Field service Engineer

Education: BS, Computer Science

Al-ISRA University, Jordan, Amman

U.S.A. equivalence evaluated by Educational Evaluators, INC

Experience:

**/** - **/** ***** Service Engineer, Applied materials, Inc (Intel Corporation) Hillsboro, OR

 Perform a wide variety of electro-mechanical assembly operations on 300 mm semiconductor equipments – FI, Mainframe and EPI chambers- System level alignments, Calibration, Setup.

 Perform preventative and corrective maintenance duties, Including hydraulics, pneumatics, plumbing, bearings and high Vacuum component on EPI 300 mm Platform.

 Performed corrective and preventative maintenance on marathon abatement system.

 Diagnose a root cause issues, and make recommendations.

 Verify operational parameters of system equipment.

 Adjust and repair equipment according to maintenance specifications and repair manuals,

 Develop maintenance procedures and specifications,

 Maintain customer satisfaction through clear, consistent communication.

 Conduct tests on single wafer and modules per statistical process control procedure,

 Perform tests and tasks associated with defect analysis including inspection under a microscope,

 Collect, develop, and analyze yield and test data to improve wafer fabrication performance,

 Perform various repetitive electronic assembly operations,

 Follow safety procedures involving the handling of chemicals such as solvents, acids, and toxic.

05/2002 – 09/04 Technician, Merix Corporation, Forest Grove, OR

 Diagnose and repair circuit Boards.

 Perform a variety of tasks, setup, calibration, and testing on photolithography equipments.

 Setup and maintain equipment within operational parameters.

 Report new technical issues and optimal solutions.

Computer Skills: AutoCAD, Access, Word, Excel, Outlook, and PowerPoint.

Electronic Skills: Detail-oriented, General Electronic Testing Equipment, Use hand tools, torque tools

Electrical gauges, and common equipment for calibration. Interpret Schematic

Blueprint, wiring diagrams, and logical diagrams.

Certifications: Centura ACP 300mm Platform (theory and maintenance).

Inner Layer Print Level A&B

ORACLE Developer/2000 (Forms5 Part A)

ORACLE Developer/2000 (Forms5 Part B)

ORACLE Developer/2000 (Reports3)

Introduction to ORACLE RDDM Ver.8

References will be provided up on Request

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