Vernon M. Toussaint
***** ******* ** *** **** • Dallas, TX 75252 • 978-***-**** • ***********@*****.***
QUALIFICATION SUMMARY
• M.Sc. in Information Systems & B.Sc. in Electrical Engineering.
• Strong and extensive background in IC products electrical testing, analysis, product management, quality monitoring strategies and yield improvement.
• Excels at collaborating across departments; coordinating with staff and senior managers to complete projects on time and within budget.
• Strong manufacturing production background & proficiency with laboratory test and measurement tools.
• Excellent quantitative, analytical and writing skills.
TECHNICAL SKILLS
• Application Programming: C/C++, SQL, PL/SQL, Java, BASIC, UML, Pascal.
• Applications: dPower, JMP, MS Office, MS Project, Visual Studio.
• Concepts: Object-Oriented Programming, Database Design/Normalization, Writing UML, Design of Experiments, SPC (Six Sigma, Cpk), Project Management.
• Professional Strengths: Project Management, Electrical Testing/Analysis, Product Characterization, Cross-Functional Collaboration, Process Improvement, Cost Reduction.
PROFESSIONAL EXPERIENCE
Jan 2007 Staff Product Engineer
- Present Intersil Corporation, – Richardson, TX
• Project manager providing leadership and management of multiple IC development projects through the life cycle phases: from design through post production support.
• Supporting cost reduction, yield improvement and customer return activities.
• Deriving production test limits using statistical methods and ensuring that products comply with data sheet electrical and reliability specifications.
• Performing product characterization using tester, bench and thermo stream as well as reviewing results with core development team.
• Cross-functional coordinating/collaborating with a team of engineers from design, marketing, applications, product and test to achieve critical project milestones, customer samples and timely product release.
• Generating and presenting project schedules, development costs and Finished Goods costs as part of Business Plan review.
• Ordering masks and wafers from external foundries and planning assembly builds of packaged parts for product qualification and production release.
• Responsible for pre-silicon planning, executing customer samples delivery and driving manufacturing readiness.
• Developing, organizing and presenting program metrics to management during Quarterly Reviews.
• Conducting project post mortems with management to identify continuous improvement opportunities by examining successful and unsuccessful project elements.
• Facilitating recurring team meetings with emphasis on tracking and closing open actions to achieve project milestones.
Nov 2001 Chute Yield Enhancement Engineer
- Jan 2007 Analog Devices, Inc., – Wilmington, MA
• Drove trim/probe and final test yield enhancement and cost reduction activities of integrated amplifier products.
• Worked as a member of New Product Release Team to ensure the successful test development, characterization and release to production of high speed amplifiers.
• Developed plans for process change and led engineering evaluation studies for fabrication transfer of Bipolar and HVBP processes from Sunnyvale to Wilmington within the aggressive 6 months schedule.
• Formulated concise trim/probe and final test yield analysis for 4” to 6” wafer fabrication transfer and polyimide fabrication process change.
• Chaired ADWIL Trim Material Review Board, updated/distributed meeting minutes and, along with other members, decided disposition of discrepant material.
• Active participant in recruiting new college graduates from my alma mater, UCF, to the company.
• Mentored new engineers and supervised interns.
Jun 1997 Manufacturing Product Engineer
- Nov 2001 Analog Devices, Inc., – Wilmington, MA
• Worked closely with local and off-shore new product teams to support silicon debug, product characterization, product validation and manufacturing release of integrated amplifier product.
• Implemented targeted product engineering projects for improving final test yield.
• Developed yield evaluation plans to compare automatic test equipment (ATE) results to bench test performance.
• Optimized final test flows for increased quality and cost improvement;
• Worked closely with external and internal test sites to ensure smooth high volume production.
• Supervised interns and technician.
EDUCATION
Sept 2003 M.Sc Information Systems GPA: 3.6/4.
- May 2006 Northeastern University, Boston, MA
Jun 1995 B.Sc Electrical Engineering GPA: 3.2/4.
- May 1997 University of Central Florida, Orlando, FL
Aug 1989 A.Sc Quality Control and Reliability Control GPA: 4.0/4.
- Aug. 1991 Central Florida Community College, Ocala, FL
HONORS
Dean’s List (Spring 96, Fall 96, Spring 97):
University of Central Florida
President’s List (all semester 1989 –91), Valedictorian:
Central Florida Community College
Professional Award:
Multiple recent incentive awards for dedication and project execution.
AFFILIATIONS
Phi Theta Kappa Honor Society
Institute of Electrical and Electronic Engineers (IEEE).