Engineer Manager
Resume:
Will Dunnavant
Lehi, UT *****
801-***-**** home
*************@***.***
(IMFT) Intel Micron Flash Technologies, Diffusion- “Acting” Engineering Shift
Lead--Process Engineer III, Jan 08- present- Location: Lehi, UT
Job Description: “Acting” Engineering Shift Lead for the current worldwide NAND
32nm Technology Leader. Provided quality process control and troubleshooting
maintenance for over 120 Diffusion toolsets. Area 300mm workstations included TEL
Indy, Quixace Kokusai and AMAT Vantage. Managed up to 3 shift engineers, 6
technicians, and 7 operators. Managed equipment performance/availability, cost control,
new product line introduction, application of statistical control, scheduled/unscheduled
downtime, constraints, product holds and disposition, SWR engineering tests,
engineering resource management and beyond. Supervised the Daily Area Meetings
between production, process, tool owners and shift engineering. Pulled utilization reports
and tool fault reports for area improvement teams. Created POs for various equipment
and part needs. Drove scheduled tool modification schedules with vendor/suppliers.
Served on the TEL/AMAT/POLY and NITRIDE Product Improvement and Preventative
Maintenance teams. Received personal recognition by Lead Tool Owner and Sustaining
Group Lead for increasing AMAT workstation availability due to excellent maintenance
supervision and area cost cutting improvements. During 2008 discovered two major
safety violations within the Diffusion area being a Phosphoric acid by-product issue and
an ISSG H2 toxic gas door open during experiment. Did fab safety walk thru's and
conducted training for various LOTO procedure plans. Created with IMFS (Singapore)
engineering preventable maintenance procedures and effectively trained all IMFS
personnel on 300mm RTP/ISSG Vantage tool and process control. Managed spare
hardware and consumables with technicians and tool owners on a weekly basis. Worked
with the following software programs: DOE, SPC, JMP, FDC and other statistical control
software. Saved IMFT upwards of 70-100K (easily covering my 1rst year annual
salary) in parts that did not have to be installed on the RTP toolsets; including
reflector plates, probes, support cylinders and edge rings.
Applied Materials, Field Service Engineer III, April 2000- Dec 2007
Locations: Applied Materials, Austin-Applied Materials, Santa Clara- LSI Logic,
Gresham, OR- Micron Technology, Manassas, VA- Intel Corporation, Colorado Springs-
Atmel Corporation, Colorado Springs- Intel Corporation, Rio Rancho, NM – Intel Micron
Flash Technologies, Lehi, UT.
Job Description: Lead/Ramp Specialist/Field Service Engineering expert who served
within various leadership, equipment and process engineering roles for over 8 years with
the largest semiconductor equipment manufacturer in the world (Applied Materials).
Generated weekly reports to summarize projects, tool uptime, usage, and other toolset
related issues. Various levels of technical diagnosis and experienced installation manager
on over 130 pieces of semiconductor equipment spanning 200mm and 300mm
technology nodes at two of the largest semiconductor customers in the world- Intel
Corporation and Micron Technology.
Ramp engineering experience on the following 300mm equipment: RTP Vantage,
Integrated Electro Copper Platers (iECP), CVD-Producer SA/PE/HARP and RTP
Radiance. 200mm related experience includes: RTP-Mod 1/TPCC/XE/Radiance & CVD-
Tungsten Dep-Etch. Over almost 10 years have helped develop and maintain training for
over 35-40 Intel/Micron technicians and process-field engineers. Successful install
management (almost single handedly) of over (18 tools) $40million dollars worth of
300mm Vantage RTP/ISSG equipment during the most aggressive ramp in
semiconductor history.
United States Marine Corps, Maintenance Supervisor, May 1996 – April 2000.
Locations: 29 Palms, CA- Camp Pendleton, CA.
Job Description: Supervised 10 armed Marines as Corporal of the Guard for a high
security risk ammunition depot at Marine Corps Base 29 Palms. Served as a Squad
Leader for 12 Marines at Electronics Maintenance Company of which I served as a
technical expert and quality control manager. Within this role, assisted Marine
technicians with difficult High Frequency Radio-Radar troubleshooting and validated that
repairs were completed to quality specifications. Managed, organized, tracked and
audited several million dollars worth of inventory items for our electronic maintenance
shop. Supervisory skills, technical ability, productivity and quality workmanship
frequently recognized by top leadership.
Education:
• M.B.A, Masters of Business Administration, University of Phoenix (2005)
• B.S.B.A, Bachelors of Science in Business Administration, University of
Phoenix (2003)
• A.S. in Electronics and Hardware Technology-Palomar Community College,
San Marcos, CA (I was one course shy of obtaining this degree due to hire on
at Applied Materials-had to leave California) (1999-2000)
• A.A., Associates of Arts- Florida Community College of Jacksonville (1993)
• Marine Corps Leadership Training (Certificates)
• Marine Corps Electronic Schools-Basic Electronics/VHF/UHF/HF/Ground
Radar-component level troubleshooting, 29 Palms California (14 months)
• 300mm/200mm platform/process training-Applied Materials, Santa
Clara/Austin (2000-2007)
• Applied Materials Training (Summary of course content upon request)
(2000-2007)
• Intel Corporation Training (Summary of course content upon request)
(2000-2006)
• Intel/Micron Technology Training (Summary of course content upon request)
(2008)
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