Leonid Lazovsky

https://www.linkedin.com/in/leonidlazovsky

Cell 650-***-**** e-mail: ac7o3u@r.postjobfree.com

Citizenship: Canada Legal status in US: TN Visa

Current location: Fairport, NY

DESIGN SPECIALIST – ANALOG and MIXED-SIGNAL ELECTRONICS

Keywords: analog and mixed-signal electronics, SPICE simulation, PCB layout, digital cameras, image sensors design, optoelectronic measurements, device simulation

CAREER SUMMARY

Decades of expertise in development of camera heads and test electronics for solid-state image sensors.

Expertise in analog electronics development, image sensor investigation, evaluation and measurements.

CORE COMPETENCIES

Analog circuitry (design, simulation, layout, characterization, debugging)

Strong knowledge of analog and mixed-signal electronics including Low-noise high-speed amplifiers, Track-and-hold amplifiers, A/D and D/A converters, Image sensor drivers

On-hand experience with schematic capture and PCB design tools

On-hand experience with transistor-level design

Image sensors design and characterization

SELECTED ACCOMPLISHMENTS

Image sensors for space, military and scientific applications

Application-specific cameras for industrial and military applications with extreme speed and S/N requirements

Test electronics for advanced image sensors

PROFESSIONAL EXPERIENCE

Sony Electronics, East Rochester, NY

Image Sensors Design Centre, Pixel Development Engineer 2016-2018

Analysis, simulation, development and test of advanced CMOS image sensor pixels for various applications including mobile phones, medical equipment, automotive etc.

Improved tap-to-tap mismatch and parasitic parameters of the multi-tap CMOS pixel

Photometrics, Tucson, AZ

Electronics Engineering group, Sr. Camera Systems Engineer 2015-2016

Joined Photometrics as an expert in the field of CCD image sensor application and characterization, with emphasis to custom-designed high-speed low-noise EM CCD cameras, sensor characterisation and analog off-chip electronics development (project closed).

Teledyne-DALSA Corporation (Canada), Waterloo, ON, Canada

Application Specific Contracts Division (CCD group), Design Specialist 2000-2015

Joined DALSA (now Teledyne-DALSA) as CCD image sensor designer to lead custom-designed CCD sensor development projects, with a primary role of full design cycle implementation (from task formulation to final product qualification) as well as manufacturing process optimisation to meet challenging technical requirements.

Key developments:

Image sensor and low-noise multi-tap camera head

Contract won over competitor in company key market);

100 Mfps 2D time-of-flight sensor and high-speed digital camera for US Navy

Multi-tap high-speed CCD image sensor with Electron Multiplicationand test electronics

patent granted;

Buttable CCD TDI arrays and test electronics for X-ray and visual imaging

patents granted and pending;

Rad-hard low dark current 1-Mpix sensor and test station for NASA interplanetary mission

Sensor selected among competing alternatives; Robert H. Goddard Award granted;

Development of off-chip signal-conditioning electronics and image sensor drivers

Development of image sensor test techniques, procedures and algorithms

“Electron” National Research Institute / “Electron-Optronic” Research&Production Enterprise (St. Petersburg, Russia)

Senior Engineer, Senior Research Associate, head of CCD design team Before 2000

Joined “Electron” National Research Institute (and later transferred to “Electron RPE) as electronics engineer in Solid-State Image Sensors Division. Initially worked with off-chip circuitry with emphasis to low-power, wide-bandwidth and small footprint CCD drivers and video signal amplifiers. Later on, professional activity expanded onto CCD image sensors design and integration into custom modules, and camera heads design.

Key developments:

Design and characterization of CCD drivers and CCD front-end signal amplifiers

USSR first all-solid-state TV camera;

Design of complex test systems and cameras using TTL and CMOS logic

Wave-front sensors for ESO Very Large Telescope adaptive optics system

Contract won over competitors;

CCD chip and camera head for Gen III image intensifier.

Off-chip electronics for first Russian high-speed HDTV sensors

MoD contract won.

SOFTWARE TOOLS:

Schematics and device simulation: OrCAD P-Spice, LT Spice, Athena/Atlas

PCB schematics and layout: DX Designer, PADS Layout, Power PCB, Altium Designer

Image sensors layout: Design Workshop 2000, Cadence

Programming: Modula-2; familiar with Matlab

EDUCATION

M.S.E.E. (Honour Diploma), St. Petersburg State Electrotechnical University (LETI), Russia

HOBBIES

Electronics (eventually made a profession), Hi-Fi systems, mountain skiing, tennis, badminton, kayaking

List of publication: over 25 papers, 3 USSR patents, 2 US patents