Engineer Engineering

Prasit Sricharoenchaikit, Ph.D.

* ***** ****** ****

Westborough, MA 01581

Home phone: 508-***-****

Cell phone: 508-***-****

email: *******@*******.***

Summary

Over 25 years of R & D, Process Development and Manufacturing experiences

in the Integrated Circuit & Semiconductor, Specialty Chemical, Active

Matrix Liquid Crystal Display [AMLCD] Industries, Photovoltaic Industry

(Solar Cell) and Waste Treatments. Successfully developed new technology

of metallization for microelectronic industry. Strong technical

background with excellent problem solving skills in electroplating &

electroless-plating, imaging, photolithography, AMLCD manufacturing, wet

chemical processing, etching chemistries and waste treatments. Developed

experimental designs including statistical analyses for process development

and optimization. Strong academic background in colloid & surface

chemistry, wet chemical processing, photolithography, environmental

engineering and chemistry. Proven troubleshooting and problem solving

skills. Excellent project management skills. Fast learner, result-

oriented, self-motivated, good managerial skill, excellent communication

skill and record of achieving results (24 publications, 6 US patents, one

pending and 5 foreign patents).

Experiences

1366 Technologies, Inc, Lexington, MA 08/09 -

01/10

Senior Photovoltaics Engineer

. Developed & Optimized Si etching process for texturing both mono and

multi-crystal.

. Developed resist process for solar cell manufacturing.

. Optimized imprinting process for solar cell manufacturing.

. Developed metal-assisted Si <100> etching process.

. Developed Silica slip casting process.

M/A-COM Technology Solutions, Burlington, MA 3/97-4/09

Principal Engineer

. Developed an entire process for solder bump (Patent pending) for Wafer-

Level Chip Scale Packaging (W-L CSP) and Bumping for High Density Flip

Chip (HD FC) for Si and GaAs devices. This process built solder bumps on

M/A-COM's products which bring in revenues of $ 7-10 million.

. Design of Experiment (DOE)

. SPC for chemical processes used in semiconductor fab.

. Developed copper plating for Damascene process.

. Developed silver plating process for microwave integrated circuit.

. Developed gold plating process for microwave integrated circuit.

. Optimized Orientation Dependent Etching (ODE) process of Si <100> wafers.

. Optimized Buffer Oxide Etch (BOE) processes for etching oxide wafers.

. Optimized Plasma Etching Process (Down Stream Oxygen Plasma).

. Optimized Resist Removal Process using chemical stripper.

. Developed several etching processes for different metals using wet

chemistry.

. Troubleshoot problems (e.g., photolithography, wet chemistry and

processing issues) of integrated circuit (IC) production in the fab.

. Other responsibilities include photolithography, wet chemical processing

and integrated circuit fabrication processes.

. Environmental Health & Safety Consultant.

Kopin Corporation, Westborough, MA 2/95-3/97

Senior LCD Process Engineer

Directed manufacturing of high resolution Active Matrix Liquid Crystal

Display [AMLCD]. Responsibilities also include R&D, Process Development,

Failure Analysis and Trouble Shooting of AMLCD manufacturing process.

Specific achievements are as follows:

. Improved AMLCD productivity through new design of spacer dispensing

equipment.

. Identifying the course of defects through thorough failure analysis.

. AMLCD process optimization using experimental design.

. Managed a production of micro AMLCD.

Aspen System, Inc., Marlborough, MA 9/94-

2/95

Senior R&D Scientist

Conducted advanced research in new product and process development of thin

film (Pd, Cu) deposition using electroless-plating and written proposal for

contract research.

Shipley Company (Two Capacities), Marlborough, MA 11/84-8/94

a) Process Engineer (9/92-8/94)

Directed manufacturing of photoresist and developers. Have achievements in

areas of process development, troubleshooting, and process optimization of

photolithography and plating processes.

. Improved manufacturing yield 20% by implementing on-line technical

assistance.

. Reduced manufacturing cost $100k annually by developing improved cleaning

process.

b) R & D Scientist (11/84-9/92)

Solid scientific and engineering background with strong technical expertise

in electroplating & electroless-plating, imaging, photolithography and wet

chemical processing. Developed state-of-art technology in metallization.

. Invented technology that produces selective metallization at sub-half

micron

level. This requires a unique combination of plating and

photolithography

technology. This achievement resulted in 10 patents and 5 publications.

. Solved stability problems in plating through-hole critical to generating

$5M in

revenue per year.

. Developed ion exchange technology for treating rinse waste from plating

industry.

. Made significant process improvement resulting in a competitive edge in

the market.

. Selected as peer reviewer for several professional journals because of

strong technical strength.

. Managed a group with engineers under my supervision.

R.E. Dietz Company, Syracuse, NY 8/84-11/84

Senior Process Engineer

Managed the entire plating (Cu, Ni and Cr) operations. Provided technical

support and direction to the manufacturing group.

