Engineer Customer Service
Resume:
Kevin Paul Hiller
Home Phone: 626-***-****
Cell Phone: 626-***-****
Monrovia CA 91016
Email: **********@*****.***
SKYPE: kevinpaulhiller
US Citizen, current active Secret Security Clearance
OBJECTIVE: MEMS Test Engineering
SUMMARY:
Test Engineering Management - 8+ years
Test Engineering experience in a high technology industry - 20+ years
Prior management role in semiconductor test engineering - Two terms as Test Engineering Manager and one term as Sr. Director of MEMS Test Engineering.
Direct experience of MEMS device testing and fabrication processes.
Highly experience in procuring and qualifying / characterizing final test hardware for high volume manufacturing and subsequent transfer to off-shore facilities.
Previous experience with and understanding of:
Circuit design - 15 years of circuit design understanding and debugging.
Engineering - 20 years in engineering roles, semiconductors and MEMS technology.
Analog circuits - 10 years of expertise in understanding and debugging analog devices.
Mixed signal circuits - 15 years of hands on mixed signal testing and hardware design.
Digital circuits - 15 + years as an expert in digital circuits both understanding and testing.
Semiconductor ATE platforms - 18 years of expertise on a wide range of VLSI test platforms.
Software coding - 15 years of test scripting, C, C++, Lab View (NI), Python.
Other Technical Skills - I am an expert in designing complete test solutions from wafer level test platforms to final test hardware for high volume production. I am also an expert in debugging new product offerings to help the designers fix any flaws. Management skills are excellent as I have managed groups of engineers and technicians to bring new product on line in a timely manner. I excel in failure analysis and reliability standards also. A well-rounded engineer with the most recent MEMS technology under my belt pertaining to test systems, test coding and hardware development.
PROFILE:
NPI MEMS Test Engineering management.
ATE (automated test equipment) design and implementation for MEMS sensors, digital circuits, RF and Thin Film passive components.
MEMS product transfer to offsite / shore expertise.
Budgetary, scheduling, supply chain, logistic, and program management.
VLSI Tester expertise, Teradyne J-950, J-971 and UltraFLEX.
Multitest handler and MEMS flip table expertise.
SPEA handler and robotic MEMS flip table expertise.
VLSI test platform program development. C++, Lab View, MS Visual Basic and Python scripting.
Organic laminate (PTFE, DriClad, Thermount) package design and circuit analysis.
Proficient in SPC analysis.
ITAR and Export control procedures and classifications.
Management Background:
Supervised and managed groups of Engineers, Technicians and Production operators in the semiconductor arena. Responsible for NPI (New Product Introduction) and release of various custom packaged and laminate solutions for Medical, Military and OEM high end modules, MEMS microphones, accelerometer, gyros, Microcontrollers, MCM Automotive devices, Thin Film passive component devices and high speed InfiniBand technology data communication IC's.
PROFESSIONAL EXPERIENCE:
Sensor Dynamics / Maxim Lebring, Austria (MEMS Sensor Accelerometer & Gyros)
1-2011 to 9-2012
Senior MEMS Sensor Test Engineer (Slated for Manager prior to acquisition by Maxim)
Sensor Dynamics has been recently merged with Maxim on July 18th 2011.
Responsibilities:
Daily production monitoring of MEMS product offerings with emphasis on production throughput and yield.
Test program development on new product offerings that include developing the most robust test coverage allowed along with streamlining the test time to its lowest level without compromising fault coverage.
Multitest handler and flip table upgrading for performance enhancement.
SPEA handler and flip table bring-up and qualification. Recently acquired this new handling system in June 2011.
New test equipment design for the next generation of MEMS sensor solutions to include pressure and RF devices.
Failure analysis studies determining root cause and implementing containment strategies while designing a new protocol to be implemented.
Documentation preparation and implementation to meet ISO / QS9000 standards.
Performing MSA (measurement-system-analysis) on new and existing product offerings.
Training / sharing engineering expertise to fellow engineers and technicians.
Accomplishments:
Upgraded Multitest Flip table with new DUT fixtures and flex cables to enhance performance and reduce down time.
Performed FPGA board failure analysis, reported findings to SD engineering and made suggestions for improvement.
Root cause failure analysis on Multitest flip table flex cables. Reported findings to SD and Multitest for engineering action to be taken to develop a more robust flex cable interconnect.
Endicott Interconnect Technology, Endicott, NY
9-2008 to 1-2011
Senior MEMS NPI Test Engineer (Group Leader)
Transferred into a new business unit within EIT. Responsible for the acquisition, installation, training and program development for the Teradyne UltraFLEX VLSI test platform. Devices tested included
MEMS sensor, IR, Acoustic, Accelerometer, Gyro, Pressure and Microprocessors.
Supervise / manage an engineering and technician team in MEMS NPI (New-Product-Introduction) and release into final production.
Design / develop new custom test hardware for a variety of MEMS sensors.
Utilize existing ATE test platforms, Teradyne and HP along with KLA and EG Probers for MEMS test.
Develop MEMS test programs and hardware interface protocols.
Total project management responsibilities for scheduling and product deliveries.
Endicott Interconnect Technology, Endicott, NY
7-2006 to 9-2008
Senior Product-Test Applications Engineer ( MEMS Sensors)
Design and Manufacturing organization developing high end PTFE / DriClad laminate package solutions for MEMS sensors, DSP, analog, mixed-signal and RF applications.
