Robert M. Fritzsche

** ******** ***** ****

Attleboro Falls, MA 02763

508-***-****

xpgps4@r.postjobfree.com

Summary

Results-driven engineer with over 25 years experience in leading cross-functional teams in many roles ranging from direct manufacturing support to strategic and logistic project management. Led several projects related to global strategy for best cost production and best cost sourcing including logistics of equipment moves and technology transfer to the operational sites, training technical staff and working with purchasing and quality control to select and develop local suppliers. Traveled extensively to Mexico, Europe and Asia and worked with diverse cultures. Have significant experience with customers on new product launches.

• Experienced in world-class manufacturing of products for industrial, electronic, automotive and military applications in ISO and QS environment

• Skilled in Program Management and Best Cost production & sourcing

• Trained in QC and problem-solving skills including Design of Experiments, Taguchi and Juran

• Experienced with FMEA, Six-Sigma (certified Yellow-belt), Lean Manufacturing, SPC, GR&R,PPAP and other quality tools

• Successful project manager meeting cost and quality goals on time and within budget

• Expertise in materials, machining, stamping, and high-speed assembly operations

Professional Experience

Texas Instruments / Sensata Technologies Attleboro, Massachusetts

Process Engineering Manager Sensor Products August 2001-January 2009

Responsible for Global Pressure disc and Thermal disc manufacturing processes and device assembly technologies for internal and external operations. Led multiple projects for line moves and technology transfer to achieve best cost objectives.

• Managed move of disc operations from U.S. sites to Best Cost Producer sites in Mexico and China resulting in direct savings of over $500K per year and enabling additional yearly savings of more than $4Million .

• Conducted training of 5 engineers, 6 technicians and 6 operators and provided launch support.

• Conducted qualification tests and met customer requirements for approval.

• Developed new disc processes for new products resulting in over $8 Million annual revenue

• Authored Core Technology Manual and conducted training of key technical personnel to support global line moves to Best Cost Producer sites in Mexico and China

Texas Instruments / Sensata Technologies Attleboro, Massachusetts

Process and Product Engineering Manager – Lead Frames 1991- 2001

Responsible for technical project leadership related to key manufacturing technologies; served as Material Applications expert for Lead Frames for the Semiconductor Group as a member of the SC Materials QIT; supervised cross-functional team to manage product handling and packaging.

• Developed a stress relief annealing process and managed program to establish production capability for Fine-pitch lead frames enabling the realization of $12 Million annual revenue.

• Led TI Semiconductor IC packaging base metal selection and sourcing to save over $500K annually and achieve worldwide leadership in cost and performance.

• Investigated state-of-the-art technologies to optimize TI’s capability to produce fine-pitch etched lead frames at world class specifications for lead width and space. Technology improvements led to a 10% improvement in lead pitch capability and contributed to a 2.6% yield improvement in overall process yields.

• Coordinated Packaging Deployment Team to improve Customer Satisfaction for product handling and storage; reduced customer incidents from 8 per quarter to less than 2 in first 12 months while initiating over $80K annualized cost savings.

• Led People &Asset Effectiveness strategy for the department. Recruited and trained team leaders and team members and established recognition program. Grew participation from 16 to over 70.

Robert M. Fritzsche

Texas Instruments / Sensata Technologies Attleboro, Massachusetts

Engineering Manager – Stamping and Cut Operations 1981 - 1991

Responsible for managing a technical group of 8-12 engineers and technicians in support of the high-speed stamping of lead frames and the mechanized cut-to-length finishing operations. Acted as Capital Manager for the department for annual budgets of $2-5 Million.

• Supervised the growth of the stamping operation from 12 presses to 20 while upgrading technical capability from 400 to over 600 Strokes/Min.

• Managed transition from cut-only to cut and downset in finishing operations to achieve a 4% yield improvement and improve profitability through the reduction of damage.

• Led material and tooling sourcing strategies based upon supplier technical capabilities, cost of ownership and delivery performance to support 300% growth of increasingly complex products.

Sr. Engineer/Engineering Supervisor – Precision engineered parts and materials 1973-1991

• Conducted various programs to improve yield, quality and productivity for clad materials and components for electronic, jewelry and industrial products.

Education

MBA, Management – Bryant University

BS, Metallurgy – Case Institute of Technology

Other

Disclosures and patents:

Holder of 3 patents and co-inventor of 6 additional patents.

Affiliations:

Member, ASM International; Voting Member, Material Sub-committee of the Packaging Committee of SEMI.

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