project engineer, electronics engineer, quality engineer
Resume:
BIBO CHEN
**** ****** **, ***** ****, Texas *****
*********@*****.***
Employment Objective:
Seek an engineer position related to project management, produce design/test development, or product quality assurance/improvement, where I can utilize my extensive product development and quality improvement experience, and my leadership and analytical skills to develop new products, improve quality, and reduce costs and lead times.
Qualifications:
• Mentoring and coaching engineers to achieve success with measurable goals and accountabilities.
• Leading across boundaries and influence with others to realize project and team success.
• Strategic project planning and execution of timely deliveries and budget cost control.
• Software development and hardware design expertise including testing, electrical and physical failure analysis, and product reliability qualification.
• Cost reduction and quality improvement through statistical data analysis and production flow optimization.
Special Skills:
• Software: SAS, Excel Pivotal Table, Spotfire, MS Project, MS Office, , Business Objects, Assembly, Pascal, C/C++, Perl, UNIX, SharePoints
• Hardware: Oscilloscope, Logic Analyze, Automatic Test Equipment (ATE), PCB, Burn-in.
• Embedded processors (DSP/MCU/ARM) & Peripherals, Flash Memory, JTAG, USB, CAN, SPI, ADC/DAC, OSC, PLL, DFTM.
• SSBBP, QSM, SPC, Pareto Chart, DOE, FMEA, DNV TS16949/ISO9001, 8D Process, 3x5WHY, Ishikawa/Fishbone, GRR, 5S.
• Fluent in English and Chinese Mandarin, both writing and speaking.
Patents and Technical Papers:
• U.S. Patent #6,865,694 “CPU-based system and method for testing embedded memory”
• Presented “OMAP Multi-site Test Strategy” at TI Test Symposium (2004)
• Presented “TMS320C5x SRAM Testing and Repair” at TI Test Symposium (2002)
Honors and Awards:
• Outstanding ASP Customer Satisfaction Award (2005)
• Outstanding Asian-American Employee Award, Organization of Chinese Americans (2005)
• Elected into TI’s elite tech ladder Member Group of Technical Staff (2000)
Professional Development:
•Six Sigma Black Belt Professional Certification (MSI)
•Texas Engineer-In-Training (EIT, Serial No: 21516)
•Program/Project Management Development Training (PDI)
•Competent Toastmaster (CTM), TI Talker Club President (2003)
Education:
University of Houston, Bachelor of Electrical Engineering, 1995 (Honors Graduate)
Experience:
2007-2012 Texas Instruments, Houston, Texas
Manager, Micro-controller (MCU) Automotive Product Quality Engineering
• Managed several engineers and technicians in support of customer failures returns related to automotive safety-critical systems (anti-lock breaks & airbags) from major customers such as Bosch, Continental, TRW, Delphi, and Visteon. Responsible for 30+ embedded Flash MCU products worth hundreds of millions dollars in revenues. Tracked progress (DPPM, Cycle Time and WIP) through periodically material review board (MRB) meetings.
• Successfully lowed DPPM (defective parts per million) level from 100s to 0.5 within 4 years, resulting in significant new business from customers.
• Analyzed failure signatures to identify the root cause of problems, recommended corrective actions, and developed and implemented preventive solutions.
• Incorporated lessons learned through updating test specification and FMEA (failure mode and effective analysis) database to prevent future product failure occurance.
• Extensive usage of statistical analysis softwares to analyze product characterization and manufacture measurement/test data, as well as 8D process, 3x5WHY and Ishikawa tools.
• Championed DNV TS16949/ISO9001 audit for the engineering department. Passed every annual TS audit with zero finding.
2001-2007 Texas Instruments, Houston, Texas
Team Lead, Digital Signal Processor (DSP) Product Development Engineering
• Led product engineers in test program development and hardware designs to test several high volumes DSP products.
• Responsible for design-for-test/manufacture (DFTM) definition, prototype debugging, device characterizing, reliability testing, device qualification, data sheet specification, failure analysis, yield improvement and cost reductions.
• Developed test codes and designed PCB boards to do thermal, mechanical, and electrical stress tests such as high temperature operation life stress test (HTOL or Burn In Test), high temperature humidity biased 85c/85%(THB), high/low temperature cycle (T/C), high temperature bake (HB), PCB board level reliability (BLR), etc.
• Extensive usage of statistical process control (SPC) such as 3 segma and outlier to improve the manufacture yield and reduce cost, as well as improving quality and reduce relibality risks.
• Defined many of design-for-test/manufacture (DFTM) specification for reliablity tests across the DSP engineering organizations.
• Led various engineering teams in the definition and development of memory testing and memory repair test standards, saving development cost and improving test efficiencies.
1995-2001 Texas Instruments, Houston, Texas
Hard Disk Driver (HDD) Product Development Engineering
• Developed software and designed hardware to test servo micro-controllers (MCU) for major HDD customers, including Seagate and Western Digital.
• Responsible for prototype debugging, device characterizing, reliability testing under thermal mechanical stress conditions, device qualification, data sheet specification, failure analysis, yield improvement and cost reductions.
• Over $1,000,000 saved by improving test yield and reducing test time on several products.
• Awarded a patent on memory testing. The test method reduced the memory test time significantly, saving millions of dollars for the company.
• Elected into company’s elite Tech Ladder - Member Group of Technical Staff in 2000.
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