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***** ****** ***** . ****** *****, CA. ****0

Phone 760-***-****. Cell 760-***-**** - E-mail abm5ln@r.postjobfree.com

Robert O. Miller

Expert Manufacturing Operations and Project Management Executive:

Expert in Manufacturing Operations, Quality Systems, Supply Chain

and complex Project Management. Expertise achieved from 35 years of

experience in high volume electronics manufacturing with four different

fortune 500 companies - IBM, Fairchild Semiconductor, LSI Logic and

National Semiconductor. Experience includes specifying and building

factories from the ground up in the US and Far East. Developed and managed

a subcontract manufacturing organization in the Far East, having spent 15+

years at these factories implementing and training. Thorough understand

how to work with the Far East cultures. Have achieved 10 x cost

reductions, developed, and implemented automated production lines. Also an

expert in Quality Systems (Iso 9000 etc.) and developed the Total Quality

Systems Solution for LSI Logic, which included an integrated supply chain

management system. Have also worked as an experienced consultant with

operational responsibilities to complete a complex cross-functional product

transfer project. Have led my own company transferring LTCC manufacturing

technology into China.

Position Objective:

Senior Executive Operations or Program/Project Management.

Core Competencies:

. Problem Solver - have experienced and been successful overcoming high

volume manufacturing operating problems:

o Cost

o Cycle time

o Product design, delivery, quality, reliability

o Raw material problems

o Workforce training - US, Asian Rim, China

o Customer satisfaction

o New factory and process lines design/build

o New supplier development

o Subcontract manufacturing selection, process transfers,

continuous improvement and management - Asian Rim & Armenia

o New process development

. Division Management - P&L responsibility

. International factory operations and equipment development

. Engineering Management - engineering teams 100+; factory automation;

offshore process/product transfers.

. Cross functional team builder

. Quality Engineering

o Total Systems Solution -combination of:

. 6 sigma

. Continuous improvement

. Cross functional problem solving - The Learning

Organization

. Best business practices

. Supply Chain Optimization - Cost Reduction

. Subcontract manufacturing management - Asian Rim

. Product cost reduction by 5-10X - accomplished 3 times+

Professional Experience

2001 - 2009 President and Owner of LTCC Science and Technology

Established LTCC Science and Technology in 2001. Deliverable was to

establish high volume LTCC design and manufacturing capabilities in China

and teach the Chinese how to manufacture. Successfully established two

process lines for Chinese customers.

National Semiconductor - Director LTCC Operations

Managing Director of National Semiconductor's LTCC Division from

April 1998 to September 2001. Many advances were implemented in large

format LTCC processing and equipment technology.

Accomplishments Include

1. Developed the Cascade LTCC equipment set.

a. 12 inch frame - 10.5 inch print format

b. No stress auto blank and frame

c. Cascade punch - max rate of 400 holes per second.

d. Auto via hole x-y placement measurement system with via offset

auto program to the via punch.

e. Stress free via and ink cure system

2. Established a foundry model for the National LTCC Division.

3. Successfully second sourced products for Motorola and the initial

Ericsson Bluetooth module.

4. Established a foundry customer base of 30+ customers.

5. Profitable operation Q2, 2001.

National Semiconductor -Consultant 1996-1998

Successfully affected the seamless transfer of technology between National

Semiconductor facilities from Santa Clara, CA to Texas and Scotland.

LSI Logic Corp, Milpitas, Ca. - Director Quality - Director Advanced

Package Development

Extensive customer interface with quality and supply chain delivery

problems. Introduced the Total Systems Solution. Managed packaging

subcontractors (6) in the Far East. Developed Flip Chip Technology.

Fairchild Semiconductor - Portland, Maine

Division Engineering Manager for the Digital Division. Managed all

engineering functions, Design, Wafer Fab, Test and Assembly.

IBM Corporation - Burlington, Vermont

Semiconductor process engineer and 1st level Engineering Manager

At IBM and Fairchild led teams that implemented four wafer fabrication

sites. Designed and built many automated manufacturing innovations for

wafer fabrication and assembly operations.

Education

Alfred University Alfred, N.Y.

BS Ceramic Engineering

1. Major Holmes Thesis Award, Member of Keramos

Penn State University State College, PA.

MS Solid state Technology

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