Post Job Free
Sign in

Product/Project or Design Development Manager- Ectronics/Manufacturing

Location:
Aurora, IL, 60502
Salary:
120000
Posted:
January 21, 2011

Contact this candidate

Resume:

IGOR POLNYI

*** ********* *****, ******, ******** 60502

630-***-****

****.******@*****.***

QUALIFICATIONS PROFILE

Well-versed professional with remarkable product design and development expertise honed by more than 19 years of experience within the electric / electronics manufacturing industry. Show paramount efforts in managing all facets of product life cycle development, from initial analysis and conceptual design through enhancement and commercialization. Possess stellar qualifications in creating effective business plans to increase revenue, promote favorable company image, and simultaneously reducing cost. Demonstrate innate ability in delivering high-impact presentations and addressing needs of diverse clients to present innovative business solutions. Detail-oriented with proven effectiveness in a competitive and fast-faced environment. Multilingual in Ukrainian, Russian, and English.

CORE COMPETENCIES

- Competitive Market Research and Analysis

- Conceptual Product Innovation

- Outstanding Customer Service and Relations

- Extensive Product Knowledge and Introduction

- Budget Implementation and Cost Control

- Continuous Process and Performance Improvement

- Customer Needs Assessment

- Superior Presentation and Interpersonal Skills

- Problem Resolution and Decision Making

- Articulate Oral and Written Communication

EMPLOYMENT HISTORY

DESIGN MANAGER ~ FOXCONN TECHNOLOGY GROUP, CHICAGO, IL 2003–PRESENT

Develop various design strategies to meet customers’ future plans by vigorously attending customers forecast and roadmap meetings. Take part in reviewing and verifying design specifications and requirements for new or modified products. Analyze projects materials to support development progress based on additional requirements stated by customers during project development. Oversee milestones on a progress, including test results data provided by the Supporting Groups from Asia. Regularly interface with the Engineering, Tooling, Quality, and Manufacturing departments to eliminate potential issues involving quality and schedules for the engineering samples and production orders. Work closely with the global R&D Department regarding the strategic developments in the Sockets and Connector Division for the $4B business unit. Solidify long-term customer relationships by developing competitive reliable products in a timely manner.

Notable Contributions:

- Eliminated additional tooling cost by 20% and expedited development time by 20% through standardization of numerous components for different products

- Significantly reduced cost by 50% and received an higher percentage award versus competitors by recommending an alternative design

- Successfully developed 23 patents (additional 5 pending) issued in the United States, China, Taiwan, and Japan to facilitate product cost reduction and lead to bigger revenues in comparison to competition

- Extensively traveled to collaborate with and mentor other departments on new concepts and design

- Initiated the development of more than 30 products, including CPU sockets for mobile, desktop, and high-end servers for Intel, IBM, and AMD

SENIOR DEVELOPMENT ENGINEER ~ CINCH CONNECTORS, LOMBARD, IL 2000–2002

Assumed full responsibility in examining molding principles for socket housings based on product height differences and material properties in conjunction with molding processing and mold presses specifics. Contributed in proposing the interstitial pitch principle to lessen product pitch based on existing contact design. Created an artificial contact wiping mechanism in assembled CPU unit for low profile sockets and low force contacts. Designed a concept for existing contact area protection during shipment and product placement.

Notable Contributions:

- Minimized insertion depth to improve assembly speed and true position reliability by 30% through the creation of a processing verification for CMT socket type, with implementation of the gang load principle

- Cut down assembly time by 20% through the development of concept for electro-optical transceiver based on insert molding principle

- Significantly improved retention by 50% through several innovative principles for contact retention in a plastic housing

- Elevated yield rate to 97.5% by designing a new concept for rework principle

SENIOR DEVELOPMENT ENGINEER CONSULTANT ~ INTERPLEX INDUSTRIES, FLUSHING, NY 1999–2000

Performed comprehensive research on new development principles for substrate and connector attachments. Masterfully led the new solder principle development based on gang loading principles and multi-cavity housing geometries.

Notable Contribution:

- Played a vital role in the continuous modification and improvement for solder and flux bearing leads for different applications and pins pitch layout.

PRIOR WORK EXPERIENCE

DEVELOPMENT ENGINEER ~ AMP Incorporated, Harrisburg, PA: 1994–1999

SENIOR DESIGNER ~ Bink and Associates, Camp Hill, PA: 1991–1994

EDUCATION

BACHELOR OF SCIENCE IN MECHANICAL ENGINEERING (BSME)

State Lviv Polytechnic Academy, Lviv, Ukraine

U.S. Academic Equivalency Certificate # 91139-AC

PROFESSIONAL TRAINING

CADKEY, Pro/E, SolidWorks: In Process

Certificate of Accomplishment from Precision Metalforming Association (PMA)

Certificate of Accomplishment in Machining Skills

Pennsylvania State University- EIT (Engineer-in-Training)

PROFESSIONAL AFFILIATION

Member, Professional Engineering Society of Ukraine

TECHNICAL PROFICIENCY

Microsoft Office Suite (Word and Excel), CADKEY, Pro/E, and SolidWorks



Contact this candidate