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Supply Chain Engineer

Location:
Morrisville, NC
Posted:
November 28, 2013

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Resume:

Brad Condon

***********@*****.***

919-***-**** (RTP, NC)

EXECUTIVE SUMMARY:

( Procurement & Engineering background with proven success

( In-depth knowledge of international supply chain strategy, practices,

and procedures

( Ability to lead, grow, and inspire multiple teams and staff world

wide

( Recognized for strong work ethic and integrity

( Managed fiscal budget targets assigned by CFO and Business Unit

General Managers

( Inventory management experience ensuring supply demand sufficiency

and order execution

( Strong analytical and negotiating skills managing strategic supplier

relationships

( Experience negotiating complex commodity contracts to meet diverse

customer and supply objectives

( Excellent project management, communication, and presentation skills

( Hands on experience with JEDEC, ISO9000, QS 9000, ASTM, ISTA, and FDA

guidelines

CORE COMPETENCIES:

( Strong Work Ethic and Integrity ( Financial Acumen

( Motivational Leadership ( Competitive Intelligence

( Relationship Building ( Negotiating

( Talent Development ( Profit & Loss Risk Analysis

CAREER PATH:

13 years in Procurement/Global Supply Chain at Lenovo and IBM. 5 years of

Development Engineering at Tyco Electronics. Promoted in 1997, 1999, 2000,

and 2006.

( Lenovo ThinkPad Accessories Procurement Director, RTP, NC - 04/2012

to current

( Lenovo ThinkPad ODM Procurement Director, RTP, NC - 04/2011 to

04/2012

( Lenovo Latin America Procurement Director, RTP NC - 06/2010 to

04/2011

( Lenovo Ex-Pat Assignment, Memory Procurement Director, HK/SZ, China -

06/2006 to 06/2010

( IBM Memory Procurement Senior Commodity Manager, RTP, NC - 06/2002 to

06/2006

( IBM Accessories Procurement Commodity Manager, RTP, NC - 06/2000 to

06/2002

( Tyco Electronics Senior Packaging Development Engineer III,

Greensboro, NC - 09/1999 - 06/2000

( Tyco Electronics Packaging Development Engineer II, Greensboro, NC -

09/1997 to 09/1999

( Tyco Electronics Packaging Development Engineer I, Greensboro, NC -

09/1995 - 09/1997

( Rochester Institute of Technology (R.I.T.), Rochester, NY - Graduated

09/1995

( Abbott Laboratories Packaging Engineer College Internship, Waukegan,

Il - 01/1994 to 09/1994

RECENT AWARDS & RECOGNITION:

2012 & 13: Chief Procurement Officer Award - beat stretch cost savings

targets

2010: Selected for "Gold Program" (Executive pre-promotion training

with rotational assignments)

2008: Selected to attend opening ceremony of 2008 Summer Olympic

Games in Athens, Greece

2006: Selected for a 4 year Ex-Pat Assignment based in Hong

Kong with office in Shenzhen, China

EXPERIENCE:

Lenovo - Research Triangle Park, NC (04/2012 - Current)

ThinkPad Accessories Procurement Director, Global Supply Chain

? Lead 3 procurement teams: 1) GCM, 2) GSM, and 3) OE. Responsible

for supplier management, competitive bid analysis, price negotiation,

cost reduction, supply chain strategy, and supplier capacity management

supporting Lenovo flagship product line, ThinkPad

? GCM Team responsible for Global Commodity supply chain management,

GSM Team responsible for all Supply/Demand planning, and OE Team

responsible for all Order Execution.

? Annual spend responsibility = $400M

? Staff responsibility = 37.

