Engineering Intern Mechanical Design

Nitish Kumar Singh

https://www.linkedin.com/in/singhknitish909/, 585-***-****, ******@***.***, Rochester, NY Objectives Seeking a May to December 2025 Internship or Co-Op to utilize my academic knowledge. Education Rochester Institute of Technology 05/2026

Master of Science in Manufacturing and Mechanical Systems Integration Minor: Semiconductor Process Integration, Microelectronic Fabrication, Semiconductor Packaging Rajeev Gandhi Proudyogiki Vishwavidyalaya University 06/2016 Bachelor of Engineering in Mechanical Engineering

Skills Design: NX, SolidWorks, Creo

Processes: System Integration, Precision Engineering, Sheet Metal, Machined, Casting, Welding, GD&T Analysis: Ansys, Tolerance Stack-Up Analysis, Structural and Thermal Analysis, DOE, Jmp Pro, Python Engineering: O-Ring Material Selection, Tube and Hose Fitting Selection, Material and Fastener Selection Semiconductor: Plasma Chamber, Optical System, Vacuum, Gas Delivery, Cooling System, Wafer Handling Achievements Applied Materials: Outstanding Performance 2024

Applied Materials: Invention Disclosure Form (IDF) Award 2023 TII Group: Outstanding Performance 2022

Experiences Rochester Institute of Technology: Graduate Research Assistant 09/2024 – Present

• Collaborated with cross-functional teams to define project requirements to initiate the project

• Designed, simulated, tested, and optimized automation processes to enhance precision and reliability.

• Analyzed data from experimental processes to enhance methodologies, leading to increased efficiency. Applied Materials: Lead Engineer (Payroll: HCL Technologies) 09/2022 – 09/2024

• Led the design & development of Semiconductor Equipment in collaboration with Optical, Electrical, Software, and Process engineers, reducing component complexity by 20–30% for cost savings.

• Designed a high-precision Cooling, Optical, Gas Delivery, and Vacuum Chamber system for thermal stability.

• Conducted root cause analysis to enhance semiconductor manufacturing reliability. TII Group: Senior Engineer 02/2021 – 08/2022

River Engineering: Assistant Engineer 09/2019 – 02/2021 SpiceJetTechnic: Design Engineer (Payroll: Miraash Engineering and Technology) 10/2017 – 09/2019 CIPET: CAD/CAM Engineer (Payroll: Orion Security) 08/2016 – 09/2017 Projects Experience Defect Analysis and Contamination Control in Semiconductor Manufacturing Processing

• Conducting Line Edge Roughness defect analysis of the process to assess the impact on device performance. Particle Detection System Design & It’s Integration

• Collaborated with optical engineers to design a particle detection system that reduces components.

• Developed and tested a cooling system to enhance the performance of optical components. Plasma Reactor Design for Advanced Semiconductor Manufacturing Equipment

• Designed & developed a high-throughput vacuum chamber with integrated real-time particle detection and optimized cooling for ALD/CVD processes.

Equipment Troubleshooting/Servicing/Testing for Intel, Samsung, and SK Hynix Fabs

• Conducted inspections, pressure tests, and thermal analyses to detect leaks, then upgraded seals and flow. RIT Club

• American Society of Mechanical Engineering, Baja SAE, Project Management (PMP) 01/2025 - Present

• Leadership Retreat 09/2024 - Present

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