Quality Engineering Technician with 20+ years of experience

VIDA MERCADO

Austin, TX • 512-***-**** • ****.*******@*****.***

LinkedIn: linkedin.com/in/vidamercado

PROFESSIONAL SUMMARY

Quality Engineering Technician with 20+ years of experience in high-volume semiconductor manufacturing environments. Expertise in risk management (FMEA), and workflow optimization. Proven track record in driving efficiency and productivity through Lean Six Sigma methodologies. Skilled in structured problem solving and root-cause analysis (8D/DMAIC), with hands-on proficiency in defect inspection and advanced failure analysis techniques (SEM, FIB, EDX).

CORE SKILLS & COMPETENCIES

Quality & Risk Management

QMS/QMR • Non Conformance & MRB • PCN/Change Management • ISO Standards • Audit Compliance • Customer/Supplier Quality • ESD Control • JEDEC • KPIs • Risk Assessment & Mitigation • FMEA (Champion-Level)

Lean Concepts & Six Sigma

Continuous Improvement • Kaizen Leadership • Standard Work • Waste Reduction • Process Optimization • Productivity & Yield Improvement • 5S • DOE • SPC • ISTAB • Performance Metrics • Six Sigma Certification

Root Cause & Failure Analysis

8D/DMAIC • Systemic & Technical RCA • CAPA • Fishbone • 5 Why • Fault Tree • Field Return Triage • Fault Isolation • Optical/IR • X Ray • SEM/TEM • FIB • EDX

Yield Enhancement & Defect Metrology

FEOL/BEOL Inline monitoring • Defect elimination • Excursion Control • Defect density (D0, adders, %DD, %CLUST) Defect inspection • BF/DF KLA2xx, PUMA, Compass/Plus • Surfscan SP1/2 • SEM Review: AMAT SEMx/G3

●Data Analysis & Reporting

Excel • JMP • SQL • Klarity • Verity • JIRA • QMS • Dashboard Development • Trend Analysis • Technical & Customer Facing Reports • PowerPoint • AI Assisted Analysis (CoPilot/ChatGPT)

EMPLOYMENT HISTORY:

Senior Failure Analysis Engineering Technician

Samsung Austin Semiconductor. – Austin, TX Feb 2026 – Present

Technical lead for physical deprocessing and Failure analysis of in-line die and customer returns.

Customer Quality Engineering Technician

Cirrus Logic Inc. – Austin, TX Apr 2024 – Nov 2025

Supporting liaison for Tier-1 customer, managing field return triage (RMA), and promoting quality, performance, and reliability throughout all phases of product lifecycle.

Drove triage of customer returns (RMA) cross-functionally through ATE, Bench and Failure Analysis routines to identify failure mechanisms and implement sustainable resolutions.

Collaborated with supply chain engineers across fab and OSAT operations to perform root-cause investigations (8D/ DMAIC) linking failure modes to process, test, or assembly origins.

Interfaced with PE, PTE engineering teams to review/ analyze Time-0 parametric shifts to implement appropriate guard bands and/or test-coverage enhancements.

Built dashboards and internal tracking systems to support efficient data collection, documentation, and management of all active and archived RMA material.

Developed workflows and reporting templates to standardize CQE communication and improve turnaround time (30%).

Created technical reports for customer-facing communication of resulting FA and Supplier investigations.

Analyzed RMA, test, and customer data to determine DPPM trends and translate failure patterns into actionable insights.

NPI Technical Champion - SCE Edge Processing

NXP Semiconductor - GNTC-A - Austin. TX May 2021 – Mar 2024

Technical lead for business line interests supporting probe and final test development for New Product Introductions.

Coordinated cross-functional execution of core team assignments across all product phases, including new product qual, reliability testing, first silicon readiness, test plan development, and equipment/ Kit hardware qualifications.

Led root-cause investigations using 8D and DMAIC methodologies, applying structured problem-solving tools (fishbone, 5-Why, fault tree) to eliminate program and equipment breakdowns.