? Suppliers managed: WD, Seagate, Apricorn, Targus, Logitech, Shimane

Sanyo, Goodway, Liteon, Chicony, Kensington, Samsonite, + VLH

? Present cost savings and supplier performance to CPO and CFO weekly

? Present strategy to CPO quarterly

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Project Manage contractual negotiations with the Lenovo Legal

Department and Suppliers

? Responsible for inventory management throughout the entire life cycle

Lenovo - Research Triangle Park, NC (04/2011 - 03/2012)

ThinkPad ODM Procurement Director, Global Supply Chain

? Lead two procurement teams: 1) ODM Procurement Team, and 2) Tier 1

Component Team. Both teams are responsible for supplier management,

competitive bid analysis, price negotiation, cost reduction, supply chain

strategy, and supplier capacity management supporting Lenovo flagship

product line, ThinkPad

? ODM Procurement Team: Manages suppliers supporting Lenovo outsourced

manufacturing

? Tier 1 Component Team: Manages procurement of parts not sourced by

the ODM's. ex. Keyboards, cameras, finger print card sensors, touchpad

sensor, and ThinkPad/Lenovo logos

? Annual spend responsibility = $3.8B

? Staff responsibility = 14

? Suppliers managed: Wistron, Quanta, Compal, Flextronics, & LCFC

(Lenovo/Compal JV), Chicony, Liteon, Alps, Bison, Synaptics, Authentec,

Kuroda, and CNP

? Present cost savings and supplier performance to CPO and CFO weekly

? Present strategy to CPO quarterly

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Project Manage contractual negotiations with the Lenovo Legal

Department and Suppliers

? Responsible for inventory management throughout the entire life cycle

Lenovo - Research Triangle Park, NC (06/2010 - 04/2011)

Latin America Procurement Director, Global Supply Chain

? Lead a procurement team responsible for supplier management,

competitive bid analysis, price negotiation, cost reduction, supply chain

strategy, and supplier capacity management in Brazil and Argentina.

? Scope included all ODM sourcing and all in country component sourcing

such as Memory and ECAT

? Annual spend responsibility = $1.7B

? Staff responsibility = 17

? Suppliers managed: Wistron, Quanta, Compal, Flextronics, Smart

Modular, and HBS Memory

? Presented cost savings and supplier performance to CPO and CFO weekly

? Presented strategy to CPO quarterly

? Developed suppliers in Latin America

? Project Managed contractual negotiations with the Lenovo Legal

Department and Suppliers

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Responsible for inventory management throughout the entire life cycle

Lenovo - Hong Kong/Shenzhen, China (06/2006 - 06/2010)

Ex-Pat International Assignment, Memory Procurement Director, Global Supply

Chain

? Lead a procurement team responsible for supplier management,

competitive bid analysis, price negotiation, cost reduction, supply chain

strategy, and supplier capacity management into worldwide manufacturing

locations

? Product Responsibility: DRAM, NAND, SSD, VRAM, DOM Cards, and USB

Memory Keys

? Annual spend responsibility = $3.5B

? Staff responsibility = 12

? Suppliers managed: Samsung, Micron, Hynix, Elpida, Nanya, Promos,

Powerchip, SanDisk, Toshiba, Intel, Ramaxel, and Sharetronic

? Direct support provided to Development, Marketing, Sales, and

Manufacturing providing cost effective use of technologies and business

solutions

? Presented cost savings and supplier performance to CPO and CFO weekly

? Presented strategy to CPO quarterly

? Chaired WW Memory Procurement Council

? Developed Global Suppliers in emerging geographies

? Project Managed contractual negotiations with the Lenovo Legal

Department and Suppliers

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Responsible for inventory management throughout the entire life cycle

IBM - Research Triangle Park, NC (06/2002 - 06/2006)

Memory Procurement Senior Commodity Manager, Global Supply Chain

? Lead a procurement team responsible for supplier management,

competitive bid analysis, price negotiation, cost reduction, supply chain

strategy, and supplier capacity management into worldwide manufacturing

locations

? Product Responsibility: DRAM, NAND, SSD, VRAM, DOM Cards, and USB

Memory Keys

? Annual spend responsibility = $1.75B

? Staff responsibility = 6

? Suppliers managed: Samsung, Micron, Hynix, Elpida, Nanya, Promos,

Powerchip, SanDisk, Toshiba, Intel, Ramaxel, and Sharetronic

? Direct support provided to Development, Marketing, Sales, and

Manufacturing providing cost effective use of technologies and business

solutions

? Presented cost savings and supplier performance to CPO and CFO weekly

? Presented strategy to CPO quarterly

? Chaired WW Memory Procurement Council

? Developed Global Suppliers in emerging geographies

? Project Managed contractual negotiations with the Lenovo Legal

Department and Suppliers

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Responsible for inventory management throughout the entire life cycle

