Post Job Free
Sign in

Manager Engineer

Location:
1585
Posted:
May 17, 2010

Contact this candidate

Resume:

G. WILLIAM TASKER

** ********* ****** **** . **** Brookfield, MA 01585

508-***-**** (home) . 508-***-**** (cell) . **************@*****.***

PRINCIPAL RELABILITY ENGINEER / MANAGER

Reliability Estimation . Mission Profile Validation . High-Performance

Products

Major strengths are broad materials science background, technical

leadership abilities, and team building and management talents with strong

analytical, problem solving and communication skills. Most recently,

acquired substantial expertise in reliability estimation for semiconductor

devices in demanding high-temperature, automotive applications. A creative

individual contributor and astute technical manager with 20+ years of

industrial experience in the fields of fiber-optics and photonics, vacuum-

electron devices, microelectromechanical systems (MEMS), and semiconductor

device reliability has published over 20 technical papers and been awarded

9 U.S. Patents.

[pic]

Multifaceted Materials Scientist . Use- and Knowledge-Based Reliability

Estimation . Failure Analysis of Materials . Semiconductor Device and

Package Reliability . Team Building and Management . Project Management .

Effective Communicator . Key Technical Asset at Customer Interface .

Results Driven [pic]

PROFESSIONAL EXPERIENCE

ALLEGRO MICROSYSTEMS, INC., Worcester, Massachusetts

Manufacturer of analog power integrated circuits (ICs) and mixed-signal

Hall-effect sensors

Principal Reliability Engineer

2003-2009

Provided technical leadership as individual contributor within Quality and

Reliability (QAR) group and often consulted with IC and Sensor Business

Units as well as Technology Development and Assembly and Packaging groups

on QAR problems. Acquired substantial knowledge of QAR issues associated

with front-end and back-end semiconductor manufacturing operations and

skill at troubleshooting.

Major Initiatives:

. Applied concepts of use- and knowledge-based qualification with relevant

physics-of-failure acceleration models to create a reliability estimator

spreadsheet that computes device reliability as perceived by the customer

for an arbitrary mission profile using standard qualification data as

input.

. Made key contributions to design and analysis of time dependent

dielectric breakdown (TDDB) experiments and constructed reliability

projections based on Weibull analysis of the TDDB data in a cross-

functional effort to address customer returns caused by gate oxide

failures.

. After review of the wire bonding literature, became leading authority at

Allegro on gold ball bond failure mechanisms including corrosion and

Kirkendall voiding within the Au-Al intermetallic phases.

. Responsible for assessing the reliability of new assembly methods for

packaging of current sensors.

Key Accomplishments:

. Evaluated reliability of Allegro's products with respect to a customer's

specific mission profile for all new demanding high-temperature,

automotive applications using reliability estimator spreadsheet. This

capability for validating reliable product use in a given mission profile

targeted prevention of future field failures and became an important tool

for Allegro when engaging potential customers.

. Provided quantitative measure of gate oxide reliability (ppm/year) based

on a projection from the extrinsic failure distribution as determined

from TDDB measurements. Using this approach, also constructed "burn-in"

maps showing necessary stress conditions to obtain requisite reliability

level.

. Acted as key technical consultant to cross-functional teams evaluating

suitability of new epoxy molding compounds for packages in commercial and

automotive applications with regard to ball bond integrity. Identified

causes and recommended fixes for various problems impacting bond

reliability.

. Established long-term reliability of solder attachment method in novel

flip-chip assembly for current sensors supporting initial customer

acceptance and a successful product family launch.

G. WILLIAM TASKER Page 2

[pic]

ZETA NETWORKS, INC., Cambridge, Massachusetts

MEMS-based optical component company no longer in existence

Director of Operations 2001-

2002

Founding member of management team for a MEMS start-up company targeting on-

chip integration of optical functions for intelligent optical networking

applications. Broadly contributed to strategic planning effort for new

business plan in areas of staffing, budget, product roadmap, market

analysis, and infrastructure for product development and manufacture.

. Prepared staffing and facilities plan, corporate budget, and detailed

development plan to achieve product roadmap.

. Responsible for marketing-related portions of new business plan including

analyses of market environment and direction, total addressable market,

customers, and competitors.

STANDARD MEMS, INC., Southbridge and Burlington, Massachusetts

MEMS foundry no longer in existence

Director, Microphotonics Group (MPG)

2000-2001

Provided leadership to MPG from inception. Set technical objectives and

organized internal developmental programs supporting large commercial

opportunities in the optical networking market. Managed MPG's intellectual

property portfolio.

