Stanley Filipiak

Home: 512-***-****, Cell: 512-***-****

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ac3lpc@r.postjobfree.com

Pflugerville Texas 78660

www.linkedin.com/in/stanleyfilipiak

SUMMARY

Analytical professional who possesses more than 20+ years of engineering experience in research and development and manufacturing in CVD, PECVD and HDP processes. Routinely exceed corporate expectations having achieved 22 Patents for novel PECVD films and Semiconductor integration methodologies. Recognized by Motorola as a pioneer in PECVD film development and the films passivation expert.

PECVD Technology used in the semiconductor, metallurgical, and health industries

Quality control using in-line real time Fault Detection and Control (FDC)

Lean Manufacturing Training for yield increases and cost decrease

Statistical Process Control of output variables for control of yield and scrap

PROFESSIONAL EXPERIENCE

Motorola / Freescale / NXP, Austin Texas 1984-2016

Semiconductor Development and Manufacturing

Films Manufacturing Engineer, 2007 – 2016

Responsible for the process control, sustaining, integration and defectivity reduction of F-doped HDP, LowK, organic ARC, stressor and liner and spacer PECVD processes used in the manufacturing of integrated circuits for microprocessor and automotive applications.

Conducted daily operation and control of various PECVD processes assuring high product yield and low defectivity.

CVD CSET Expert Team representative to resolve scrap and integration issues and deliver complete analysis to the external customers on their concerns and direct future product changes to the manufacturing line.

Served as a Films and Metals FDC Champion to ensure process control per wafer and identify potential product impact at the wafer level.

Films and Metals Process Transfer Champion between internal and external business units compiling all process and integration data for a successful product transfer.

Senior Scientist for PECVD Development, 2004 - 2007

Created and developed advanced PECVD films and materials used in the manufacture of advanced microprocessors and automotive integrated circuits down to 90nm. Controlled these in a pilot production atmosphere and followed these processes through to successful integration.

Stanley Filipiak Page Two

Completed development and qualification of the Fluorine-doped TEOS process, which is the low “K” dielectric for HiP6 and HiP7 material which is still in manufacturing and being sold across the globe.

Completed development and qualification of the LowK barrier process for HiP8 and beyond material which is now in advanced system controls in the automotive industry.

Served as Senior PECVD Scientist for HiPX technology initiatives. Recognized as the expert in Passivation and integration of PECVD films, and creator of new plasma ARC films for use in 248 and 193 nm lithography. These processes are being used in automotive controls and micro-controllers.

Process Development Engineer, 1984 - 2004

Primary engineer for the introduction of PECVD processing into APRDL (Advanced Products Research and Development Laboratory). EPI, RTA, and RTP process engineer.

Maintained PECVD processes for pilot production of R & D material with adequate yield and stability while developing newer films for semiconductor integration.

Achieved the distinction of being one of a small group of people within Motorola to achieve “Distinguished Innovator” Status for achieving 10 U.S. Patents issued.

Author and Co-author on over 40 Technical papers published in assorted Scientific Journals.

Trainer and Supervisor of the development technicians in the Films department.

Kennametal, Greensburg, Pa. 1979-1984

Cutting and machining tools

Senior Process Technician,

Senior Process Technician in the Advanced Coatings and Ceramics laboratory, overseeing design and construction of LPCVD furnaces, piping, electronics, vacuum system design, welding, and assembly for research use.

Designed, built and processed material on the first of a kind Pulsed Chemical Vapor Deposition system in the company. Evaluation for transfer to full scale manufacturing was underway.

Developed coating processes using groups IVB, VB and VIB metals reacted with Carbon, Boron, Nitrogen and/or Oxygen deposited on metal and ceramic substrates. These were tested for performance and selected successful processes were transferred to the companied manufacturing site.

EDUCATION / TRAINING

Majoring in Materials Science

University of Pittsburgh, Pittsburgh, PA

Associates in Applied Science, Chemistry

Community College of Allegheny County, West Mifflin, PA

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