Scott D. Gilman

*** ******** ***. ***********, ** 01331 978-***-****

aczfmr@r.postjobfree.com

SUMMARY OF QUALIFICATIONS:

Accomplished Operations & Engineering Manager with 27 years of experience

Extensive experience in financial budgeting, product development, and capital planning

Broad knowledge of TS16949, ISO9001 & ISO14001Quality Management Systems

Innovative and proactive leader who nurtures teams and organizations

EDUCATION:

M.B.A. – Leadership (2017) - Franklin Pierce University, Rindge, NH

B.S. - Management (2011) - Franklin Pierce University, Rindge, NH

A.S. - Electrical/Electronics Eng. (1989) - Vermont Technical College, Randolph, VT

PROFESSIONAL EXPERIENCE:

Skyworks Solutions, Inc., Woburn, Massachusetts 2000 - Present

Engineering Manager

Drive hiring/recruiting activities of Engineers and Technicians for the Equipment Engineering Group.

Directly manage multiple shifts of Equipment Engineering Technicians who support 7x24 manufacturing.

• Lead corporate Molecular Beam Epitaxy Equipment Engineering activities for 14 years.

Focused on reducing operating expenditures through the cultivation of enduring partnerships with 2nd and 3rd party suppliers.

• Pro-actively moved forward the use of Lean Manufacturing, SPC, Visual Systems, Operating

Systems for Production Control, accurate Specifications for ISO900 compliance, LOTO, and Poke-

Yoke.

Built robust relationships with all stakeholders, including senior executives, to optimize decision-making and promote continuous business improvements.

Budgetary responsibility and financial planning for all aspects of department’s repair/maintenance; which includes spare parts, consumables, capital improvements, and service contracts.

Texas Instruments, Merrimack, NH Feb’99-Mar’00

Senior Manufacturing Supervisor

Responsible for off-shift operations & process engineering (45+ employees) of Semiconductor Manufacturing at Texas Instruments Advanced Analog Products Division.

Specifically hired to help meet customer future demand for product, through building up one off-shift (Compressed Weekend Nights) that had impeccable quality but low productivity.

Primary responsibilities included: safety, quality, meeting quarterly manufacturing objectives (Losses/1K, Product Rework Rate, & Shipment of Product) reducing operation expenses, continuous improvement, hiring, team building, employee performance management, productivity plans, salary planning and corrective action.

Intel Corp., Hudson, MA (formally Digital Equipment Corp.) Jun ‘93-Jan‘99

Etch Operations Manager

Site Emergency Response Team Safety Officer

Responsible for all administrative duties and direct supervision for 25 Operations, Equipment Engineering & Process Engineering Technicians in Etch Technology.

Specific responsibilities include ensuring a safe work environment, team building, performance management, salary planning, training plans and corrective action.

Volunteer Instructor with Intel-University for the Energized Electrical Work curriculum.

As one of four Site Emergency Response Team Safety Officers covering a 7X24 operation, sole responsibility of ensuring the Safe response to all Fires, Hazard Materials Incidents, and Medical Emergencies.

Convac/APT, Hopewell Jct., NY Office Oct ’90-Jun’93

Field Service Engineer

Responsible for the domestic and international installation, trouble-shooting and preventative maintenance for all Convac/APT Semiconductor, CD, Ceramic Substrate and LCD Manufacturing Equipment.

Primary Field Service Engineer covering IBM Burlington, VT, for Double Sided Wafer Scrubbers for CMP & Develop/Coat Wafer Tracks.

Performed Pre-Source Inspections prior to Customers Source Inspections of Ceramic Substrate Manufacturing at Convac/APT’s main production facility in Viahgen/Enz, Germany, too secure high Customer satisfaction.

Managed Spare Parts Inventory at Convac/APT East Coast Field Service Office.

Conducted training seminars for IBM Engineers and Technicians on Convac/APT’s products.

SITE Services, Santa Clara, CA Oct ’89-Jun’90

Field Service Engineer

Responsible for repair and preventative maintenance for Contract Service during third shift (solo) of 30 GCA Develop/Coat Wafer Tracks at IBM Burlington, VT Division.

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