained ownership of tools and processes, updating procedures and specifications. Analyzed, identified, and resolved process issues and developed new processes, and transferring new processes from R&D to production. Fixed major, unsolved mystery in Plasma Therm tool and saved 400K/year.

• Manufacturing Production

Worked closely with production and manufacturing teams, resolved issues in minimum time. Due to vast hands-on experience, other groups and departments wanted me to be on their team to understand the issues and fixes. Modified micro electronics manufacturing tool, like Tencor, and design of new support fixture to tape glass monitor with AlTiC wafer without touching then wafers. Introduce may fixture and modification tools in the fab to reduce cycle time

• Root Cause Analysis

Accuracy in Data collection, running tests, analysis results, and fixing root causes or suggested possible solutions. Fixed process to avoid breaking wafers in Anelva due to thermal shock. Fixing wafer clamshell carriers and storage racks to stop breaking wafers. Performed failure analysis to support various groups, using microscope, SEM, Joel and EDX, for example analyze particle or contamination and getting detail about elements or source of contamination. Fixed major tool and recipe issues at R&D level and saved 300K

• Starting new 200 mm wafer pilot line

Converted fab from 150 mm to 200 mm wafers. Planned and tested the key tools to made them ready to run pipe cleaners. Prepared all types of monitors to test tools and recipes. Started 200 mm wafer pilot line as a strong team member and set-up reclaim process for wafers and monitors including specification and documentation. 50% more head, doubled the yield

• Continuous Improvement

Designed and manufactured fixtures and modification in production tools, as per customized requirements considering continuous improvement for process and wafer handling. Utilized experience of semi-conductor manufacturing and working in clean room fabs, fixed issues in minimum time and cost in simplest way. Continuously listen to the feed back from manufacturing floor and modified tool and process to save production time and waste

• Process Efficiencies

Worked with integration team to reduce 1000 plus step operation process for head/sensor manufacturing to 850 operations. Improved recipes by increase safe power, fixed issues in process and some time tool, like butterfly buttons in Comptech tool.

• Problem solving/ Troubleshooting

Worked with Photolithography team to identify the root cause of hot spot in ASML and reduced rework rate from 17 wafers per week to 5 wafers per week. Saving cost $30k/year

• Training and Development

Trained 600 plus employees in last 8 years including operators, technician, and Engineers for using techniques for handling wafers in high tech clean room fabs, with detailed documentation.

• Supply Chain Management

Modified production tools from design, manufacture, install, test, training and documentation. Designed support tools for the fab to help doing jobs more accurately. To achieve this, worked closely with machine shops and vendors. Ordering parts and getting them from vendors in special cases.

• Collaborative Team Member

• Dependable and Task Driven

• Familiarity with FPS and MKS systems. In-depth knowledge of units

• Familiarity with photo, plate and etch processing Read-Rite Corporation, Fremont, CA 4 years

Senior Process Engineer 2000-2004

Controlled tool and processes including PVD, CVD, RIE. Resolved production issues, qualifying new recipes and processes and transferred from R&D to Production. Knowledge of different types of wafers. Applied Magnetics, Santa Barbara, CA 3 years

Process Engineer 1997-2000

Maintained micro-electronics manufacturing processes, disposition product. Worked in shifts and supported Thin Film area.

Chemical Coating Industries, Karachi, Pakistan 7 years 1989 -1996 Maintenance Engineer

Maintaining metallization plant, maintenance of vacuum pumps, installation of cooling towers and supervise machine shop for spare parts and metal cylinders for color printing machines. Experience moving heavy equipment. Loading unloading containers EDUCATION

Master of Science (MS), Industrial Engineering

University of Oklahoma, Norman, OK

Bachelor of Science (BS), Mechanical Engineering

NED University of Engineering and Technology, Karachi

(18 units of Coursework) PhD, Industrial and Manufacturing Wayne State, Detroit, MI

US citizen Available to start work

Shifts are ok Scout

Salary reasonable Seaman (one year shipping experience) Traveling experience, more than 20 countries


Latest: Western Digital

Direct report to; Director Production and Manufacturing- Piyush Desai Ph: 408-***-****


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