. Improved manufacturing control by establishing an in-house quality

control lab.

. Improved product yields by using analytical and problem solving skills.

Virginia State University, Petersburg, VA 1976-

1977

Chemistry Lab Instructor

. Chemistry lab instructor for undergraduate students.

Bangkok Plating Center, Bangkok, Thailand 1974-1976

Chemical Engineer

. Supervised the entire plant operation.

. Design and implemented racking system for plating process, resulting in

higher yield.

Education

. AFS Exchange Student (American Field Service International Scholarships)

. B.Eng. (Chemical Engineering), Chulalongkorn University, Bangkok,

Thailand.

. M.S. (Chemistry), Virginia State University, Petersburg, Virginia

. Ph.D. (Civil/Environmental Engineering), Syracuse University,

Syracuse, New York

Member: American Chemical Society

American Electroplating Society and Finishing Society

Former member of publication board: Plating and Surface

Finishing

Served as Peer Reviewer in Following Professional Journals:

. Journal of Environmental Science and Technology.

. Journal of Electrochemical Society

. IEEE Transactions on Components, Hybrids & Manufacturing Technology

(IEEE Trans. CHMT).

. Canadian Journal of Chemical Engineering (CJChE)

Honors:

. Studied as an Exchange Student in the USA Under the Auspices of

American Field Service International Scholarships (AFS).

. Served as an Honorary Guest Lecturer at Department of Environmental

Engineering, Khon Kaen University, Khon Kaen, Thailand, July 26, 2006.

. Received Best Poster Session, M/A-COM's 2007 Engineering Conference.

Publications

1) Letterman, R.D., Vanderbrook, F.C., and Sricharoenchaikit, P.,

"Significant of Electrophoretic Mobility Measurements in Coagulation with

Aluminum Salt", J. American Water Work Association, 74:1:44 (Jan. 1982).

2) Letterman, R.D., and Sricharoenchaikit, P., "Interaction of Hydrolyzable

Metal and Cationic Polyelectrolyte Coagulants", Proc. Annual Conference of

American Water Works Association, St. Louise, June 1982, also in J.

Environmental Engineering Division, ASCE, 108:EE5:883 (Oct. 1982).

3) Sricharoenchaikit, P., and Letterman, R.D., "Effect of Al (III) and

Sulfate Ion on Flocculation Kinetics", J. The Environmental Engineering

Division, ASCE, 113:5:1120 (Oct. 1987).

4) Sricharoenchaikit, P., "Ion Exchange Treatment for Electroless Copper-

EDTA Rinse Waste", Plating and Surface Finishing, 76, (12), 68 (Dec. 1989).

5) Calabrese, G.S. Abali, L.N. and Sricharoenchaikit, P., "Micrometallized

Photoresist for Semiconductor Lithography", Shipley Poster Session, SPIE.

San Jose, CA, March 4-9, 1990.

6) Abali, L.N., Bobbio, S.M., Bohland, J.F., Calabrese, G.S., Gulla, M.,

Pavelchek, E.K., and Sricharoenchaikit, P., "Metallized Photoresist, A New

Approach to Surface Imaging", Proc.. Microcircuit Engineering,

International Conference on Microlithography, Leuven, Belgium, Sept. 18-20,

1990, also in Microelectronic Engineering, vol. 13, 93 (1991).

7) Calabrese, G.S. Abali, L.N., Bohland, J.F.,Pavelchek, E.K.,

Sricharoenchaikit, P.,Vizary, G.,Bobbio, S.M., and Smith, P., "Novel

Surface Imaging Masking Technique for High Aspect Ratio Dry Etching

Application", Proc.. SPIE, vol. 1466, 528, Advanced in Resist Technology

and Processing VIII, San Jose, CA, March 4-5, 1991.

8) Calvert, J.M., Dulcey, C.S. Peckerar, M.C., Schnur, J.M., Georger, J.H.,

Calabrese, G.S., and Sricharoenchaikit, P., "New Surface Imaging Techniques

for Sub-0.5 Micrometer Optical Lithography", Solid State Technology, 34

(10), 77 (Oct. 1991).

9) Sricharoenchaikit, P., "The Effect of Pre-etch Solvent Treatment on

Electroless Plating of Polycarbonate", Plating and Surface Finishing, 78

(11), 66 (Nov. 1991)

10) Sricharoenchaikit, P., "Waste Treatment for Electroplating Operation",

Proceeding of the 2nd. International Workshop on Advanced Science and

Technology Transfer to Thailand, 459-485, ISBN 974-7055-03-1, August 21-23,

1992.

11) Sricharoenchaikit, P., "Thin Metal Film Formation Using Electroless

Plating", J. Electrochemical Society, 140 (7), 1917 (July 1993).

