RYAN GOHNERT
• 208-***-**** • ********@*****.***
Skills
Strong Knowledge of 3-D CAD programs (SolidWorks and Autodesk Inventor)
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Finite Element Analysis (ANSYS 13)
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Excellent communication skills (Technical papers and Sales experience)
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CNC Mill, lathe, and metal fabrication knowledge
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Creative and hard working
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Education
BS Mechanical Engineering: Brigham Young University- Idaho Graduated December 2012
Mechanical Engineering Experience
• Mentorship, industrial Finite Element Analysis project for ON Semiconductor.(See publications)
• Medieval trebuchet competition with ASME, team placed second
• Created an adaptor in Autodesk Inventor that converts metric pipes into standard American units
for Aquatherm Piping
Work experience
Lab Assistant: Brigham Young University-Idaho April 2011 to Dec 2012
• Instruct fellow students with solid model design strategies using SolidWorks and Autodesk
Inventor, and assisted with any question that they may have
Recruiter: HealthSource Global Staffing July 2009 to Feb 2011
Managed and coordinated the placement of over 100 labor related employees for a temporary
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assignment
Lead a team of recruiters through multiple hospital strike situations
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Never failed to achieve the ten day staffing deadline
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Project Administrator: PDAN: PD Naidoo & associates February 2007
Assistant to project manager on New International Airport
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Volunteer Service Rep: The Church of Jesus Christ of LDS Aug 2004 to Aug 2006
Publications
S. Hunter, R. Gohnert, “Simulation of Various Bond Pads in Unit Probing”, poster in Idaho
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Student Chapter booth, IMAPS International Symposium, San Diego, CA, Sep 2012
S. Hunter, R. Gohnert, A. J. Dutson, Naidu, D. S., “Finite Element Simulations of Stresses in
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CUP Bond Pads of Al-SiO2 Interconnect”, IEEE EPTC 2012, Singapore, Dec 2012
S. Hunter, R. Gohnert, R.L. Warnick, A. J. Dutson, “A Bond Pad’s View of Wirebonding”,
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IMAPS Wirebonding Workshop, San Jose, CA, Jan 2013