CYNAN NEAK
*** * ****** **., ****** MA *****
Phone: 978-***-****
Email: *******@*****.***
OBJECTIVE:
Provide growth and value in a technology. To obtain a position that will enable me utilizes my experience and I am a hard working problem solving individual with extensive experience in Electronics Industry. I work well independently and with others.
EDUCATION:
ITT Technical Institute, Woburn, MA
2007- 2008 in Computer Electronics Engineering Technology
ITT Experience: Problem solving (math), Strategies for the Technical Professional, Introduction to Personal Computers, Managing and Maintaining, Fundamentals of Electronics, And DC/AC Circuits Laboratory
Lowell High School, Lowell, MA
Graduated 2006 Diploma
Hand Tool Experiences Use: Wrench, Pliers, Screwdrivers, Knife, Hand drill, hummer, Diagonal cutting pliers, Micro cutting pliers, Punch down tools,, Electrician’s scissors, and Soldering tools
PROFESSIONAL EXPERIENCE:
03/2009-08/2012 Global Imaging Technologies (GENERAL DYNAMICS) Nashua, NH
Thin Film Coating Technician
• Operated auto and manual coating chambers for electro-optical infrared (EO/IR) systems, multi-axis stabilized HD cameras, infrared lenses, optical systems and components and motion control products.
• Work under flow hood/ Clean room.
• Clean substrates as required / load and unload substrates on tools.
• Mechanical repairs and maintenance HVAC chambers and machines.
• Follow to manufacturing work orders, run sheets and travelers.
• Reliability and quality tests, and making electrical measurements, before and after products finish coating.
• Manually and using computer automated test systems.
• Optics testing and measure. Using spectrometer machine read and automatic save data of the optics (spectrophotometer, spectrograph or spectroscope) is an instrument used to measure properties of light over a specific portion of the electromagnetic spectrum, typically used in spectroscopic analysis to identify materials.
• We measure chemical on a scale by grams/ounces. (Have to be 100% measurement.)
So it be prepare for prep. Chemicals would be put into the chamber (Machine),
and manually/auto mixing under vacuum and high temperature heat.
• Chemical: Aluminum(Al), Chromium(Cr), Germanium(Ge), Gold(Au), Nickel(Ni), Platinum(Pt), Silicon(Si), Sliver(Ag), Yttrium(Y), Zinc(Zn), Acetone(CH3)2CO, Alcohol(-OH).
7/2008- 10/2008 CURTISS WRIGHT; Littleton, MA
Position Responsibilities:
Assemble complex electronic modules
Substrate attach (duroid/ceramic)
Follow written process instructions
Complete all required product documentation
Follow mechanical assembly instructions
Maintain output at expected levels
Maintain workstation area clean
Work flexible hours as required
Other duties as assigned
- Assemble chips on a ceramic or on a duroid substrate were modeled with or without under fill Epoxy.
• Un/Assemble complex electro-mechanical equipment. Understanding blue prints, repair parts and final assemblies ready for testing and shipping.
10/2007- 5/2008 GSI GROUP; Wilmington, MA
• Reliability and quality testing manually also using computer automated test systems. Related to the production of wafer fabrication, components, subassemblies, and final assemblies. Uses sophisticated programs to collect and evaluate operating data to conduct on-line adjustments to products, instruments or equipment.
2/2007- 9/2007 Triqunit Semiconductor; Lowell, MA
• Soldering and testing circuit board manually for customer.
• Reliability tests, and making electrical measurements.
• Perform mechanical production assembly operations to build up and assemble units such as Panels assembly, chassis drawers, cable harnesses, wire run lists, wiring diagrams, verbal instruction and using prints to install
• Utilizes a variety of small hand tools such as soldering irons, wire strippers, crimpers, wrenches, and screwdrivers
• Under fill epoxy to enhance solder joint reliability.
• Accomplishments: Finish all 15 circuits’ board for customer and obtain customer satisfaction.
Reference: upon request