Mechanical Engineer Design
Resume:
Girard Sidone
Bordentown, NJ
Phone: 609-***-**** *******@*******.***
SUMMARY
Senior mechanical engineer with vast experience and progressively responsible positions in
engineering and product development with leading research and development companies.
Holder of several patents for sheet metal, plastic, and automated apparatus designs. Track
record for providing strategic and tactical solutions that delivered substantial cost savings and
productivity improvements. Exceptional strengths in mechanical design, leadership, problem-
solving, cost savings, and multi-tasking.
KEY SKILLS
Electro-Mechanical Packaging Design RF, EMC, & ESD Design Concepts
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Pro-Engineer Wildfire 2/3 modules, including 3D Structural and Thermal analysis solutions
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Advanced 3D Modeling & Surfacing, Sheet Metal Six Sigma Methodologies
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Design, Intralink, and PDMlink.
Plastic injection molding, sheet metal, extrusion, MIM, ANSI Y14.5 and Geometric Dimensioning
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and machined part designs and Tolerancing
Reliability testing and validation (e.g., shock and SMT PCBs, Flex Circuits, and
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vibration) Cable/Connector technologies.
Cradle-to-Grave product realization Familiarity with industry standards and
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specs, such as Mil-specs, EIA, ANSI,
Mechanical design of precision factory-automated test
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ASME, IEEE, IPC, IEC, Telcordia, NEBS,
fixtures and apparatus.
NEMA, ETSI, UL, PS&C, and FCC.
PROFESSIONAL EXPERIENCE
Motorola, Inc., South Plainfield, NJ January 2005 – April 2009
Senior Staff Mechanical Engineer
Lead mechanical engineer responsible for developing the design of Motorola's next generation
Smartphone product line. Responsibilities include all aspects of electro-mechanical packaging, report
and spec writing, sheet metal and plastics design, and addressing EMI/RFI/ESD challenges. Duties
also included the physical design of audio and antenna components, FEA analysis, the coordination of
the product testing process, and the determination of manufacturing materials. Tracked and
communicated technical issues to the cross-functional core and management teams while contributing
to the decision-making process to assure adherence to customer specifications and production
schedules.
• Directed an external design engineering team in Taiwan for the new sophisticated slider
Smartphone. It entailed taking the product from conception to production. This responsibility
required a vigilant review of the designs while continually implementing Motorola’s best practices
and Six Sigma Methodologies.
• Received a Motorola Bravo award for delivering a new low-profile battery connector design for the
China Mobile Smartphone ahead of schedule. This component helped enable this phone to be the
thinnest on the market.
• Managed a strict quality approval process throughout development. Responsible for weekly
updates to the core management team and the certified documentation for quality approval.
Exceeded goal deliverables to reduce the shipping authorization date by 30 days.
• First to introduce a flex circuit antenna system into a Smartphone product in Motorola by providing
the mechanical design of the antenna systems, audio packaging, grounding strategy, and various
housing components.
• Responsible for analyzing and solving Reliability Testing failures from the component level to the
physical housings to meet Motorola’s stringent reliability requirements.
Girard Sidone (continued) page 2
Mitec Wireless, Inc., Matawan, NJ 2003 – 2005
Senior Mechanical Engineer
Lead mechanical engineer for a global manufacturer of wireless telecom and satellite communications
equipment. Developed and designed complex thermal-sensitive electronics packaging for RF high
powered amplifiers used in wireless telecommunications equipment. Primarily responsible for all
aspects of mechanical packaging including, housing design, customer specification compliance,
costing, thermals, RF shielding, cabling, component layout verification, power, electrical & mechanical
engineering documentation packages.
• Solved micro-component extreme thermal challenges at the micro-component level by using the
latest heat sinking technologies.
• Directed cost reduction activities resulting in 30% savings for the Ericsson Base Station Power
Amplifier.
• Collaborated directly with the manufacturing manager by working on the factory floor during the
new-product-introduction phase to address assembly challenges from the chassis to the PCB
component levels.
