Digital Transformation Supply Chain

Executive Leader in Engineering, Innovation & Digital Transformation

CAREER SUMMARY

Technology and Business Leader with over 30 years of experience specializing in electronics, semiconductor design, and digital transformation across high-tech industries. Proven track record in engineering design, strategic planning, and solution architecture with expertise in scaling global teams, pioneering new methodologies, and delivering measurable business impact in the electronics and semiconductor sectors.

● Technology & Product Innovation: At Apple, supported the development of core engineering design methodologies for Mac, iPad, Apple Watch, AirPods, and emerging hardware platforms. At Huawei and Siemens, drove AI-driven design automation, digital twin strategies, and predictive analytics to optimize next-generation semiconductor and electronic systems.

● Business Growth & Strategic Execution: At Siemens, spearheaded global industry sales strategy for the electronics and semiconductor sectors, driving over 20% annual revenue growth and expanding market presence through strategic partnerships, GTM initiatives, and sales enablement programs.

● People Leadership: Built and scaled high-performing global teams at Apple, Huawei, Siemens, and Cadence, leading cross-functional groups of engineers, sales professionals, and executives and mentoring teams that played pivotal roles in product innovation, software development, and hardware design methodologies.

● Operational Excellence: At Huawei, led the transformation of product design and manufacturing processes, reducing design cycle times by 40% through AI-driven automation, predictive analytics, and digital twin technologies, improving yield, power efficiency, and manufacturability.

● Strategic Partnerships: Orchestrated acquisitions and technology integrations at Apple, ensuring seamless assimilation into Apple’s hardware and software ecosystem and fostering alliances with industry leaders such as NVIDIA, Microsoft, and Intel to drive technological advancements. PROFESSIONAL EXPERIENCE

Siemens Digital Industries Software, San Francisco Bay Area (Aug 2020 - Sep 2024) Vice President, Electronics & Semiconductor Industry Led Siemens’ global semiconductor and electronics strategy, driving digital transformation, AI adoption, and supply chain optimization for enterprise and SMB customers. Spearheaded key go-to-market initiatives, expanding Siemens’ presence in semiconductor design, digital twin, and high-performance computing while achieving 20%+ annual revenue growth and a 40% increase in customer satisfaction.

● Led AI and hyperscale computing initiatives, enabling next-gen semiconductor architectures, cloud-based design solutions, and high-performance computing infrastructure to drive Siemens’ digital transformation.

● Defined Siemens’ industry roadmap for AI-driven chip design, 3DIC packaging, and supply chain optimization, driving strategic investment in semiconductor and electronics software solutions.

● Led strategic alliances with Meta, Microsoft, Apple, Google, and Amazon, positioning Siemens as a key technology partner in their digital transformation and silicon-to-system innovation efforts.

● Championed sustainability and circular economy initiatives, integrating green manufacturing, trusted traceability, and cybersecurity best practices into semiconductor and electronics solutions.

● Directed Siemens’ market expansion in high-growth regions, including India and APAC, aligning sales strategies with local business needs, emerging technology trends, and evolving geopolitical factors. Sondrel Ltd, San Francisco Bay Area (Apr 2020 - Aug 2020) Head of Solution Architecture, North America - Semiconductor Design Consulting and Services ALAN PORTER

San Francisco Bay Area • **********@******.*** • linkedin.com/in/alandporter • 408-***-**** Alan Porter Page 2

Established and led the solution architecture function for Sondrel’s U.S. operations, supporting semiconductor design consulting services. Built technical capabilities, secured key partnerships, and delivered client-centric solutions for SoC, ASIC, and silicon packaging projects.

● Built Sondrel’s U.S. technical operations from the ground up, establishing solution architecture capabilities for SoC, ASIC, and semiconductor design consulting while integrating state-of-the-art sub-nanometer IP solutions from ARM, Cadence, Synopsys, Broadcom, and Rambus.

● Led technical engagements with customers, crafting high-value proposals and SoWs that secured $2M in consulting contracts while managing seamless execution with cross-functional teams in the U.S., U.K., and India.

● Drove 20% revenue growth and expanded market presence, ensuring alignment between client needs, internal technical teams, and third-party IP vendors, enhancing project delivery and customer satisfaction. Sela, San Francisco Bay Area (Sep 2019 - Apr 2020) Chief Technical Officer - Sustainability Ecosystem Blockchain Analytics Platform Led the architecture and development of a blockchain-powered sustainability analytics platform, integrating AI, Big Data, and real-time satellite/sensor data to automate transparency, fund allocation, and environmental impact monitoring for global sustainability initiatives.

● Designed algorithmic modules integrating real-time tracking, biometric fund verification, and AI-driven resource allocation, securing pilot deployments with WWF & BP to improve oil spill remediation, marine wildlife conservation, and sustainable farming initiatives.

● Established university partnerships to develop AI and Big Data-driven environmental tracking models, enhancing predictive analytics for sustainability efforts.

