SHEHUL PANKAJ SURATWALA www.linkedin.com/in/shehulsuratwala/

*** **** ******* **, *** 8102, ac7vtb@r.postjobfree.com

Allen, Tx-75013 Phone: 817-***-****

Authorized to work for any employer in USA.

Career summary

Experienced mechanical engineer with a demonstrated history of working in the mechanical/research industry. Skilled in 3D CAD modelling, Thermal engineering, Mechanical design, problem solving and control systems. Strong engineering professional with a master’s degree focused in Mechanical Engineering.

Education

M.S. in Mechanical Engineering (2015-2017) CGPA:3.6/4.00 University of Texas at Arlington, USA

B.E. in Mechanical Engineering (2009-2013) CGPA: 9.23/10

Atmiya Institute of Technology and science, Rajkot, Gujarat, India

[Affiliated to Gujarat Technological University, India]

Skills

Technical: Solidworks, ProE-creo, MATLAB, Inventor, ANSYS workbench/Icepack, SLA/FDM 3D printing, Lean Six sigma, Mechanical Design, AutoCAD, Root cause analysis, Sensor design, Thermal engineering, computational simulations, GD&T, Control Systems (PID controllers), Rapid Prototyping, Additive Manufacturing, Control Strategy Logic, Electronic Packaging(Certified), FMEA,, Inventory control, Process planning and scheduling, SAP, VariPDM, CR process

Work Experience

Mechanical Engineer- KONE (2018-till date)

-Working as a KTO engineer for door category under supervision of Mr. Andrew Shupe, supporting the team with Engineering tasks like design/Analysis process, CR process, maintaining proper documentation on VariPDM, FL/SL order configuration in SAP.

Process Assistant – Amazon (2017- 2018)

-Responsible for daily freight management, scheduling outgoing inventory, inventory control at facility, labor management, managing department (trans-shipment), maintaining paper work for all outgoing inventory.

Mechanical Engineer -University of Texas at Arlington Research Institute (2015- 2017)

-Successfully completed conceptual design and re-design process of smart seat cushion project by 3D CAD modeling using Solidworks, computational simulations using Ansys and manufacturing work through various molding processes like compression/Injection molding-polymer processing and testing & validation process through FMEA.

-Completed conceptual design process of Reheal glove project, developed 3D CAD models using Solidworks and manufacturing processes like rotational/injection molding process in accelerated thermal heating cycles and through heated air flow to improve DFM.

Academic Projects

Energy scavenging and harvesting

Objective of this project was to determine the Non-conventional ways to harvest renewable energy. Under this project several published papers on renewable energy were reviewed, and a presentation was given. Also wrote a review paper on this topic to improve efficiency in semiconductor devices.

Using a software package determine the viscoelastic strain energy density of a PCB wafer per thermal cycle

With help of Ansys Icepack software project geometry of a PCB was created and material properties such as co-efficient of thermal expansion, young’s modulus, power source were given as an input.

Determine the optimum location of fan for finned heat sink inside a semiconductor electronic cabinet

Main objective of this project was to learn parametrization feature of Ansys software. For this project, a 3d model of a semiconductor equipment cabinet along with the finned heat sink was created and simulations were carried out in Ansys Icepack software for the various locations of the fan to determine uniform thermal stress analysis.

Determine the effect of using several types of fin configuration on pumping power for Electronic cabinet

Using the Ansys workbench software, inline and staggered fin configuration was modeled. To determine the optimum configuration of fin so that minimum pumping power required, simulations were carried out in Ansys to plot the different parameters such as velocity distribution, temperature distribution, volumetric flow rate.