Assist customers developing the next generation of package solutions that reduce the overall fit / form factor by as much as 75% while increasing the overall electrical performance, i.e., SNR (signal-to-noise-ratio), cross talk and greatly improved (diff pair) impedance matching. Travel to customer sites working with design, electrical and mechanical engineers developing the best approach to meet the end deliverable in a timely manner along with a DFM (design-for-manufacturing) process ensuring high yields and a robust product offering.
Akustica, Inc., Pittsburgh, PA (MEMS Acoustic Microphones)
7-2004 to 6-2006
Senior MEMS Test-Product Engineering Director
Startup Design and Manufacturing organization developing and manufacturing Acoustic MEMS microphones utilized in various environments, i.e., cell phones, PC’s and hearing aids.
Supervise / manage an engineering and technician team in NPI (New-Product-Introduction) and release into final production.
Developing and implementation of Product Test plans and Production Strategies for acoustic MEMS product offering. Coordinate the introduction of test equipment and hardware associated with the acoustic MEMS product application. Supervise an engineering staff and technicians responsible for the day to day test and manufacturing processes.
Highlight: Designed and implemented the first ever acoustic electrical test prober system (wafer level) in the industry along with an automated final test robotic production handler.
AVX-US, Myrtle Beach, SC (Semiconductor Passive Wafer Level Components)
7-2002 to 4-2004
Test Engineering Manager (Manufacturing)
Startup Design and Manufacturing organization developing Thin Film passive components, (Resistor Networks, Capacitors, RC, RLC and Filters) utilized on current and new high speed PCB / PWB designs throughout the electronics industry.
Supervise / manage an engineering and technician team in NPI (New-Product-Introduction) and release into final production.
Development and implementation of Product Development plans and Production Test Strategies for the Thin Film product offering. Coordinate the introduction of test equipment and hardware associated with the Thin Film product application. Work with and manage equipment vendors, (Ismeca, Exatron Hover-Davis, Laseral) for the successful capital equipment installation and start up with in the FAB. Supervise technicians and equipment operators responsible for the day to day manufacturing processes. Write ISO and QS9000 documentation to achieve qualification status.
Highlight: Designed and implemented a wafer probe test for thin film passive component wafer die test along with a robotic test handler to perform final test in production.
Banderacom, Inc. Austin, Texas (Start-Up Company, SERDES Devices)
8-1998 to 6-2002
Test Engineering Manager
Start-Up Design organization developing / designing an ultra-high speed (2.5GHz) data transfer custom ASIC SOC (System On Chip) utilizing InfiniBand technology.
Supervise / manage an engineering and technician team in NPI (New-Product-Introduction) and release into final production.
Developing production plans and methodologies for InfiniBand technology. Cross functional team work with Logic Designers (LSI Logic) for IP ASIC implementation. Integrate custom ASIC modules for final test coverage compatibility. Review IP data sheets and coordinate compatibility issues with IP vendors. Implement a RCS (Release Control System) for custom ASIC test program software. Organize and manage COT (Customer Own Tooling) vendor relationships. Wafer FAB (TSMC) process monitoring (.18-micron technology) and qualification review. Qualify and implement Teradyne Catalyst VLSI platforms for production final test. Package selection (HSBGA) and vendor (ASE) interaction for product incorporation. Probe and Final test hardware schematic generation. Coordinate hardware build and verification with vendor (Teradyne). Perform SQE (Supplier Quality Engineering) for Vendor qualification.
Motorola Semiconductor, Austin, Texas
6-1990 to 7-1998
Senior Product-Test Engineer (32 Bit-Microcontrollers)
A self-contained R&D / Product Development facility of 32bit Microcontrollers and MCM (Multi-Chip-Module) automotive devices.
Supervise / manage an engineering and technician team in NPI (New-Product-Introduction) and release into final production. Cross functional teamwork for custom ASIC implementation. Characterization and qualification report generation for customer circulation. Capture and document entire product process and development criteria. Wafer FAB process monitoring (.35 & .25 micron technology) and qualification. NPI (New Product Introduction) team leader on the Z3 Multiple Chip
Module. Test program development utilizing C++ / UNIX operating systems. Probe Card and Final Test hardware design and development. J971 / J953 / A580 Mixed Signal VLSI tester training. Supervise Engineers and Technicians in the Microcontroller development, qualification and product transfer.
Delta Design Inc. San Diego, CA
1-1988 to 5-1990
Senior Field Service Engineer (Robotic Pick & Place Handlers)
Delta Design is manufacture of Robotic equipment incorporated in the Semiconductor industry. End users included Intel, HP, IBM, Conexant, Motorola and a variety of third party assembly / test facilities.
Customer service and product installation on the Delta Flex robotic handlers. Perform training seminars. Equipment retrofitting and upgrading on customers sites throughout the US and abroad.
Beckman Instruments, Palo Alto, CA
6-1982 to 1-1988
Senior Field Service Engineer
Beckman Instruments is a manufacture of high end biomedical research equipment utilized in Hospital, College, and Research facilities. Customer service and product installation on Robotic Medical Laboratory equipment. Present training seminars throughout the US.
K-P Vending Company, Wilkes-Barre, PA
11-1974 to 4-1982
Owner / Operator
Owner, vending company that included video arcade games and vending machines.
Education
AS / ET Electronics Technology GPA-3.6
United States Navy (Submariner FTG-2 SS) 8-1971 to 10-1974 Computer Engineering, AS Certificate, GPA-3.9
Motorola Inc. Engineering Review Program (ERB), Motorola University, BSEE Semiconductor Design / Process Technology 1997, GPA 3.8
Contact this candidate