● Architected blockchain security frameworks, implementing encryption, smart contracts, and automated compliance to ensure traceability and secure global fund distribution. Huawei, San Jose, CA China (Oct 2017 - Sep 2019) Chief Technology Architect - HW/SW Systems Engineering Led Huawei’s digital transformation for hardware and software systems engineering, implementing AI-driven automation, digital twin frameworks, and predictive analytics across smartphones, 5G infrastructure, PCs, wearables, and automotive technologies. Spearheaded system-wide process optimizations, ensuring seamless integration of Huawei’s HiSilicon ICs into next-gen platforms.

● Led Huawei’s transition from manual design processes to a fully automated AI-driven digital twin ecosystem, eliminating inefficiencies and cutting design cycles by 40% while improving quality by 30%.

● Developed AI/ML-powered design automation and predictive analytics, enhancing design accuracy, manufacturability, and system-wide collaboration across global engineering teams.

● Spearheaded semiconductor design optimizations for HiSilicon ICs, enhancing 3DIC integration, chiplet architectures, and sub-nanometer design methodologies for AI, 5G, and hyperscale applications.

● Architected a system-wide digital thread framework, integrating design, manufacturing, and validation data, enabling real-time analytics and process optimizations across hardware/software teams.

● Led AI-driven workflows for SIPI (Signal & Power Integrity) and thermal analysis, significantly improving simulation accuracy, test efficiency, and predictive failure analysis.

● Enhanced 5G, AI, and connectivity integration across flagship products, enabling high-performance computing, cloud connectivity, and advanced semiconductor design solutions.

● Developed standardized design workflows for multiple product categories, ensuring scalable engineering processes for consumer electronics, telecom, and automotive applications.

● Upgraded global engineering teams by launching digital transformation training programs, mentoring 200+ engineers in next-gen AI-driven design, automation, and digital twin methodologies. Cadence Design Systems, San Francisco Bay Area (Dec 2016 - Oct 2017) Director of Business Development - Product and System Design Enablement Alan Porter Page 3

Led strategy, business development, and product enablement for Cadence’s electronic design automation (EDA) software, driving market expansion, product adoption, and strategic partnerships across semiconductor and AI-driven electronic design markets.

● Developed go-to-market strategies and drove adoption of Cadence’s EDA and system design solutions, ensuring alignment with industry needs and emerging AI/hardware trends.

● Forged strategic partnerships that enabled alliances and acquisitions, expanding Cadence’s market footprint and strengthening its competitive position.

● Led cross-functional collaboration across R&D, sales, and marketing, driving customer engagement and optimizing design workflows for semiconductor and AI hardware companies. Apple, San Francisco Bay Area (Apr 2005 - Dec 2016) Senior Design Engineering Manager - Product Design Technologies Led Apple’s digital transformation for product design and engineering, joining during the company’s expansion to launch the first iPhone, iPad, Apple Watch, and AirPods. Led the development and implementation of design technologies, digital workflows, and verification methodologies, enabling seamless hardware/software integration across new product categories. Built and scaled a high-performance engineering team, optimized design automation frameworks, and streamlined product development cycles, earning Apple’s Ten-Year Key Contributor Award.

● Managed a $50M budget for engineering software, simulation tools, and design automation, negotiating high- value vendor contracts and optimizing Apple’s global engineering workflow.

● Led digital transformation across Apple’s product design ecosystem, integrating predictive analytics, digital twin frameworks, and automated design verification, reducing time-to-market from years to ~9 months.

● Built and scaled Apple’s product design technology team from scratch, hiring and mentoring 30+ engineers within the first three months to support all flagship products.

● Spearheaded verification and signal integrity solutions for Mac, iPad, Apple Watch, AirPods, and iPhone, ensuring seamless transitions between chip architectures (e.g., PowerPC to Intel, ARM-based M chips).

● Drove next-gen simulation and design verification workflows, improving PCB miniaturization, multi-radio integration, and power efficiency, solving thermal and signal integrity challenges for ultra-compact designs.

● Orchestrated seamless integration of acquired technologies, leading design process assimilation for companies like P.A. Semi, Beats, and sensor/camera acquisitions.

● Implemented a centralized design simulation model database, streamlining cross-domain collaboration and reducing design verification cycles across engineering teams.

● Developed Apple’s "Design for Manufacturing" and "Design for Test" frameworks, integrating supplier collaboration and early defect detection, enhancing manufacturing efficiency and compliance validation.

● Reduced design cycle iterations and prototype dependencies, enabling faster production readiness and quality control for Apple’s consumer electronics and future automotive initiatives. PREVIOUS PROFESSIONAL EXPERIENCE

Director of Services, Cadence Design Systems, Greater New York City Area (1997 - 2005) Sr. Sales and Applications Engineering Manager, Viewlogic / Synopsys, Mid-Atlantic, Detroit, MI (1995 - 2000) EDUCATION

NextGen Advanced Executive Leadership Program, Siemens / INSEAD Advanced Leadership Program, Apple University

Post-graduate Continuing Education Program, Telecom Engineering, Monmouth University Bachelor of Science (BS), Electrical and Computer Engineering, Biology Minor, Bucknell University CERTIFICATIONS

Executive MBA Certificate sponsored by Cadence, Santa Clara University Leavey School of Business Strategy in the Age of Digital Disruption Certificate sponsored by Siemens, INSEAD B2B Marketing Pro Certificate, Forrester

Employee Ambassador – Champion Certificate, Siemens

Contact this candidate