Ensured program readiness of probe cards and test kit hardware through mechanical design reviews, setup validation, BOM accuracy, and supply chain quality controls.

Optimized floor operations using Lean principles to implement standard work, area 5S, and operator cross-training.

Served as FMEA champion for probe and final test, leading annual cross functional reviews that strengthened process controls, elevated quality standards, and advanced global ESD compliance across test floor operations

Principal CFM & Defect Metrology Technician

Skorpios Technologies - Austin, TX __Nov 2016 – May 2021

Equipment and program manager driving yields and managing factory and product level defectivity.

Managed AMAT ComPlus and KLA SP1 Surfscan tools overseeing all preventive maintenance, upgrades, and tool repairs.

Interfaced with vendors to develop equipment capabilities, establish performance metrics, and determine SPC strategies.

Advised customer and integration teams on inspection planning, recipe/ layer optimization, and defect characterization.

Analyzed defects and processing data to identify trends, reduce defectivity and prevent excursions.

Yield Enhancement & Defect Analysis Technician III

NXP Semiconductor – ATMC - Austin, TX Sep 2006 - Oct 2016

Defect Layer Owner, accountable for primary automotive, aluminum-based technologies, focused on reducing in-line defectivity throughout all Front-End of Line (FEOL) stages.

Managed sampling and data collection of in-line defectivity monitors to establish and control baseline D0 levels and drive improvements.

Conducted scrap investigations following 8D/ DMAIC processes to isolate factors and determine root causes. Analyzed potential failure points to mitigate system breakdowns and minimize future risk.

Designed & executed various DOEs to support process development and/or new equipment qualifications.

Implemented various line improvements utilizing Lean Concepts and cross-functional team efforts to reduce waste, enhance productivity, and increase yield.

Facilitated and led high-impact technical Kaizen events involving cross-functional participation (process, manufacturing & equipment disciplines) to evaluate & resolve various complex issues impacting the factory.

Led internal engineering teams responsible for area SPC, and in-line scrap performance metrics.

Defect Metrology Technician:

NXP Semiconductor – ATMC - Austin, TX Sep 2006 - Oct 2016

Application and Equipment owner for Defect Metrology tools: BF/ DF, KLA Tencor SP1, AMAT SEMV, FIB, EDX.

Program manager responsible for all performance metrics, recipe development, SPC, tool matching, and overall manufacturability of high-volume defect inspection and SEM review.

Factory lead for In-Line SEM Defect review along with advanced localized API inspections and FA techniques, such as X/Tilt SEM, FIB, and EDX. Analyzed data for defect characterization.

Led focus team in cost savings initiative to qualify direct & second source vendors, extend life cycle for parts, and consolidate preventive maintenance saving over $25k/qtr.

Led cross-factory implementation of innovative process control methodology for the KLA SP1 toolset.

Established optimal settings, base templates, and a comprehensive guide for recipe development on SEMV G3.

Qualified and released new (used) AMAT SEMV G3 tool and associated analytical components.

Senior Process Technician III Thin Films, CVD:

Freescale Semiconductor – MOS 2,3,13 - Austin, TX 1993 – 2006

Process & Equipment owner for Atmospheric Pressure Chemical Vapor Deposition (APCVD) toolset.

●Responsible for recipe development, variability reduction, defectivity improvements, and process optimization.

●Managed SPC, FDC, FMEA, and other quality systems for assigned toolsets and associated processes.

●Implemented and drove Factory Automation (GEM) for the WJ tools for operational ease and risk reduction.

●Facilitated control plan workshops to implement cost initiatives saving over $17k/qtr.

●Films Metrology Tool Owner: - BIORAD FTIR.

EDUCATION & CERTIFICATIONS:

Austin Community College – General Engineering

Six Sigma Yellow Belt certification (Green Belt-level experience through DMAIC, RCA work).

Lean Concepts and Advanced Quality & Reliability Training: FMEA, SPC, DOE, ISO standards.

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