Engineer Manufacturing
Resume:
Huan Huynh
Santa Clara, CA 95051
*********@*******.***
SUMMARY
A Senior Packaging Engineer with experience in all aspects of packaging
design, production and distribution processes, product readiness and
logistics. Effective in providing packaging expertise and solutions for the
New Product Introduction (NPI), product lifecycle (investigation, design,
launch, ramp, and stabilize), and worldwide strategies to achieve lowest
cost packaging solutions. A visionary with the ability to re-develop,
critique, and implement new programs to create a more efficient production
processes. Experienced in providing technical expertise on the distribution
processes and assisting the product development teams to ensure the overall
product strategy for moving the product through the supply chain is
optimized for the Distribution Centers (DC's) and logistics providers to
provide the lowest cost solution. Possess excellent supervisory and project
management skills as well as written and oral communication skills.
Communication Software:
MS Outlook, cc: Mail, Network Courier, MS Meeting Maker, Net Meeting, Live
Meeting
Office Software:
Microsoft Word, Excel, Access, Power Point, CAPE and TOPS (Palletization
Programs), ME (Mechanical Engineering, CAD), AutoCAD, SolidWorks (3-
Dimensional CAD)
Operating Systems:
HP-UX, MS NT/Windows, DOS
EXPERIENCE
Intel Corporation
2004-2008
Packaging Engineer
Hillsboro,
OR
. Champion Packaging Intel Workmanship Standards (Packaging iWS) and drive
packaging design for manufacturability (Pack DFM) rules into designs.
. Work proactively with design and manufacturing personnel to drive to the
elimination of manufacturing issues on the first attempt of any design.
. Communicate to manufacturing and production-sites new designs and
coordinate design and manufacturing inputs into new products and
processes (early involvement).
. Communicate potential issues to management and teams for resolution;
document risks and sign-off any violation going into production (risk
assessment).
. Support first article process activity on new products and processes.
. Thorough knowledge of iWS, Performance Specifications, process flows,
product and process requirements, and line configurations for target
factories.
. Participate in Pre and Post build activity and post-mortems for product
and process builds.
. Involvement in component qualification for new components (Packaged
Environmental Testing).
. Aid in the transfer of product and process to production sites for
manufacturing.
. Participate in Product Development Teams (PDT) for product and process
specific issues.
. Provide support for packaging related manufacturing issues with
sustaining products.
. Participate in Quality Action Notice (QANs) and the investigation,
problem solving, and implementation to the production sites.
. Experience in Lean Manufacturing / 6 Sigma.
Huan Huynh 408-***-****
Page 2
New United Motor Manufacturing, Inc.
2003-2004
Packaging Engineer (Contracting Position)
Fremont, CA
. Support Toyota Production System's returnable packaging initiative for
new model program and achieve 30% cost reduction. Price negotiations on
materials and contracts. Provide packaging methodology and strategy
support to management and production.
. Perform cost optimization and Engineering economic analyses. Coordinate
and procure all projects, parts warranty, and parts logistics management
system in compliance with ISO Standards and Six-Sigma.
. Support and procure Kaizen activities for all vehicle model programs and
perform operations analyses for manufacturing.
. Implement lean manufacturing process and waste reduction. Implement
kitting process and Human Ergonomics' best practices.
. Development packaging and materials handling applications for components
and sub-assemblies with cross-functional teams including suppliers and
vendors.
Innovated Packaging Company, Inc.
2002-2003
Packaging Engineer
Newark,
CA
. Reviewed and evaluated customer's equipments for various packaging
requirements at customer's sites.
. Developed, designed and engineered crating and bracing through equipment
review and evaluation using variety of packaging materials.
. Performed testing of designed packaging solutions.
Hewlett-Packard
1998-2001
Manufacturing Development Engineer
Roseville, CA
. Managed, in conjunction with the Pacific System Distribution Asia (PSDA)
partners, all packaging sourcing and tooling issues.
. Developed and managed detailed packaging schedules that outline and
track both the packaging design and tooling development and the
prototype and production sourcing strategies.
. Assisted the marketing teams to manage the superstore sleeve graphic
schedules and key deliverables and the manual, as well as with the CD-
ROM localization strategies.
. Conducted packaging design reviews for all projects and making sure to
obtain feedback from the NPI project teams, the PSDA partners, and the
distribution centers.
. Managed the package testing ensuring all test requirements and packaging
design guidelines were met.
. Managed packaging launch schedules and qualifications.
. Corresponded with the NPI project managers to provide them with
packaging and tooling cost estimates for key checkpoints and regular
updates on the packaging development schedules.
. Researched, evaluated and qualified new packaging technologies and
suppliers to create low cost and easily manufactured packaging
solutions.
. Developed a supplier strategy that was consistent with the division's
rapid time to market and launch strategies.
. Developed and maintained expertise on the DC and logistics provider's
processes, as well as the associated costs, to ensure the packaging
solutions were optimized for them.
. Developed and maintained key relationships with the contacts at the
DC's. Coached them to identify opportunities to improve the DC processes
and packaging solutions to achieve worldwide lowest cost.
. Assisted the planning team to identify key opportunities to improve
inventory flexibility allowing them to better manage the total inventory
required to meet product forecasts.
. Guided the Go-To-Market team, marketing and the NPI project teams toward
the lowest cost solutions by educating them on the DC processes and
associated costs.
Innovated Packaging Company, Inc.
1996-1997
Packaging Engineer
Newark, CA
. Reviewed and evaluated customer's equipments for various packaging
requirements at customer's sites.
. Developed, designed and engineered crating and bracing through equipment
review and evaluation using variety of packaging materials.
. Performed testing of designed packaging solutions.
Huan Huynh 408-***-****
Page 3
Trans-Pak, Inc.
1995-1996
Sales Representative/Packaging Engineer
Santa Clara, CA
. Reviewed and evaluated customer equipments.
. Developed and designed crating and bracing.
. Developed and designed corrugated protective packaging.
Educational Leave
1993-1995
Lockheed Missiles & Space Company, Inc.
1985-1992
Quality Assurance Inspector
Sunnyvale, CA
. Responsible for Quality Control (QC) inspection on inbound raw
materials, semi completed and finished parts for the determination of
quality, workmanship and dimensional operation. Held a Classified
clearance.
EDUCATION
. San Jose State University, San Jose, CA, B.S. in Industrial Packaging
Engineering, 1995
. Mission College, Santa Clara, CA, A.S. in Electro-Mechanical Computer
Aided Design Drafting (CAD), 1989
ACCOMPLISHMENTS
. Achieved ~ $147k packaging cost savings and 114k pounds of waste
prevention by converting from existing non-recyclable Polyurethane foam
material to the 100% recyclable Polyethylene foam solutions annually for
Intel Corporation.
. Achieved ~$1.75 million in packaging cost savings from 1999 to 2001 as
results of using alternative designs and packaging materials for Hewlett-
Packard.
AWARDS
. Received an Intel Environmental Excellence Award in 2006 for the efforts
to increase Intel's environmental stewardship while reducing cost by
providing efficient packaging solutions across Assembly, Test, and
Manufacturing (ATM) sites.
. Received award through Hewlett-Packard Company's Stock Award and
Recognition (STAR) Program in 2000 for packaging environmental and cost
reduction by providing efficient packaging solutions across Assembly,
Test, and Manufacturing (ATM) sites.
Contact this candidate