12) Sricharoenchaikit, P., Dixon, T., Williams, A., and Chinoy, P.,

"Optimization of Gold Electro-Plating Process Using Design of Experiments",

M/A-COM's Eleventh Annual Engineering Conference, Oct 14-17, 1997, Hyannis,

Massachusetts.

13) Sricharoenchaikit, P., "Coagulation & Flocculation Processes",

Proceeding of the Workshop on Treatment of Color and COD Treatment in

Wastewater, Environmental Research Institute, Chulalongkorn University,

Thailand, May 24-28, 1999.

14) Sricharoenchaikit, P., "Effect of Current Density on Profile of Narrow

Metal Line Width Using Pulse Gold Electroplating", Plating and Surface

Finishing, 86, (10), 66 (Oct. 1999).

15) Sricharoenchaikit, P., and Stevens, R., "Effect of alcohol type and KOH

concentration on Orientation Dependent Etching", M/A-COM's 14th Annual

Engineering Conference, Oct 10-13, 2000, Mt. Snow, Vermont.

16) Sricharoenchaikit, P., "M/A-COM is Getting Ready For Advanced Packaging

Arena", M/A-COM's 16th Annual Engineering Conference, Oct 20-23, 2002,

Springfield, Massachusetts.

17) Sricharoenchaikit, P., "Building Solder Bumps on GaAs Flip Chip

Schottky Devices", International Conference on Compound Semiconductor

Manufacturing Technology, 2003 GaAsMANTECH Conference, May 19-22, 2003,

Scottsdale, Arizona.

18) Sricharoenchaikit, P., "Modeling of Electroless Plating Mechanism",

2003 M/A-COM's Annual Engineering Conference, Oct 20-23, 2003, Portland,

Maine.

19) Sricharoenchaikit, P., "Cost Saving for Resist Removal Using Chemical &

Dry Etch", 2005 M/A-COM's Annual Engineering Conference, April 10-13, 2005,

Taunton, Massachusetts.

20) Sricharoenchaikit, P., "Electronics Materials and Waste Management",

International Conference on Hazardous Waste Management for a Sustainable

Future, January 10-12, 2006, Bangkok, Thailand.

21) Sricharoenchaikit, P., "Simple and Inexpensive Solder Bump Process for

AlGaAs PIN Diodes", 2006 M/A-COM's Annual Engineering Conference, April 9-

12, 2006, Taunton, Massachusetts.

22) Sricharoenchaikit, P., "Situation, Direction and Management of

Electronic Wastes", Electronic Waste Conference, July 24-25, 2006, King

Mongkut's Institute of Technology Ladkrabang, Bangkok, Thailand.

23) Sricharoenchaikit, P., "WEEE, RoHS, REACH and M/A-COM", 2007 M/A-COM's

Annual Engineering Conference, April 29-May 2, 2007, Mount Washington

Resort, New Hampshire. Note: I received The DFT's Award for Best Poster

Session.

24) Sricharoenchaikit, P., "Elimination of Pyramid Formation in Orientation

Dependent Etching (ODE)", 2008 M/A-COM's Annual Engineering Conference,

April 27-30, 2008, Mount Washington Resort at Bretton Woods, New

Hampshire.

Patents

Gulla, M., and Sricharoenchaikit, P., "Plasma Processing with Metal Mask

Integration",

a) European Patent Application, Publication No. 0397 988 A2 (Nov.

22,

1990)

b) U.S. Patent No. 5,053,318 (Oct. 1, 1991)

c) Taiwan Patent Office, Patent No. 051187 (Jan. 14, 1992)

Gulla, M., and Sricharoenchaikit, P., "Novel Metal Accelerator",

a) European Patent Application No. 0 456 982 A1 (Nov. 21, 1991)

b) U.S. Patent No. 5,213,841 (May 25, 1993)

Gulla, M., and Sricharoenchaikit, P., "Selective Metallization Process",

a) European Patent Application, Publication No. 91114755.1 (Sept.

2, 1991)

b) U.S. Patent No. 5.158,860 (Oct. 27, 1992)

Sricharoenchaikit, P., Calabrese, G.S., and Gulla, M., "Controlled

Electroless Plating",

a) European Patent Application, Publication No. 0 525282 A2 (Feb.

18,

1992)

b) U.S. Patent No. 5,203,911 (Apr. 20, 1993)

Gulla, M., and Sricharoenchaikit, P., "Plasma Processing with Metal Mask

Integration",

a) U.S. Patent No. 5,213,917 (May 25, 1993)

Sricharoenchaikit, P., "System and Method for Solder Bump Plating", Patent

Application Number 11/602,736 (submitted to Patent Office on Nov. 21,

2006).

Sricharoenchaikit, P., "Procedure for a Reduction of Number of Voids in

Solder Bumps" submitted for approval at M/A-COM Technology Solutions,

Lowell, MA, March 2009, for a patent application.

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