Supply Chain Engineer

Semiconductor, MeMS resume

P. Godavarti

Dr. PRASAD S. GODAVARTI

**** *. ********** *****

Gilbert, AZ 85297

**********@*****.***

480-***-**** (Home), 480-***-**** (Mobile)

OBJECTIVE A senior level operations, manufacturing or reliability position in semiconductor

processes, packaging and electronics reliability

TECHNICAL SKILLS IC Packaging for MEMS, Supply Chain Management Selection of

Hybrids and Electronic including Cost of Electronic Parts,

Parts Ownership and Logistics Materials and

Process for High-

Flip Chip, Wire Bond RoHS Compliant Printed

Reliability

and MEMS Packaging Circuit Board

Manufacturing. Assembly China

RoHS Implementation

and Test Manufacturing

OTHER SKILLS Project Management MS Office Supervision

Patent Development Team Leadership Lean and 6-sigma

EXPERIENCE Semiconductor Processes Motorola, FlipChip & 5 + years

Magusion

Identified, incubated and nurtured several semiconductor processes including metal

deposition, photo resist, solder bumping (Electrolytic, Electro less and direct paste

deposition)

Validated and introduced Known Good Die (KGD) wafer level burn-in process

validation

Developed low cost processing of wafer bumping

Semiconductor Packaging & Motorola, Magfusion, 8+ years

Test Orbital Sciences & InPlay

Investigated and nurtured novel, low cost packaging schemes including flip chip

technologies and wafer scale packaging suitable for hermetic packages

Generated Two Patents on MeMS Packaging

Developed Flip Chip attach processes

Conducted failure analysis on flip chip, Hybrids, BGA and QFN packages

Conducted stress deformation characterization RF MeMS packages

MIL-STD-1540 testing for piece part screening and product qualification and

acceptance

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P. Godavarti

EXPERIENCE (contd) Supply Chain Management Orbital Sciences, Magfusion, 7+ years

Honeywell & InPlay,

Identified suppliers and developed relationships for titanium hardware, space

structures, electronics packaging, contract manufacturing and new materials

Developed supply chain partners from US and China

Identified cost efficient solutions to logistics and shipping

Managed supplier quality audits and supplier qualification using ISO standards.

Developed RMA process for products designed in USA, manufactured in China and

shipped to Japan

Certified Green belt: 6-sigma and lean manufacturing

Program Management and Motorola, FlipChip, 6+ years

Supervision Magfusion, Orbital Sciences

& InPlay

Managed cross functional team of engineers and technologist to implement wafer-

level burn-in

Led Packaging Design, Manufacturing and Test and Implementation efforts in a

MEMS startup company

Led a large cross-function team of technologists and customers in the project

development phase for next generation automotive electronics using lead-free solders

Managed Test Engineering for high-rel pen-based computing products and switches

led a team of technologists to respond to issues of parts (electronic and mechanical),

manufacturing processes and materials on at least two major Missile Defense Agency

contracts.

Managed a $300K DoD project for advanced gas turbine engine materials

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P. Godavarti

WORK HISTORY 05/2007-03/2009 InPlay Technologies, Scottsdale, AZ, Manufacturing Manager

07/2007-05/2009 Honeywell Aerospace, Phoenix, AZ, Technologist

07/1987-07/1992

05/2006-07/2002 Orbital Sciences, Chandler, AZ, Sr. Principal Engineer

03/1993-09/1193

07/2002-10/2001 Magfusion, Chandler, AZ, Packaging and Test Manager

09/2001-10/2000 FlipChip Technologies, Phoenix, AZ, Sr. Technical Staff

09/1994-09/2001 Motorola, TX & Chandler, AZ, Principal Engineer

EDUCATION Professional

Project Management Diploma, Georgetown University, 2000

Doctorate

1979-1983 Ph.D. (Materials Science and Engineering), Northwestern University,

Evanston, Ill

Master of Technology

1977-1979 Indian Institute of Science, Bangalore, India

Bachelor of Technology

1972- 1977, Banaras Hindu University, India

AFFILIATION 08/2001 12/2008 SMTA Vice-President & President, Sonora Chapter

12/2001 - 12/2002 IMAPS, President, Phoenix Chapter

PATENTS Packaging of a micro-magnetic switch with a patterned permanent magnet, U.S. Patent

Number 7,250,838, July 2007

Micro-magnetic latching switch packaging, U.S. Patent Number 6,894,592, May 2005

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