. Established technology roadmap and managed developmental projects for

microfabricated components including micromirror actuator arrays with

application in 2-D and 3-D optical switches for next generation optical

networks.

. Prepared and executed staffing and facilities plan for location of

personnel, offices, and laboratories in Southbridge.

. Recruited multidisciplinary team and filled 5 senior staff positions in

areas of optical design and testing, MEMS design and fabrication, and

packaging.

. Initiated and coordinated substantial off-site developmental work by MPG

at the Cornell Nanofabrication Facility (CNF) at Cornell University

leading to demonstration of novel 2-D optical switch prototype.

. The MPG filed 7 invention disclosures and patent applications relating to

photonic MEMS components for optical switches and other applications in

optical networking.

CENTER FOR ADVANCED FIBEROPTIC APPLICATIONS (CAFA), Southbridge,

Massachusetts

Industry-led, non-profit consortium for the development of new products no

longer in existence

Section Head, Microelectromechanical Systems

1995-1999

Contributed to successful start-up of CAFA. Proposed, planned, and

implemented CAFA's initial activity in MEMS. Led 2 major business

development initiatives. Managed CAFA's patent portfolio.

. Generated $500K in Federal contracts for development of microfabricated

particle detectors and biomedical sensors for analytical instrumentation.

. Assisted in securing appropriations of $2.8M from the Commonwealth of

Massachusetts for first-phase equipping and staffing of CAFA's

laboratories.

. Identified and analyzed technology transfer, licensing, and new product

opportunities for member companies of CAFA in fiberoptic current sensors

and non-invasive health monitoring instrumentation.

. Planned facilities and staffing of a microfabrication laboratory at CAFA

for development of MEMS-based products.

G. WILLIAM TASKER Page 3

[pic]

GALILEO ELECTRO-OPTICS CORPORATION (GEOC), Sturbridge, Massachusetts

Manufacturer of fiber-optic components; name changed to NetOptix; purchased

by Corning, Inc. in 2000

Principal Investigator / Manager, Engineering / Senior Scientist

1986-1995

Initiated and directed corporate efforts to develop and implement new

processing methods and materials for manufacture of vacuum-electron

multipliers.

. Wrote technical proposal resulting in a $1.9M award to GEOC from the

Advanced Technology Program of the National Institute of Standards and

Technology (NIST-ATP) to investigate methods of microfabricating vacuum-

electron multipliers.

. Provided technical leadership and project management during the 26-month

NIST-ATP effort.

. Initiated, executed, and managed substantial off-site developmental work

by GEOC at the CNF at Cornell University in support of NIST-ATP effort

and earlier developmental activities.

. Demonstrated feasibility of microfabricating vacuum-electron multipliers

for both point and areal detection of charged particles by surface and

bulk micromachining methods.

. Developed substantial expertise in microfabrication of 2-D and 3-D

structures by various wet and dry anisotropic etching techniques,

conformal thin-film methods, and wafer bonding procedures.

. Created a strong, proprietary position for GEOC in microfabrication of

electron multipliers as inventor on 7 U.S. Patents covering devices and

methods.

. Working with Sales and Marketing, Manufacturing, and various Engineering

groups, successfully implemented a mechanism (Aggregate Project Planning)

for identifying projects with the greatest commercial potential and

assigning developmental resources accordingly.

. Organized and monitored GEOC-funded research at Drexel University on

thermochemical reduction kinetics of lead silicate glasses for

conventional vacuum-electron multipliers and at the Pennsylvania State

University on the chemistry and physics of glass surfaces.

AT&T BELL LABORATORIES, Murray Hill, New Jersey

Now part of Alcatel-Lucent

Associate Member of Technical Staff / Senior Technical Assistant

1972-1976

Designed and fabricated developmental multimode and single-mode optical

fibers for high-bandwidth communications systems.

Contributed to the development of the Modified Chemical Vapor Deposition

(MCVD) process for production of glass fiber waveguides.

Invented waveguide structure and manufacturing method for optical fibers

resulting in 2 U.S. Patents.

EDUCATION

Ph.D., Ceramics, Massachusetts Institute of Technology

Thesis: X-ray Photoelectron Spectroscopy of Silicate Glasses

B.Sc., Ceramic Science, Pennsylvania State University

TECHNICAL CAPABILITIES

COLLATERAL AREAS OF EXPERTISE: Physics and Chemistry of Surfaces and

Interfaces, Structure-Property Relationships in Materials, Surface

Analytical Methods, Microfabrication Technologies and MEMS, and Fiber-Optic

Technology

SOFTWARE: Microsoft Office and Project, Reliasoft Weibull++, PTC Mathcad,

and Chemex Vision Lite



Contact this candidate