Six Sigma Black Belt Process Control Engineer

**** ***** ***** **, *******, VA ***** Home: 804-***-****

e-mail: **********@*****.***

http://www.linkedin.com/in/cjgould

PROCESS CONTROL ENGINEER / DATA ANALYST

Fifteen years’ experience in design, development, implementation, optimization, and leadership of large-scale corporate actions to improve capability, quality, productivity, and efficiency, with significant cost savings realized through expertise in:

LEADERSHIP

Project Management

Conflict Resolution

Risk Assessment (FMEA)

Change Control Management

Strategic Partnership

Budget Planning

Technical Roadmap Planning

Coaching & Performance Management

PROFESSIONAL PROFICIENCY

Statistical Methods

(DOE, ANOVA, SPC, MVT, Sampling)

Problem Solving

(8D, Fault Tree, Route Cause Analysis)

Close Loop Control Systems

(SISO, MIMO, FF, FB, FF-FB)

Data Mining & Advanced Analysis

Filtering & Optimization

(EWMA, RMSE)

Six Sigma Process Control

(DMAIC, PDCA)

SOFTWARE

JMP

MATLAB

AutoCAD

MS Project

VISIO

MS WORD

EXCEL

SAS

SQL

Professional Experience

QIMONDA, (FORMERLY INFINEON AND WHITE OAK SEMICONDUCTOR)

Sandston, Virginia  1999- February, 2009

Global DRAM manufacturer for computing, graphics, consumer, mobile computers, and cellular applications, with more than 13,000 employees worldwide

Senior Staff Engineer

Technical Lead - Metrology & Imaging Process Control  1999-February 2009

Capital Equipment Leadership

 Planned, organized and performed capital equipment evaluation for automated Scanning Electron and Optical Microscopy systems.

 Generated Commercial and Technical procurement specifications and influenced global purchasing strategy for production measurement systems.

 Negotiated technical and commercial contracts with capital equipment suppliers offering continuous and joint development commitment to form strategic partnerships and leverage competitive service and equipment pricing.

Data Analysis / Process Control Systems

 Employed automated SQL scripting for data-mining with filtering, normalizing, correlation, statistical analysis and predictive modeling generated through JMP, SAS and Matlab scripts.

 Documented and designed process and system flows, work methods, Corrective and Preventive Action (CAPA), Process Control and Quality Plans with VISIO and MS Word.

 Developed and deployed automated control systems across multiple process areas and manufacturing facilities with significant gains in Process Capability demonstrated through automated tuning of machine variables such as; volume gas flow, step times, exposure energy, image focus, and positioning.

Project Management / Lean – Six Sigma Continuous Improvement

 Lead Six Sigma Black Belt (SSBB) projects employing cross functional teams and Value Steam Mapping techniques to drive Continuous Improvements with benefits realized in equipment and process productivity and capability. Strategic projects minimized process faults and defects though statistical monitoring of machine sensors, process timing and product measurement / inspections.

Major Lean Six-Sigma Project accomplishments

• $6 million annual revenue increase and $1.2 million in capital cost avoidance realized through implementation of Dynamic Sampling.

• $15 million annual revenue increase through reduced scrap and improved product yield upon implementation of Automated FF-FB MIMO control system.

• $2 million annual revenue increase through implementation of model based metrology (Predictive Overlay) and Inter-process thin film / imaging control system to reduce Rework and Scrap.

 Directed and supervised a team of senior and staff engineers, with emphasis on technical development, Performance Management, Key Parameter Improvement (KPI) tracking and continuous improvement reported in both quarterly cost savings and yearly return on investment.

 Developed, trained and mentored technical staff in Work Methods, SPC, CAPA, Lean

Manufacturing and Project Management.

 Leader for Infineon Technologies Process Automation Team, member of manufacturing

cluster Metrology Strategy.

SIEMENS MICROELECTRONICS – Semiconductors

East Fishkill, New York  1996 - 1999

DRAM Development Alliance with IBM and Toshiba

Process Development Engineer

Optical & Scanning Electron Metrology Applications

 Developed Gauge Capable measurement methods for application in high volume manufacturing.

 Delivered detailed technical documentation, reports and specifications as part of a consortium of companies (i.e., IBM Microelectronics, Toshiba & SIEMENS Microelectronics).

 Issued Technical Roadmaps and strategic recommendation regarding metrology methods, apparatus and equipment for manufacturing application.

 Worked closely with equipment vendors, performing negotiation influencing direction and specification adherence.

 Designed and performed Supplier Quality Assessment (SQA), Best-of-Breed evaluation and Validation for manufacturing capital equipment including optical and SEM metrology systems.

CHERRY SEMICONDUCTOR – Semiconductor

East Greenwich, Rhode Island  1994 - 1996

Global manufacturer of Automotive ICs, keyboards, sensors with 14,000 employees worldwide

Equipment Maintenance Technician

Photolithography manufacturing

 Performed preventative and corrective equipment maintenance for lithography processing systems.

 Designed and installed custom exhaust/drain manifold on refurbished SSI 6” wafer coater

systems improving area productivity, process capability and reducing maintenance cost.

Education

Vermont Technical College: AS Mechanical Engineering

CERTIFICATIONS

ASQ CQM – expected exam completion – July, 2009

PMP – expected exam completion – Fall, 2009

Publications / Patents

 US Patent No. 7,358,493, “Method and Apparatus for Automated Beam Optimization in a Scanning Electron Microscope,” Granted April 15, 2008.

 US Patent No. 7,184,853, “Lithography method and System with Correction of Overlay Offset Errors Caused by Wafer Processing,” Granted February 27, 2007.

 US Patent No. 6,727,989, “Enhanced Overlay measurement Marks for Overlay Alignment and Exposure tool Condition Control,” Granted April 27, 2004.

 US Patent No. 6,463,184, “Method and Apparatus for Overlay Measurement,” Granted October 8, 2002.

 Advanced Process Control Applied to Metal Layer Overlay Process, SPIE 2004

 Novel implementations of scatterometry for lithography process control, SPIE 2002

 Advanced Process Control: Benefits For Photolithography Process Control, ASMC 2002

 Gauge control for sub-170-nm DRAM product features, SPIE 2001

 Advanced Process Control: Basic Functionality For Lithography, ASMC 2001

 Deciphering and encoding product overlay: hidden errors, SPIE 2000

 Pattern placement errors: application of in-situ interferometer-determined Zernike coefficients in determining printed image deviations, SPIE 2000

 Results of AEC/APC Deployment at White Oak Semiconductor, AEC/APC symposium XI, 1999

 Overlay Measurement Technique Using Moiré Patterns, 20October 1997

 Enhanced Overlay Measurement Marks for Overlay Alignment and Exposure Tool Control, 15February 1999

 Method for Direct Overlay Measurement of IC Device Features, 23March 1999

 Across Field Overlay Variation (AFOV) Compensation for Semiconductor Devices, 18September 1999

 Comparison of optical, SEM, and AFM overlay measurement; SPIE 1999

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