• Was trusted to facilitate the Plant closing and transfer of data and equipment from the NJ site to
the corporate headquarters in Montreal.
Lucent Technologies, Inc., Holmdel, NJ 1994 – 2003
Member of Technical Staff
Specialized in sheet metal electro-mechanical packaging design of chassis and circuit pack hardware,
providing a common look-and-feel, and resolving new hardware challenges faced by
telecommunications companies. Reliability engineering team leader for the development of a
corporate-directed electro-mechanical packaging platform used across all business units.
• Engineered and patented plastic and metallic hardware packaging components that were used
across the diverse business units, including the Wireless, Optical Networking, Switching and
Access product units. Successfully addressed system challenges in metal sub-rack design,
cooling, EMI/ESD, RF, backplane interconnection, and circuit board layout.
Earned the Bell Labs’ President’s Award for the design of an exceptional method for bi-planar
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soldering of power transistors to a circuit board and heat sink. Exceptional product results helped
lead to a technology spin-off to a new company that developed state-of-the-art power amplifiers.
• Led a core team of multi-disciplinary engineers to develop and support a corporate hardware
architecture that defined all aspects of the equipment packaging. Successfully addressed the
requirements for the next generation of circuit board, backplane, interconnection, chassis, and
cabinet designs resulting in reduced time-to-market and total cost-of-goods, while producing a
cross-product common look-and-feel.
AT&T Manufacturing Development Center, Princeton, NJ 1985 to 1994
Member of Technical Staff I
Conceptualized and developed patented automated assembly, vision, and test systems used in
complex circuit board assembly, cable assembly, and test systems. Working manager responsible for
all aspects of a design services department's operations, including directing a professional staff of 6,
managing design, operational and project budgets, up to $2M per year.
• Transitioned AT&T’s research innovations into marketable designs.
• Designed multiple robotic actuators, system frame weldments, and electronic cabinet, for a novel
flexible robotic workstation used in assembly precision pick-and-place operations. Experienced
with pneumatics, precision motors, and drive systems. Working knowledge of PLCs and
controllers.
• Determined the sequence of production operations, and identified equipment, component, and
tooling requirements to ensure time and cost objectives were achieved.
Girard Sidone (continued) page 3
Lead design engineer on the development of an award-winning automated PCB fluxing system
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and its conveyor. This System became an environmental and industry success and flagship
product for the organization with sales of over $1M per year. The Product received Bell Labs’
President’s award.
Provided electronics packaging solutions for hazardous chemical, water-tight, and flammable
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environments for various systems developed within the organization.
Responsible for all aspects of a design services department's operations, including directing a
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professional staff of 6, managing design, operational and project budgets, up to $2M per year.
EDUCATION AND TRAINING
Six Sigma White Belt & Yellow Belt Target Costing
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Pro-Engineer Design, Sheet Metal, & Surfacing ISO 9000
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Design for Manufacturability ANSI Y14.5 and Geometric Dimensioning
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and Tolerancing
Design for Sheet Metal Manufacturability Supply Chain Core Competencies
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Design for Simplicity Proficient user of MS Office products
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Associates Degree, Mechanical Engineering Technology, Pittsburgh Technical Institute. Pittsburgh, PA
PATENTS & AWARDS
U.S. Patents Awards
Method for Shearing PCB Panels – Patent Bell Labs President’s Award, AT&T
#5,598,757
Apparatus and Fixture for Securing a Distinguished Alumni Award, Pittsburgh
Component Heat Sink – Patent #6,182,958 Technical Institute
Anti-Rotational ESD Ground Clip – Patent Nominated for Customer Satisfaction Award,
#6,267,607 AT&T
Apparatus and Method for Solder Attachment Nominated for Technical Achievement Award,
of High Powered Transistors to a Base AT&T
Heatsink, Patent #6,276,593
Latch for Electronic Faceplates – Patent Motorola Bravo Award for exceeding
#D498,467 deliverables on the Battery Connector Design
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