Mechanical Engineer Manager
Resume:
Aleksander Owczarz, MSME, MBA/MPM
*********@*********.***
Experienced Design and Manufacturing Mechanical Engineer
Over 10 years experience in semiconductor equipment design, manufacturing
and engineering, support of technology development. Recognized for
creativity, successful problem solving and integrity. 66 US patents
awarded.
? Passion for creative hardware design ?
Excited about problem solving & "hands on tasks"
? Extensive knowledge of manufacturing and materials ? Participated
in various technology developments
? Designed rotary and linear DC drives ?
Extensive knowledge of various sensors
? Design Teflon valves, pumps, tanks, fittings ?
Creative and effective cost reduction
? Designed electric and pneumatic actuators ? 10
yrs of Mechanical Engineering management
Professional Experience
Manufacturing Engineering:
? Delivered first 5 machines of preproduction run. Release hardware
documentation of Chemical Mechanical
Planarization (CMP) wafer processing machine with continuous
sustaining support. Created assembly process
procedures. Prepared plan for testing and critical dimension control
for Quality Assurance. Prepared spare parts plan
for Customer Support Group. Managed $2.5M procurement. "Hands on"
participation in assembly process.
On side engineering and "hands on" support of equipment
installation.
? Teflon compression molding. .Designed tooling for compressing/baking
process of Teflon powder into various
cylindrical shapes used in manufacturing of chemical process
chambers for wafer processing.
? New Product Introduction. Participated in all stages from design to
installation for equipment like:
CMP, acid &solvent wafer processors, wafer box &carrier cleaning
machine, chemical delivery/blending systems.
? Cost reduction and redesigning for manufacturability. Reduced cost by
20% from $660 K to $525 K by
redesigned 3 process modules for new CMP wafer processing machine
? Manufacturing method of thin plastic ( PEEK) discs. No vendors could
deliver 12" diameter disc made from
PEEK with .005" flatness below .25" thickness. Developed with
suppliers of material and double disc grinding
company manufacturing method to make discs .090" thick within
flatness specification
? Manufacturing method of electrical contacts. Developed the way to
manufacture electrical contacts with platinum
tips and integrated nitrogen purge system used in wafer plating
process. I developed this process to implement my
design for experimental wafer plating module.
? Tooling design. Designed heat shrink dies for cold
extrusion/compression of steel parts on orbital presses. Designed
various tooling to manufacture plastic and metal parts by
mechanical and hydro forming, machining, welding, dies
for punch presses and assembly processes. Designed "GO no GO"
gauges.
? Bio-cell electrofusion. Designed fixtures to manufacture wire/plastic
ultrasound welded fusion chambers.
? Medical Radiographic Equipment. Implemented magnesium castings and
bonded aluminum extrusions.
? Understanding manufacturing processes like plastic& metal extrusion,
thermal/vacuum plastic forming,
injection & compression molding, sand and die casting, sheet metal,
machining, drawing, punching, welding, EPDM
Machine Design:
? Designed plating development module for continuous partial copper
electroplating. Designed synchronized motion
of wafer during plating as function of current density. Designed
special automated electric contacts with
programmable selection. Developed electric contacts with gas
blanket. Designed integrate chemical delivery system.
? Solved machine delivery problem. Customer accepted shipment under
condition of field retrofit of the machine
with water droplets detection system on the wafer after cleaning
process. Commercial solutions where not acceptable
because no possibilities of integration with process chamber and
excessive cost. Developed machine vision system
with custom designed LED light source, which was successfully
implemented in customer location.
? Designed subassemblies for CMP machine like 60" diameter process
head turning table, belt conditioner,
slurry delivery system. Developed jointly with supplier 7kW
inverted DC motor to drive polishing belt
? Technology development support. Led matrix team to determine
possibilities to merge Fixed Abrasive and Linear
Planarization technologies on CMP platform. Development module with
web handling/converting system for
.005" thick Fixed Abrasive tape was built and tests were performed
Aleksander Owczarz, 408
307 0510 page 2
? Designed acid tool for flat panel batch process. Designed 32"
diameter Teflon process chamber. This project
required designing of Teflon components like fittings and pneumatic
valves with 1.5" diameter orifices.
At that time maximum .5" diameter Teflon tubing, valves and fittings
where available.
? Designed Teflon bellow metering pump with accuracy +/-2%. At that
time pumps where available with +/- 5%
? Designed first on the market microwave/convection drying oven. 10
cubic feet sheet metal structure
? Designed water jacked CO2 incubator for bacteria cultures. 70 cubic
feet sheet metal structure
? Designed bath and platform orbital shakers
Project and team management:
? Solved budgetary, schedule problem of $300 K project. Project
required 5 chemical dilution systems with
challenging specifications. Established suppliers could deliver
only 2 units in provided budget with not acceptable
schedule. Worked out successful plan together with market
challenger and helped supplier in critical areas.
? Saved underperforming $ 250 K project. Joint development with supplier
of gate valves for metal deposition
chambers required concept change. Project was put back on the
schedule by helping supplier in critical areas.
? Managed matrix teams with software and control engineers from other
functional groups. Different projects required
different set of skills. Designed-developed supplementary process
modules for etch tools and technology development
for wafer cleaning/wet processing and electrochemical / electro less
deposition.
? Managed mechanical staff of 25 to develop CMP ( Chemical Mechanical
Planarization) machine known as TERES
on bases of Linear Planarization. Interaction with electrical/control
and software groups. Individual design contributor
for critical assemblies
Employment history
Consultant, San Jose, California. 2009 - present
LAM Research, Fremont, California. 1997 - 2009
Manufacturer of semiconductor capital equipment for wafer processing
? Product Engineering Manager. 2001 - 2009
? Mechanical Engineering Manager. 1997 - 2001
SEMITOOL, Kalispell, Montana . (purchased by Applied Materials). 1985 -
1997
Manufacturer of semiconductor equipment for wafer surface preparation and
plating
? Mechanical Engineering Manager. 1992 - 1997
? Senior Mechanical Engineer. 1985 -1992
PRECISION SCIENTIFIC/ GCA, Chicago, Illinois
Manufacturer of bio laboratory equipment
? Mechanical Engineer
H.G FISHER INC., Franklin Park, Illinois
Manufacturer of medical radiology equipment
? Mechanical Engineer
FACTORY OF LIGHT AIRPLANES- PZL, Warsaw, Poland
?Tool Design Engineer
Education/ Professional Development
MBA/MPM:
Keller School of Business, Fremont, California
Masters of Science, Mechanical Engineering: Warsaw Polytechnic
University, Warsaw, Poland
? Tools: PRO-E/Wildfire, Windows, Excel, Power
Point.
? Seminars: wafer cleaning, electro & electro less
depositions, plasma etch, wafer linear planarization.
? Training in LAM : problem solving, design of experiments, leadership,
PP technical presentations, safety, hiring
/interviewing, core values .
? Awards: received Core Values Award from LAM for
involvement in community educational system.
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