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Engineer Project Manager

Location:
Mckinney, TX, 75069
Posted:
June 02, 2010

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Resume:

Kwame Boahen, MBA, PhD

Product Engineer

*** *********** ***, ******** ** 75069

469-***-****

*****.******@*****.***

http://www.linkedin.com/in/kwameboahen

Summary

Field applications and product engineer with expertise in product

development and product qualification, and experience interfacing with

customers, field service, marketing and field sales in support of

semiconductor manufacturing to bring new products to market in timely

manner.

Experience Summary

. Product Development

. New Product Qualification

. New Product Release

. Technical Data Sheet

. Technical Parameter Specifications

. Quality Assurance

. Product / Market Positioning

. Competitive Analysis

. Competitive Benchmarking

. Packaging Manufacturing

. Semiconductor Wafer Fab

. Product Characterization

. Product Testing

. Engineering Lab Testing

. Product Benchmark

. Mass Production Ramp

. Test Equipment Recommendation

. Product Requalification

. Yield Improvement

. Market / Product Trend

. Return On Investment (ROI)

. New Product Business Analyses (NPBA)

. Gross Profit Margin (GPM)

Technical Skills Summary

. Oracle

. Spotfire

. SQL

. Access

. MS Office

. MS Project

. C/C++ Programming

. Windows

. UNIX

Accomplishment Summary

. Prevented 25% loss in revenue by isolating and solving quality issues.

. Saved Texas Instruments $12M through SEM based in-line defect inspection.

. Improved yield by 20% through defect reduction.

. Reduced scrap wafer cost by $4M dollars annually through electrical

parametric testing.

Experience

Celerity, Inc 2007 -

2009

Semiconductor Process Equipment Components Manufacturer Inc

Allen TX

Senior Product Engineer / Project Manager

. Prevented 25% loss in revenue by isolating and solving field quality

issues at Samsung.

. Increased revenue by 15 percent by adding 2 new products to product

portfolio by completely characterizing products and transferring to

manufacturing.

. Reduced product test cycle time from 8 weeks to 1 week by building

moisture analysis station using design of experiments (DOE) skills.

. Received Samsung quality Award for diligence in solving quality issues.

KLA-Tencor 2000 - 2007

Semiconductor Yield Enhancement Equipments Manufacturer Richardson TX

Staff Applications Engineer, supporting Texas Instruments (2005 - 2007)

. Generated $42M in revenue by successfully managing product adoption

projects to fulfill customer return on investment (ROI) and gross

profit margin (GPM) requirements.

. Held 100% market share for SEM based inspection tools through market

understanding and strong product positioning combined with effective

communication with customers.

. Met deadline for 45nm technology qualification by installing and

qualifying latest version of bright field (28xx) inspection tool ahead

of schedule.

. Received General Manager's Award for effective team work.

Senior Applications Engineer, supporting Texas Instruments (2003 - 2005)

. Saved Texas Instruments $12M annually by improving process and

enhancing yield through SEM based in-line inspection strategies.

. Increased yield baseline by 20% by identifying process layers suitable

for SEM based in-line defect inspection strategy based on device

performance requirements.

. Beat deadline to qualify 65nm technology by detecting and stopping NiSi

yield limiting pipe defects using SEM based inspection strategies and

design of experiments (DOE).

. Generated new product ideas and opportunities leading to 3 generations

of SEM based inspection tools one of which won SEMICON "Best Solution

to a Problem Award".

Field Applications Engineer, supporting Texas Instruments (2000 - 2003)

. Integrated SEM based inspection in-line successfully for the first time

in semiconductor processing by solving throughput / cycle time, tool

stability and device integrity issues.

. Achieved a 20% tool performance improvement for inspection tools by

developing tool health monitoring program and applying Statistical

Control Chart (SPC) analysis.

. Reduced scrap wafer cost by $4M annually by establishing through

electrical testing that SEM based inspection is harmless to

semiconductor device performance.

. Doubled SEM based inspection tool capacity by developing efficient

sample planner based on process cycle time, tool throughput limitations

and optimum inspected area.

Chemical Abstracts Service 1999 - 2000

Scientific and Engineering Information Database Company

Columbus OH

Scientific Information Analyst

. Won employee of the month twice by consistently meeting quality and

productivity targets through good teaming and organizational skills.

Work Experience Prior to 1999 1988 - 1999

. Teaching/Research Assistant, State University of New York, Stony Brook NY

(1996 - 1999)

. Assistant Lecturer, University of Science and Technology, Kumasi Ghana

(1994 - 1996)

. CIDA Research Fellow, McMaster University, Hamilton, ON Canada (1991 -

1994)

. Lady Davis Research Fellow, Technion-Israel Inst. of Technology, Haifa,

Israel (1988- 1991)

Education

. PhD Materials Science and Engineering, State University of New York,

Stony Brook NY

. MBA Project Management, Keller Graduate School of Management, Plano TX

. MS Materials Science, Technion - Israel Institute of Technology, Haifa

Israel

. BS Physics, University of Science and Technology, Kumasi Ghana

Selected Publications

1. Effect of E-Beam on Logic Device in Advanced Process Fab, SPIE, 4689,

593 - 603.

2. E-Beam Line Monitoring in 300mm Copper Fab, Semiconductor Inter., 26,

no. 8, 80 - 90.

3. Properties of DSC Lattices at CSL Related Triple Junctions, Scripta

Mater. 43 (2), 175 - 179.

4. Grain Boundary Curvature in Polycrystalline Metallic Thin Films, MRS

Symp. Proc. 615

5. TEM Study of Yielding in Polycrystalline Thin Films, MRS Symp. Proc.

505, 383 - 388.

6. Early Stages of Plastic Yielding in Polycrystalline Thin Films, Acta

Meter. 49(2), 237 - 247.

7. Analysis of Grain Boundary Misorientation Distribution in Gold Thin

Films from Minimal Data, Scripta Materialia, 42, 301 - 306.

8. Triple Junction Engineering: The Distribution of CSL Triple Junctions in

Polycrystalline Gold Thin Films, Materials Research Society Symposium

Proceedings, 586, 117 - 122.



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