BRIAN NGUYEN

PHONE Cell: 408-***-****

EMAIL: ac1q6c@r.postjobfree.com

-RESUMEOFQUALIFICATIONS-

SUMMARY:

•Certificate Electronic Technology Technician. Fremont District Adult & Community

Education

•Five years experiences R&D Technician, troubleshoot, upgrade, built PCB, and down to component level testing.

•Collect Data and Process Data (Vout-Iout-Cdyn), Rational Visual test, Ni-DAQ .Python,DAL, running benchmarks running Automation and Data lock file. Collect Data and Process Data,

•Four years’ experience IPC-610Class2-3 PCBS solder Inspection, component and completed training IPC 610.

•Four years’ experience Solder small component, Rework and Repair SMT/BGA and Jumper wire, Under Microscope (40x). Rework and repair small parts (0402)

•Five years’ experience in R&D Biotech/Medical (Test Solution code and Temperature) and Electronic Technician about update Version, testing and troubleshooting. Product returned for repair and down to component level testing, troubleshooting. Reading schematics and engineering drawings working with EE group and Making reporting the meeting every Friday.

SKILLS:

•Knowledge of OS Windows’s server 10, 12 and OS Linux7.3.Microsoft, Excel & Microsoft Word.

•Personal Skills: Hard working, fast learner, persistent &friendly.

•I Excellent Skills in the use of hand tools test equipment.

•Having an inquiring mind.

WORKSEXPERIENCE:

Nov/2012 to Jul/2017, INTEL CORPORATION, SANTA CLARA, CA,

.Position: H/W Technician Engineering.

-Update latest Bois and BMC H/W and F/W,

-Working in the Lab EE team server team, Run command insert scripts run boot scripts and run workloads, Platform: NEON CITY: FPGA, SKX, BDX and HSX,

-Running Automation and Data lock file,

-Collect Data and Process Data, Excel and Rational Visual test, Ni-DAQ .Python,

-Modifier test system and Troubleshoot system,Update Bios setups Bios and BMC latest,Convert TXT file to CSV file,

-Rework and repair Solder small parts (0402) cable jumper wire, Rework Repair Replace BGA

Mar/2010 to Jun/2012 ZNYXNETWORKS, FREMONT, CA

•Position: Inspector Functional Test.

-Inspection on IPC610Class2-3PCB, Solder, component and Fab.

-EOE, MPI BOM Review and performed short/open insufficient solder, cold solder on the BGA.

-Working with Engineering and Solder. Rework SMT/BGA, Jumper wire and X-ray solder BGA.

-Reading in striation setup test system and functional test.

-Completed Training IPC610 from ZNYXNETWORKS.

May/2008to Jan/2010 BROADCOMCORPORATION.SANTA CLARA, CA

•Position: H/W Techcian Engineering.

-Working in the lab and team EE for Bluetooth.

-4pt_Capture testing and audio lab.

-Phone Inter-op test procedure.

-Modifier and troubleshooting, Testing and troubleshooting.

-Download program and setup new firm ware.

-Oscilloscope/200Mhz 4-Ch 2GS/S and w/40Mhz and DMM.

-Rework and repair, Solder.

Aug/2006to May/2008 UNITEKINC, FREMONT, CA

•Position: Electronic Technician.

-Expertly read schematics to troubleshoot, circuit and logic boards.

- Component level testing, troubleshooting and Debug Blink Codes and Error Codes, Circuit.ROM Firm wares Checksum.

-RMA.Component troubleshooting and PCB test.

Sep/2002toFeb/2006 ABBOTT, ALAMEDA.CA

•Position: Electronic Technician.

-Setup software test and maintained PC system to install Program and test medical

Products.

-Calibration or analytical technician, circuit’s components, Analytical equipment/instruments.

-Troubleshooting PCB and test Fixture. Working with EE group and making report in the meeting every Friday.

-Using DC Power Supply_3V/ (Hewlett Packard E363A/0-6V.SA).

-Oscilloscope/20Mhz and w/40Mhz and DMM.

-Completed Training for Agile CMV 8.5(Level1&2).From ABBOTT.

EDUCATION:

•StudyingtocompleteanA.A.DegreeinComputer.ElectronicTechnology.MissionCollege, Santa Clara, CA. (summer, 2003).

•Certificate Electronic Technology Technician.

Fremont District Adult & Community Education. (Spring2001)

CITIZENSIDP: U.S.

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