IBM - Research Triangle Park, NC (06/2000 - 06/2002)

Accessories Procurement Commodity Manager, Global Supply Chain

? Individual contributor role responsible for supplier management,

competitive bid analysis, price negotiation, cost reduction, supply chain

strategy, and supplier capacity management supporting IBM branded

peripheral hardware

? Product Responsibility: USB HDD, USB Memory Keys, Keyboards,

Speakers, Mice, UPS, PDU, DLP Projectors

? Annual spend responsibility = $500M

? Suppliers managed: Liteon, Chicony, NMB, Alps, Harmon Kardon, Jazz,

Targus, Cyber Acoustics, Powerware, APC, Delta, Infocus, LG, Msystems,

and Trek

? Direct support provided to Development, Marketing, Sales, and

Manufacturing providing cost effective use of technologies and business

solutions

? Lead Quarterly Supplier Business reviews that included feedback on

price, quality, and delivery

? Developed Global Suppliers in emerging geographies

? Project Managed contractual negotiations with the Lenovo Legal

Department and Suppliers

? Responsible for inventory management throughout the entire life cycle

Tyco Electronics - Greensboro, NC (09/1995 - 06/2000)

Senior Packaging Development Engineer, Operations Core Engineering Team -

Automotive Division

( Completed a two-year rotational engineering program focused on

packaging engineering practices & applications including four, 6 month

assignments in each of the following divisions: 1) Global Communications,

2) Global PC, 3) Global Commercial Products, & 4) Global Logistics and

Distribution

( Chaired Corporate Packaging Procurement Engineering Team and Human

Resource Teams

? Worked on a multi-disciplinary team that developed new products and

manufacturing processes

( Worked with customers to design new products

( Quoted manufacturing costs & developed manufacturing strategies

supporting new product releases

( Responsible for investigating and implementing manufacturing

strategies for cost savings

( Responsible for bringing up new programs, including: packaging

design, construction & release, equipment selection & implementation,

process development, and release to automotive industry standards

( Hands on experience with a wide variety of packaging materials &

processes including: Thermoforms, Extrusions, EPS molds, Molded pulp,

Corrugated commodities, Labels, Cartons, Bags, Pallets, and Returnable

containers

( Experience in the compliance to ISO 9000 & QS9000 guidelines & the

various specifications associated with an international corporation

( Provided direct line of support troubleshooting existing production

line problems and inefficiencies

( Provided engineering support for 4-product focus teams

Rochester Institute of Technology Packaging Science Department, Rochester,

NY (09/1991 - 06/1995)

Packaging Lab Technician, College Of Science & Technology

( Job maintained while in college

( Responsible for the operation of lab facilities

( Assisted the lab manager in contract work for various companies

within the Packaging Industry

( Assisted in the instruction and guidance of students with emphasis on

lab equipment and materials

ABBOTT Laboratories, Waukegan, IL (01/2004 - 09/2004)

Packaging Engineer College Internship

( Interacted with vendors on a daily basis to identify cost savings,

resolve existing problems with commodities, and learn about new

technology

( Assumed a leading role in a $3.6 million Cut Label Verification

Project ensuring that all cut labels were bar coded by FDA deadline

( Updated and maintained Packaging Bill of Materials and Specifications

( Created an environmental database listing all packaging materials

used for the Pharmaceutical Products Division

EDUCATION:

Rochester Institute of Technology (R.I.T.)

Rochester, New York

Bachelor of Science, Packaging Engineering class of 1995



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