Mechanical Engineer Engineering

Shreyas Govindraj Bindiganavale

***, *** ****, *** ***, Arlington, Texas - 76010 ● ***********@*****.*** ● (732) 890 - 4560

A highly accomplished, multifaceted and creative Mechanical Engineer with experience in

successful heat transfer enhancement using advanced cooling technologies.

AREAS OF EXPERTISE

Electronics

cooling in Finite Element Liquid Crystal

I cepak A nalysis T hermography

AutoCAD,

SolidWorks, MEMS ANSYS Classic &

P ro/E m icrofabrication Workbench

Data

acquisition in Digital Presentations &

L abVIEW m icrofluidics p ublications

SUMMARY OF QUALIFICATIONS

B.E. and

M .S. degrees in M echanical Engineering w ith exposure to special topics like MEMS, electronic

packaging & micro/nanofluidics

Designed, fabricated and tested d igital microfluidic devices for e lectronics cooling applications

Implemented L iquid Crystal Thermography, an innovative method of temperature

measurement using liquid crystals

Proven CAD /CAE skills with projects on A utoCAD, SolidWorks, Pro/E, ANSYS and A NSYS

I cepak

Hands - on experience with M E MS microfabrication p rocesses like spin casting, li thography,

developing, etching and metal deposition in class - 100 clean room environment

EXPERIENCE

Research Assistant Jan 2009 to Dec 2009

Integrated Micro & Nanofluidic Systems Lab

University of Texas, Arlington (UTA)

Key responsibili ties included design and fabrication of micro scale cooling devices using MEMS

m icrofabrication equipment at N anotechnology Research and Teaching Facility (NanoFAB),

U TA

Extensive design development, device fabrication and testing resulted in successful demonstration

of hotspot cooling w ith i onic liquids using d igital microfluidics

Devised L iquid Crystal Thermography to measure temperature using data acquisition and image

p rocessing techniques in L abV IEW and M ATLAB

Teaching Assistant / Student Associate Feb 2008 to Jan 2009

I ntegrated Micro & Nanofluidic Systems Lab

University of Texas, Arlington

Was instrumental in studying the effects of AC voltage on the electrowetting of ionic

l iquids and its advantages over DC voltage, using a goniometer

ACCOMPLISHMENTS

Delivered a technical presentation titled “ Electrowetting on dielectric (EWOD) Digital

M icrofluidics for Electronics Hotspot Cooling”, at The 4th Colloquium on Heat T ransfer

E nhancement in M icrofluidics, University of Texas at Arlington, for which the quality of the

work was highly appreciated

Following the success of the device for hotspot cooling, a patent w as filed titled, “ Method,

Apparatus and Compositions for Digital M icrofluidic Electronics Cooling”

Actively contributed as a co-author in “ Digital Microfluidic Device using Ionic Liquids for

E lectronic Hotspot Cooling”, a conference paper for the Proceedings of the 7 th I nternational ASME

Conference on Nanochannels, M icrochannels and M inichannels, ICN M M2009

PROMINENT PROJECTS

“Thermal Simulation of Multicore Processors”

• Designed int ricate models of the heat sink, die and substrate of the I ntel Core 2 Duo and

Q uad processors, according to the data sheets, and assembled them using SolidWorks and

P ro/ENG INEER

• Used ANSYS Workbench to perform a detailed thermal analysis on the assembled parts

a nd estimated the surface temperature of the die based on different boundary conditions

“Data Center Simulation using ANSYS Icepak”

• Designed Computer Room Air Conditioner (CRAC), racks, grilles and plenum of a data

center model

• M inimized global temperature by optimizing the plenum height and ceiling depth

using ANSYS Icepak

“Modification of Bogie Structure of a Reheating Furnace for Increased Performance”

• On-site industrial project which involved design suggestions to reduce the heat

losses from the furnace

• Used modeling tools in AutoCAD and SolidWorks and optimized design using

C OSMOSXpress & COSMOSFloWorks

EDUCATION

M aster of Science in Mechanical Engineering Dec 2009

University of Texas at Arlington, Arlington, Texas, USA

Bachelor of Engineering in Mechanical Engineering May 2007

Osmania University, Hyderabad, I ndia

RELEVANT COURSEWORK

Finite Element Method ● I nt roduction to ME MS ● F undamentals in Electronic Packaging ● C hip

Scale Packaging ● T hermodynamics ● F luid Dynamics ● CAD/CAM ● H eat T ransfer

TECHNICAL SKILLS

AutoCAD ● SolidWorks ● C OSMOSXpress ● P ro/ENG I NEER ● A NSYS Classic, Workbench, Icepak

● M AT LAB ● M athcad ● L abV IEW ● L - E dit ● L inkCAD ● C, C++ ● O rigin ● M S Office, Windows ●

M ac OS

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