Manufacturing Machine Operator
Resume:
Isaac O. Thompson
Phone:602-***-****
E mail: *************@*******.***
Summary
Recently embarks and inclined to work in Behavioural Health setting/ security officer for about two years.Previously,worked about four years in Arizona State Veterans Home Services/Setting with mentally-challenged/debillitating illness,Alzheimers,schizophrenia,bipolar,depression tendencies.Nonetheless,duties includes transportation services.
A self-motivated Manufacturing Specialist with over 16 years experience in the semiconductor industry and a Bachelors Degree in Business and Applied Science. Skilled at interfacing with customers and solving production problems in back metal thin films, grind, etch, probe and final test operations; Wet Etch, Metal Strip; Implant; Front- Back Metal; Photo Resist.
Key Qualifications
OPERATE AND TROUBLESHOOT:
Grinders, Evaporators- CHA; Probe; Etch- Dry,
Wet Etch, Metal Strip; Implant; Front- Back Metal; Photo Resist;
MRC Sputters; Furnace Operations- Sinter, Oxide, Alloy.
Equipment Adjustment
Statistical Process Control
Inventory Control
Stocking, Shipping, Receiving
Quality Inspection
Final Test
Calibrations
Meterology
Reliability Testing
Equipment Profile/Qualification
Computer Skills:
Macintosh BPC 110; Microsoft Word, Excel; IBM PC, PDP 1144 Database Management,Microsoft Outlook,Windows:7&8,Microsoft Office.
L-3 Communications Oct,2016-Present
Warrior Systems Assembly Operations,Electron Tube Operations,Processing (Potting Vacuum Station Operator).
Work Experience
Choices South Central:Behavioural Health Clinic Dec,2013-Dec,2016
Behavioural Health Technician setting duties,monitors,mediates,interfaces client/intakes interactions,maintains staff security,courteous vigilance,document daily and incident reports as regards intakes and emergencies.Nonetheless,I have acquired security surveillance and courteous vigillance observation experience in Serious/Seveer Mental Illness Setting, Apartment Complex,Commercial-Building,Grand-Resorts,Hotels,Close-Circuit-Monitoring-Settings.More importantly;dailyduties is not limited to the preceeding/afforementioned:I actively engage the intakes/client in crisis intervention strategies,motivate good behaviour development that enhances individual growth to meet their needs.Finally,communicates feedback to respective staff and supervisors as a team role.
Heraeus Materials Technology Aug,2013-Oct,2013
Machine Operator-crosstrained in wet surface grind/standard-non-standard- operations,laser mark/peen operations,QA inspections,sandblast,melt operations.
Intelcorporation:DETD1: 4-1-2013-
5-15-2013
Cross-Trained in Router Operations,Waterclean Operations,WetBlaster Operations,LaserMark Operations Operations,Magazine:Loader and Unloading Operations,Singulation-Disco-Strip-Cutter,Safety Management By Walking Around Duties.
Intel Corporation 4-26-2012-
Manufacuring Technician-CMS:FAB12:COPPER/NONCOPPER 8-24-2012
Clean Room Lean Manufacturing,12inch wafer-Transport-Foup/FOSB Box Wash/Decontamination,Heat-Dry,Inspection,Assembly,Test,Particle Control/SPC,Bagging Operations for transportation.Operation include utilize database systems for workstation:Foup Wash TrackingLog,Fab 12 Lot Dispatch Views,MES300/PM SERVICE SYSTEM,AMHS-Transport System,DAT,ENTEGRIS and cleanroom product quality assurance.
Flip Chip August,2010-
Embedded Technology wafer processing operation including October,2010
Inspection, optical microscopy, lead free solder print, wet etch/strip, Hg probe, entering data into manufacturing/characterization database, labeling/packaging product, wafer handling at start operation.
United States Postal Services Dec-Jan
Material Handler/Mail Handler 2008-2012
Automation, Robotics Operation Casual-Regular
Automation Clerk,mail-scan-operations/distribution.
JBS Packerland June, 2009-
Meat Packing/production and Inspection. Jan,2010
Arizona State Veterans Home Phoenix,Arizona May-July
Transportation,Caregiver,Supply Distribution and Nutrition- 2004-2007
Assistance.
