Engineer Project

Curriculum Vitae

Manish Verma E-mail: *************@*****.***

Personal Details:

Date of Birth : 04 February 1976

Citizenship : Irish (European Union)

Address : ** ******** ******, ********, ****ty Galway, Ireland

Phone : +353-**-******* (Mobile)

Educational Qualification:

 B.E.(Hons.) -Mechanical Engineering

 Six sigma Green belt from ASQ (American Society for Quality)

Career Synopsis:

A qualified engineer in Mechanical Engineering with over 15 years of rich experience in four different multinational Manufacturing companies. Currently working with Boston Scientific Inc Ireland as Sr. Manufacturing Engineer and has previously worked in Celestica Corp Ireland as Sr. Engineer, Intel Ireland as Process Engineer and in Usha Martin Industries Ltd India as Project Engineer.

An energetic, resourceful and highly dynamic Senior Engineer with excellent organizational, technical and management skills and extensive.

A proactive leader with a passion to deliver and extensive managerial and technical skill and the natural ability to identify and capitalize company benefits by maximizing production and quality of product.

An innovative, loyal and results oriented professional with strong communication and interpersonal skills and proven ability to surpass targets within deadline regardless of pressure.

Field of Expertise:

• Plant automation: Expertise in automated machine and database validation. This includes defining requirements (URS) and protocol tests ( IQ, OQ and PQ) for new automated system to develop an automated system as per requirement by using world class machine vendors and finally executing protocol test for automated system.

• Diffusion process in Semiconductor industries: Expertise in diffusion technology mainly LPCVD (low pressure chemical vapor diffusion) furnace (Kokusai) and Rapid thermal anneal process (Applied materials) equipments. These equipments used in process layers PAD OX /Nitride deposition, TEOS (Tetra etho oxo silicate) anneal process, Silicide formatation, source drain anneal.

• Data analysis Software’s data analysis software’s like JMP, Mini tab, and other data retrieving software’s like Crystal ball (Oracle base data analysis software), MS SQL queries.

• Sig Sigma: Expertise in using Six sigma statistics process control method for calculating process capability Ppk and Cpk, defining statistic control limits, calculating gauge R&R for variable data results, designing of experiment for product/process/equipment changes. Leading core Engineering team and demonstrating use of Six Sigma approach in resolving process and equipment related issues.

• Productivity improvement: Expertise in using process data information to improve productivity of plant. As an example linking machine local data base to centralized data base and utilizing data information in productivity enhancement, setting up matrix like Mean time to repair (MTTR), Mean time between fail (MTBF) and setting up yield matrix by individual system.

• Microsoft office software’s: Expert in Micro Soft office project management application software’s Project, Excel, word, outlook, Visio, and power point. Expert of using MS excel functions including use of pivot table, External data export system, and use of Visual basic.

Professional Experiences:

1. Boston Scientific Inc. (Boston Scientific Corporation is a developer, manufacturer, and marketer of medical devices that are used in a broad range of interventional medical specialties, including cardiology, cardiac rhythm management, peripheral interventions, electrophysiology, neurovascular intervention, endoscopy, urology, gynecology and neuromodulation)

From/to : Nov’ 08 till date

 Roles and Responsibilities :

My responsibilities include providing engineering support and solutions to Drug eluting stent business. This includes working with product development team and vendor to develop advance metrological solutions for inspecting and measuring stents. Brief summary of my role of work and significant contributions are as below.

 Technical leadership to stent manufacturing line. Responsibility includes process/equipment problem resolution for finished stent inspection machines and metrology machines used in manufacturing line. Implementation and monitoring of performance metrics i.e. Product Yield, Tool throughput Yield, Cycle time reduction, rework reduction, Facilitation of improvement initiatives.

 Work with Product development team to define requirements of new systems (URS), developing Functional Specification by involving vendor, developing Installation qualification, Operation qualification and Process qualification protocols. Finally validating system against IQ, OQ and PQ protocols. Ensuring compliance with safety, environmental and quality statutory and regulatory requirements. Ensuring compliance with internal company policies/procedures

 Presenting validation reports and technical data to internal/external audit bodies including KEMA, TUV & FDA audit bodies.

 Weekly update meeting with Engineering manager and quality manager to review progress of ongoing project and work in progress in manufacturing line. Initiating the team building efforts via Role Clarity, Review and Competence development.

o Achievements and Significant Contributions :

o Led project to develop a new automated system to measure stent critical dimensions and critical defect for high volume manufacturing line. Stent inspection process was manual in high volume stent production line and was identified constrain in line. Project objective was to find automated solutions for stent defect inspection and critical dimension measurement system with lower process cycle time. Project team developed new automated stent inspection system as per requirements. This project got approval from FDA regulatory affairs US and regulatory affairs Japan. Total cost of project was $300k per system and project saved total inspection cost of 250k$/year per system.

♣ Training and seminar attended

♣ CAPA management and corporate standard operating procedure (SOP) to handle CAPA system.

♣ Corp SOP Design Changes.

