ELectro-Mechanical Packaging Engineer
Resume:
Donald L. Lester
***********@*****.***
http://www.linkedin.com/in/donlester09
Career Summary
Experienced professional with a successful career in research and engineering driving new product introduction, leading edge design and processing. Demonstrated wide-ranging expertise and a talent to learn and apply new technology; Strong problem solving skills; Ability to work effectively in a team, use collective ideas to formulate the best solutions and deliver product excellence in a diverse technical environment. My career is built on customer focus, a drive for results, technical skills, interpersonal savvy, commitment to continuous improvement, and effective teamwork. I desire a position with a growth company where I can stretch my expertise and make a positive impact on any challenge presented.
Qualifying Experience
1996-2009 Specialist Electronic Assembly, GE Global Research, Niskayuna, NY
Staff Technical Lead of a dynamic and diverse electronic assembly work center in the Micro and Nano Systems Technology Laboratory
Interfaced daily with customers, internal and external, on status of more than 20 concurrent research projects including reporting and work-flow control
Specified and qualified more than $500,000 in capital equipment over a 3 year period to meet an annual increased need for process capability
Implemented and supported a 6 month special qualification of fabrication area for space flight assemblies including process documentation revision, new procedures, inventory control and cradle to grave parts tracking
Executed Environmental Health and Safety policies and procedures for 4800 square foot laboratory area operating 2 shifts with high voltage, compressed gases, flammable solvents, high temperature and high-speed robotic automatic equipment
Invented methods and processes – Two US patents 7,130,510 and 6,737,002 as well as several filings and disclosures
Solved difficult materials and assembly problems using 6-Sigma methodology to increase process yield as much 90%; Greenbelt Certified
Drove new optical interconnect product through innovative first assemblies on to deliver 40,000 customer qualified modules
Donald L. Lester, Resume Page2
Qualifying Experience (continued)
1987-1996 Technician-Process/Materials, GE Global Research, Niskayuna, NY
Research Technician contributing to major research projects and prototype production. Conceptualized and built special assemblies. Fabricated prototype multi-chip modules as a key technician in process operations. Technical expertise in die attach, wire bond, solder reflow, fluid dispense, materials testing and selection, microscopy, measurement and process development were of pivotal importance to military, aerospace and communications customers
1984-1987 Engineering Technician, Intel Corp., Assembly Test, Chandler, AZ
Technician working in advanced plastic package assembly, design and product transfer to production. Performed wire bond, die attach, adhesive stenciling, trim and form, transfer molding, wafer dicing, microscopy and auto measurement. Designed advanced plastic packaging for microprocessors and memory devices. Key technician executing failure analysis evaluating field-failed devices with nondestructive and destructive techniques; optical, x-ray, decapsulization and metallographic crossectioning
Education
Associates Degree in Applied Science - Mechanical Engineering Technology; Hudson Valley Community College, Troy, NY
Additional Qualifications
AutoCad 2009 Proficiency
Microsoft Office Proficiency
Solid Works - in training
XML - Working Knowledge of programming
Lab View familiarity
Donald L. Lester ***********@*****.***
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