Failure Analysis Engineer

JOANNA GRACE V. DELA CRUZ

Address: #****F La Consolacion St., Guadalupe Nuevo, Makati City, Philippines

Email: ***********.********@*****.***

Contact Number #: (63-915*******

CAREER AIM:

To pursue a dynamic career in a competitive organization that provides continuous professional growth and personal development.

QUALITIES:

• Knowledgeable in different electrical and physical failure analysis and understanding failure mechanism

• Experienced in IC failure analysis and fault localization techniques such as OBIRCH, LEM, XIVA, LC and Microprobing Analysis

• Handled various hi-end and powerful equipment for fault die isolation techniques

• Five (5) years of experienced as Reliability and FA Analyst and one (1) year as Product/Failure Analysis Engineer in a semiconductor company

• Extensive experience in performing Package Failure Analysis/Construction Analysis on a wide range of semi-conductor parts and products (BGA’s, Laminates, Lead Frames, Hermetic, Flip Chip, etc).

• Knowledgeable in handling analytical equipments (both destructive and non-destructive) such as Scanning Electron Microscope, Scanning Acoustic Tomography, X-ray, Curve Tracer, TDR, Automatic Chemical Decapsulator, Polisher, Laser Decapsulator, etc…

• Computer literate, adequate in using MS Office and other programs.

• Willing to work overtime and in any places. Easy to be with. Flexible. Fast learner and willing to be train. Can work in minimum supervision.

WORK EXPIRIENCES:

Company: Analog Devices Inc. – Gen. Trias Cavite

Gateway Business Park Javalera, Gen. Trias Cavite, Philippines

Position: Product/Failure Analysis Engineer

Department: World Wide Product Analysis

Date: March 2010 to Present

Job Descriptions:

• Performs extensive physical and electrical characterization on the device to verify failure mode

• Work on die level analysis to further investigate the device’s root cause of failure

• Knowledgeable in handling different failure analytical equipments

• Generate Failure Analysis Report that will illustrate and explain cause of failure on the device

• Communicates with the customer regarding their complaint on the parts they submitted to have more information that will help during the failure investigation

Company: AMKOR Technology Philippines – Site 3

#119 North Science Ave. LTAI Sta. Rosa, Laguna, Philippines

Position: Reliability Operation Technician / Construction and Failure Analyst

Station: Reliability and Failure Analysis Laboratory

Date: May 2005 to March 2010

Responsibilities:

As Reliability Operation Analyst: (May 2005 to April 2006)

• Performs Reliability Procedure for different types of packages.

• Performs “Force Convection Reflow” profiling

• Performs “Bias testing”, “leakage testing”, and “4pt bond resistance testing”.

• Performs C-Scanning Acoustic Microscopy on different types of package.

As Construction Analyst: (April 2006 to July 2007)

• Performs “Construction Analysis” on different semiconductor packages (BGA’s, Laminates, Lead Frames, etc).

• Communicates and generates formal Construction Analysis Report based on the gathered data for internal and external package/device monitoring.

• Conduct training of “Package Construction Analysis” to Rel/FA personnel.

As Failure Analyst: (July 2007 to March 2010)

• Performs Failure Analysis in all in-line failures, test failures, and customer returns issues.

• Performs metallurgical procedures on various packages.

• Communicates and generates formal Failure Analysis Report based on the gathered data for both internal and external customers.

• Manage laboratory consumables and chemicals.

MACHINE / EQUIPMENT EXPERTISE:

Scanning Electron Microscopy (SEM) Hitachi/Leo Supra 45

Chemical Decapsulator B&G/Nisene

Laser Decapsulator Sesame 1000

Variable Grinder/Polishing Leco/Ecomet

Real Time X-Ray Fein Focus

Curved Tracer Tektronix

O/S Tester UTI / Exatron / Huntron

Profiler Datapaq

BallShear/WirePull Tester Dage

Reflow (Force Convection) Vitronics

Time Domain Reflectrometry Tektronix

LEM/LSIM Equipment QFI

OBIRCH Phemos 1000

Liquid Crystal Analysis Hypervision

OTHER MACHINE / EQUIPMENT HANDLED:

High Temp Storage Espec

Temp Humidity Chamber Espec/Weiss

Temperature Cycle Espec/Weiss

Thermal Shock Envron

HAST Espec/Hirayama

Pressure Cooker Test Hirayama

Measuring Scope Olympus

Hi/Low Power Scope Hirox/Olympus

Low Speed Saw Buehler/Leco

Scanning Acoustic Tomography Sonoscan/Sonix

MACHINE / EQUIPMENT FAMILIAR WITH:

Fourier Transform Infra-red (FTIR) Nicolet

Focused-Ion Beam (FIB)

EDUCATIONAL ATTAINMENT:

Electronics and Communication Engineering

2006-2009 Technological University of the Philippines Taguig, Metro Manila

Electronics Engineering Technology – DOST SIE Scholarship Awardee

2002-2005 Technological University of the Philippines Ermita, Metro Manila

Secondary

1998-2002 Arellano University – Jose Abad Santos High School Buendia, Pasay City

REFERENCES:

Excellent references are available upon request.

Contact this candidate