Jeffrey Lance Baldenegro

Intel WWID # ********

*** *. ******** **. ********, Az. 85255

Home # 480-***-****

Cell # 480-***-****

Manufacturing Production Specialist with 15+ years as a clean room fab operator, 10 years as an Assembly Eng. Technician, 3 years as a Chemical Waste Handler and 2 years Shipping/ Receiving / Inventory Control of all RAW MATERIAL & ALL ENG. Test wafers and or Test Chips left at end of shift to be entered & accounted for in data base.

Crossed trained and certified in plasma / dry etchDiffusion wet etch chemical hoods, Thin film/ Photo resist Strippers, Shipping & Receiving/ Material Chemical waste Handler, Engineering Process Tech, Assembly Eng. Tech. Also have knowledge of SPC Charting of Upper & Lower Control Limits 6 sigma out of range failure

Work Experience:

Pyramid Consultants

Contracted to work at Intel

AFW001FoupWash Manufacturing Tech @ C3 Intel in ATTD group. Shift 4

Oct, 2019 - Sep, 2020

Hired to work at C3 Intel with the AssemblyTestTechnology Development group to run the AFW001 FOUP / FOSB Carrier Washer. Trained and Certified and currently got asked to help Intel's ManufacturingSystemsEng. Haley Kong to add or to improve on some Quality and Safety Procedures to add to the AFW001 Foup Wash Spec. I had learned as a Foup Wash MT @ Fab 12 & 32. The small issues and concerns I had were brought forth to my manager and he forwarded my emails to Haley Kong. My biggest concern was the rubber door gaskets on both Foups and Fosbs because of the condition the gaskets were in which were in bad shape. At Fab 12 & 32 after the carriers are washed they are put on a DAT TOOL which it takes off the door and reposition the door to make sure it is properly placed on the carrier before going on the next tool. Then it goes to a tool that checks the carrier for any air leaks due to a bad rubber door gasket or if there is still moisture inside the carrier that needed to be inspected per spec and worked on before retrying to check for the proper psi reading + - 5 according to the type of carrier it is and the correct psi pressure chart per spec. My concerns about the rubber door gasket and the plastic door lock clips that are coming into Foup Wash area broken prior to being washed prompted the Eng's to take a look at these 2 major concerns I had for possible reasons of contamination and or high particle counts due to these concerns I had since my 2nd day on the job. I am also trained & certified on rubber door gasket repair from Fab 32 last year.

KELLY SERVICES

Contracted to work for Intel ASM Wafer Starts AFW FOUP WASH MANUFACTURING TECH

Jan. 2018 to March 23, 2019

Trained & Certified on AFW Copper/ Non Copper Foup Washers, Manual & Auto bagging tool, Gasket Repair/ Peer Trainer on AFW Foup Washers & Automatic Foup Bagger.

KELLY SERVICES

Contracted to work for Intel Fab 12 Dry Etch Manufacturing Tech. Shift 7

Dec. 2010 thru Dec. 2011

Trained & Certified on the LRO & LRP (Lam Research OXIDE / PLASMA) Resist Strip Etchers in Dry Etch Area/ Trained, Certified & Knowledge of 6 Sigma SPC Upper - Lower Control Limit Charting.

KELLY SERVICES

Contracted to work for Intel

ASM Wafer Starts AFW FOUP WASH MANUFACTURING TECH

AUGUST 2007 - 2008

Worked on the AFW FOUP WASHER Cleaning all FOUP & FOSB Carriers of Copper and Non Copper Carriers. Also helped out as a Chemical Waste Handler.

Manufacturing Technician Microchip Technology - Chandler, AZ - October 1989 to March 2007

Worked 18 years at Microchip Technology in Chandler, AZ. FAB Production Specialist trained and certified in Wet & Dry Etch, Plasma Resist Etch, Diffusion, Wet Etch Chemical wet hoods, Thin Films, photo resist strippers, Shipping & Receiving, Assembly Engineering Tech. duties include K/S Diamond blade wafer wet saw, wafer mount, wafer saw die cut, pick & plate, inspect die, gold bond die attach, K/S wire bond, inspection, seal lids on packages, heat furnace, manually set ink press for marking I/C parts with chip identification, trim & form leads and put parts into shipping tubes, ThermostatUVC Hot & Cold Test in Final/ Probe Test Area, Ship Test Chips to Eng.

Intel Corp - FAB 6

August 1992 to November 1992

Hired on as a BLUE BADGE Full Time Employee on 3rd shift in Fab 6 Worked on the 8330 metal resist etcher, elected to go to Austin, TX to attend training classes to become a Preclean closed operator for metal resist etchers to clean when they become dirty and particle counts go outside of required Upper/ lower control limits.

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