Freescale Semiconductor
Manufacturing Technician,Operate meterology/characterization Equipment,metal etch/asher
Reactor Equipment. Jan-April
2006
Microsemi Inc 2006-2008
Wafer Fab Operator May-March
Final Test Operations Die- Line Operations. Operate vacuum systems for thin film operations in the back metal area. Operations include wet-etch, using acid baths/hood, quality inspection and simple preventative maintenance. Resistor, thyristors, leads packaging and assembly, electrical-surge-sort testing, using lead contact/vibration testing equipments, test-programming.
Die-Line/Medical Operations include sorting readily sawed wafers and packaging for medical assembly .Assemble/build cells for pacemaker, using silver caps packaging, memory chips and soldering.
Intel Corporation 2005
Manufacturing Technician-Level 1 Sept-Dec
Operate metal etch reactor equipment, meteorology and surface characterization process equipment.Operations include workstream utilization,monitor control,surfscan,optiprobe,
TEL Oxide Etcher,Gasonics,OCR and vacuum wand;respectively.
Mesa Air Group Phoenix, Arizona 2004-2005
Airline Services/ Ramp Agent March-April
ON Semiconductor. Phoenix, Arizona 1998-2004
Manufacturing Specialist-PSO3 ZENER RECTIFIER-Zr-Fab August-Jan
Responsibilities include training assigned associates, adjust and qualify implanters
Tool- Proof all Back Metal and Front Metal, CHA’s/ Evaporators, Operates Balzers, MRC Sputters, Front and Back Metal clean/Etch.
Quality Inspection and process control charts, simple preventative maintenance
Certification includes XRF measurement tool and UV Tape- Detape exposure
Motorola Inc. Phoenix, Arizona 1988-1998 Manufacturing Specialist Technician MOS 4- Power Fab March-August
Assist CHA technicians with cleaning and building parts. Perform simple maintenance in Back Metals, Thin Film, Detape- Tape, Etch, Shot Gun Implant and Wafer Back Grind operations.
Contributed to yield and quality improvement by consistently identifying and correcting process inconsistencies. Commended for having zero reject lots during entire tenure in department.
Received Motorola’s NO6 upgrade.
Manufacturing Associate- Bipolar 5
Operate equipment in Final Manufacturing, Back Metal Thin Film Operators, including; Vacuum Systems-
Contributed to yield and quality improvement by consistently identifying and correcting process inconsistencies.
Commended for having zero reject lots for entire tenure in department Certification includes XRF measurement tool and UV Tape- Detape exposure
Received Motorola’s NO6 upgrade
Operate equipment in Final Manufacturing, Back Metal Thin Film Operations, including: Vacuum Systems- CHA, Passivation Heat Treat, Process Control Charts and Quality Inspection. Wackenhut Securities 1998 June-Aug
Protect and serve DES office personnel/customers and property. Provide a safe working environment for customer services. In addition provided 12- hour daily ground-security services for C&F Motor Freight company/Buckeye. Overlook shipping and receiving operation. Provided 12 hr round clock vigilance for company property.
Also trained on Photo Resist, Cold and Hot Etch, After Etch and after clean inspection, Wafer Probe Test and Class Probe Operations and Equipment Adjustment.
Cross- Trained in number test programs
Maintained excellent record for accuracy and minimal scrap
Selected as Final Manufacturing Representative for Environmental Safety and Health team, which inspected and performed monthly audits for entire fabrication plant.
Zener Rectifier – ZR 1988-1990
Manufacturing Associate, March-Aug
Operated marking and final test machines.
Scientific Atlanta-Screw/drill, electrical-chemical tests, assemble, solder and packaging for TV cable boxes. 1987-1987
June-Dec
Hi- Tech Distribution 1987-1988
Stock Clerk Filler, June-Dec
Responsible for shipping, receiving and inventory control of Motorola’s integrated circuits and products
Education and Training
Arizona State University
Bachelor of Science – Agribusiness Management and Applied Science
Gateway Community College
Surgical Technology (Graduation on May 13th)
CAAHEP Accredited Institution
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