ANDREAS GEORGIADES ***** S. Cmo Guadal, Sahuarita, AZ 85629
*****************@*******.***
SUMMARY
Multidisciplinary Yield Enhancement and Efficiency expert in the semiconductor industry. Recognized for several
million dollars in cost savings and awarded technical ladder distinction. Philosophy is “supply the customer with as
good or better a product than the one guaranteed by the product data sheet, while maximizing the efficiencies along
the manufacturing chain”. Skills recruited by multidisciplinary groups for help with maximizing operation
efficiency.
Became member of Technical Staff within two years.
Saved on average $10M per year in manufacturing costs.
Prevented major customer interruptions by applying rapid correlations and root cause analysis.
Proactively initiated controls for stabilizing and maximizing yields across the board.
Fluent in English and Greek; speaking, reading, writing and cultural nuances.
Naturalized U.S. citizen since 9/23/2008.
EXPERIENCE
2002 – 2009
Texas Instruments, Tucson, AZ
Sr. Product Engineer 2007 - 2009
Led multidisciplinary teams (Fab, Test, Quality, FA, etc.) in project management. Main focus was cost
reduction, yield and <1DPPM customer issues.
Improved and stabilized Yields across the manufacturing chain resulting in millions of cost savings.
Worked with numerous international customers (Toshiba, Sony, Bosch, RIM, Samsung, etc.) rapidly
resolving line down situations which resulted in considerable cost savings (millions of dollars).
Rapid correlation of root causes using dataPOWER and other software tools and implementation of
solutions by applying process fixes in Wafer Fab, Laser Probe or Final Test.
Initiating Yield Enhancement alerts when a device’s yield (in Fab, Laser Probe or Final Test) would fall.
Depending on the fallout, various levels of alert would be initiated. Reports and action plans were
presented and put in place.
Took part in various teams (SPC, MRB, six sigma, 5S, new product qualifications, quality alerts, etc.)
In charge of qualifying process transfers from Foundries to TI Fabs.
Training and mentoring other engineers/technicians/operators/managers in data analysis/ project
management using various tools and methods.
Yield Enhancement Engineer (Product Engineer Wafer Fab) 2002 - 2007
Cost reduction by identifying Fab, Laser Probe and Final Test inefficiencies and correcting them.
Responsible for Yield Enhancement of over 500 ICC and CIC devices from the Burr Brown High Precision
Analog product line.
Responsible for Laser Probe Sustaining Eng. of over 100 CIC and ICC devices.
Process, Laser Probe and Final Test Yield integration.
Troubleshooting of Process issues that affect yields, quality, reliability.
Conversion of Legacy devices to the Eagle Tester system .
Gain Technology Corporation, Tucson, AZ 1997 - 2002
Gain Technology was acquired by Standard Microsystems (SMSC) in June 2002
Product Characterization Engineer
Responsible for characterizing MAXIM analog ICs from the inception of the design to the final test for
production.
Responsible for communicating to the customers with any inquiries about the products and implementing
them into systems.
Failure Analysis at the wafer level of unsuccessful Si revisions and implementation of Focused Ion Beam
(FIB) solutions.
Responsible for manuscript, data sheet and ECN meetings for MAXIM Linear ICs.
Implementation of test solutions for MAXIM products.
Statistical Analysis of Characterization Data and normalization of parameter test data into the final test
limits for production.
Design, layout and production of high speed and DC Evaluation PCBs.
Internal Quality Auditor for ISO9001 procedures.
Active Laser Trim and debugging of circuit on die or wafer using an Optical Laser Probe Station.
Design and simulation of active resistor ladder trim networks on die.
Database maintenance for all archived layouts and tape outs.
AC and DC Characterization of MAXIM high speed analog ICs.
Schematic capture and design of PCBs at discrete component level, prototyping and debugging of boards
for characterization, test or customer evaluation.
University of Arizona, Tucson, AZ 1995 - 1996
Tutor/Grader, ECE Department (01/96 - 12/96)
Center for Electronic Packaging Research (05/95 - 01/96)
Software package design of effective inductance and current distribution calculation inside multiconductor
thin film packages.
Cyprus National Army, Cyprus 1991 - 1993
Army Second Lieutenant, Anti-Tank Platoon Commander, 213th Infantry Unit
EDUCATION
University of Arizona, Tucson, Arizona
Bachelor of Science, Electrical Engineering
August 1993 - May 1996 GPA 3.5/4.0
Graduated in 6 semesters
Cadet Officers Army Academy, Heraklion, Crete
Certificate of Army Officer
July 1991 - August 1993
Higher Technical Institute, Nicosia, Cyprus
Diploma of Technician Engineer, Electrical Engineering
September 1988 - July 1991
AWARDS RECEIVED
- Texas Instruments: Top 10% job performer.
- Became a Make Member Technical Staff within 2 years of joining TI.
Various “Extra mile” and “Thank you” awards.
-
University of Arizona: Dean’s List with Distinction - Fall 93, Fall 94.
-
- Center for International Students and Scholars Scholarship
- Department of Education of Cyprus Republic Scholarship 1993-1996
- Cyprus Telecommunications Authority Award for Excellence in Senior Project