♣ Process improvement training.

♣ Validation of an automated system.

♣ Corp SOP document and data control

♣ Design FMEA work shop

♣ Risk management

2. Celestica Inc. (Celestica Inc is leading multinational automation manufacturing services (AMS) companies headquarter in Toronto, Canada. With a turnover $ 8.5 billion Celestica operates a global manufacturing network with operations in Asia, Europe and the Americas, providing a broad range of integrated services and solutions to leading OEMs (original equipment manufacturers).

From/to : Oct’ 07 to Nov’08

 Roles and Responsibilities :

I worked as a Senior Engineering for Hewlett Packard inkjet cartridge manufacturing lines. My responsibilities were providing engineering solutions to HP inkjet manufacturing line to optimize utilization of plant and to improving Yield by adopting six sigma process control methodology.

o Achievements and Significant Contributions :

Led Yield improvement project of Hp inkjet cartridge manufacturing lines. Project objective was to achieve Yield target from 98.7% to 99.2% by process improvement. Project team utilized DMAIC methodologies in improving process steps involve in cartridge manufacturing. Project team achieved Yield target within defined time and budget. This yield improvement equates to additional 10,000 Inkjet cartridges per month each line; 2% improvement in tool throughput yield, and reduction of over 200 Man hrs/month for doing rework. Hp manufacturing line achieved defined goal in time and net saving was $450k / year.

3. Intel Ireland Ltd. (Intel is world's largest semiconductor chip maker, supplying advanced technology solutions for the computing & communications industries. With a turnover of $40 billion, Intel’s products include chips, boards & other semiconductor components that are the building blocks integral to computers, servers, & networking & communications products.)

From/to : Jan'2001 to Sep’ 07

 Roles and Responsibilities :

I worked as a Process/Equipment Engineer in Intel Ireland manufacturing site. My responsibilities were including engineering improvements in thin film process area. Brief summary of my role are as below.

 Responsible for providing support to the Development fab to facilitate efficient operation, to optimize existing processes, to ensure that production goals are met and to communicate new process changes to high volume manufacturing Fab. This includes equipment planning, equipment selection and configuration with the area process engineers.

 Interfaces with Quality, Research and Development departments to integrate new products into the existing thin film process module. This includes technology transfer from development fab to high volume fab, installation, start up and volume ramp within diffusion process equipment.

 Responsible for developing process flow charts for new process, designing FMEA, calculating process capability based on product specification requirement and machine capability. Engineering standardization of process i.e. developing process control charts (SPC) for new process with control limits, developing standard tool qualification procedures for new process.

 Executing cost saving and energy saving projects to achieve substantial reduction in O&M expenditures and work within the budget.

 Providing Technical leadership of two different type Manufacturing Tools Rapid Thermal Anneal Tool (Make -Applied materials, qty – 10, cost of tool – 1 Million $ each) and Chemical Vapor Deposition Tool (Make - AVIZA Qty – 2, cost 1.5 million $ each) sets in 200mm flash and logic chip manufacturing technology. Responsibility includes Engineering/equipment problem resolution for Rapid thermal anneal operations.

 Responsible for Planning, forecasting and monitoring annual maintenance budget for RTX Area (Average maintenance budget 200k$/ year excluding manpower) and examine budget compliance. Planning and Monitoring annual maintenance budget of diffusion area which includes equipment consumable and non consumable spare parts, process gases and in line monitor wafers spare used in diffusion area.

 Owner for Line yield & die yield results for RTA diffusion area. Using statistical analysis software, I evaluate the results of each tool to ensure the thickness of uniformity & purity of the processed silicon wafer is within specifications.

 Chairing daily morning pass-down meeting with manufacturing equipment and process technician to review day to day maintenance and process work with in area. Initiating the team building efforts via Role Clarity, APR culture, Review and Competence development

o Achievements and Significant Contributions :

o Technology transfer from development Fab to Ireland Fab. Flash memory chip process developed in Intel development Fab in US site. I worked with process engineers in development fab in transferring technology to high volume manufacturing fab in development implemented new process in Ireland high volume manufacturing fab.

o Cost reduction project for Chemical Vapor Deposition Tool. This was a major project in cost saving. I lead this project & net saving was over 200k $ per year. I developed an onsite tool maintenance plan, thus eliminated the need of onsite vendor support.

o Optimization of preventive maintenance schedules of RTA (Rapid Thermal anneal machine) by using JMP based Statistical analysis tool.. Total net saving was above 120k$ per year.

o Optimization of wafer thickness measurement machine used in both logic and flash products by using Crystal ball (High volume data analysis software). It gave additional 35% tools spare capacity at all times.

♣ Training and seminar attended

♣ Data analysis software training in Intel University: Crystal ball (Oracle data base system), SPC++, SAP (ERP system), WIINGS (Spare parts management UNIX based system).

♣ Management training in Intel University: Time management, Project management, Diversity in work place, Constructive Confrontation, Effective Meetings, Structured Problem Solving.

DATE: (MANISH VERMA)

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