Engineer Process
Resume:
Cheng-Yu Hsieh (Amos)
********@*****.***
Education The University of Texas at Dallas, Richardson, TX
M.S., Electrical Engineering; Overall GPA: 3.3
Chung Yuan Christian University, Chung Li, Taiwan
06/2006
B.S., Electrical Engineering; Overall GPA: 3.48
Relevant Semiconductor Devices and Materials Solid State Sensor
Courses Microelectronic Packaging Application
Silicon VLSI Technology Micro Electro Mechanical
Systems
SEM, TEM Operation Lab
Academic Capacitive RF MEMS Switch:
Projects Using Matlab, ADS, ANSYS to model a Capacitive RF MEMS Switch by X-band
application with an operation frequency of 10GHz. From the device
process fabrication to the circuit matching, discussed design feature
and analysis in a shunt configuration with both ends of the membrane
fixed. Obtained optimized performance and the dimension of the
transmission line in RF domain.
SAW Device Process and Simulation:
From device process fabrication to the circuit matching by using
AutoCAD and ADS to model Surface Acoustic Wave (SAW) Device. Depositing
thin films on GaN/Sapphire and LiNbO3 to show properties of materials.
Simulate the device characteristics and design impedence circuit to
optimize device frequency response, the filter characteristic,
insertion loss and sidelobe.
Development of Machine Arm remote-controlled by Infrared Rays Module:
Using 8051 microcontrollers, IR receiver module, stepper motor, relays,
remote control and 12V power supply to develop a Machine Arm operated
by infrared rays of remote control. By integrating 8051 programming
codes and correct circuit diagram allowed the robotic arm controlled
precisely, including ON/OFF, acceleration, deceleration, changing
direction.
Ionized Plasma Vapor Deposition System:
Analyzed IPVD technique by using Matlab, simulated relations between
the flux ionization fraction and aspect ratio of trench filling,
corresponding to gas pressure, ICP power, and magnetron power within
the ionized plasma. Discussed these interactive factors, and also
related application of etching process.
CMOS Process Flow & MOSFET Design:
Sketch a process flow of CMOS, including CMP, Thin Film Sputter, LPCVD,
Photolithography, Etch, Diffusion, Ion Implant, Oxidation, described
advantages and drawbacks of each process step and solutions. Also using
ITRS roadmaps to design all the dimensions of a MOSFET, including
isolation, M1 layer, materials, S/D doping level. Then discussed the
device performance estimation.
Work CYCU Semiconductor Material Research Center
Experienc 12/2004 ~ 06/2006
e ? Research Assistant and Equipment Operator at Chung Yuan University
Semiconductor Device and Material Laboratory to assist doing
microelectronics research and manage experimental instruments,
including Evaporator, Helicon Magnetron Sputter, RF Magnetron Sputter
systems and vacuum machines.
Taiwan Riken Industrial Co., LTD. 06 ~
09/2002, 06 ~ 09/2003
? Process Integration Engineer and Test Engineer to operate different
manufacture facilities, checked each step of product processing,
figured out the error of those equipments, and further examined those
products of their qualities, and troubleshooting.
Military for Taiwan, R.O.C
10/2006 ~ 12/2007
? Wire System Maintenance and Communication Equipment Repair to
preserve all the communication systems and equipments of the battalion
under 24-hour surveillance, avoiding communication interruption.
Chung Yuan University Computer Networking Center
08/2005 ~ 06/2006
? Computer Hardware Repair and Operation System Maintenance to manage
and upgrade computer hardware and software in the school computer lab,
and instructed students to operate school computer systems.
Operation Computer Systems: Windows 2000/XP/Vista/7, MS-DOS
Skills Application: Microsoft Office (Word, Excel, Powerpoint, Outlook,
Publisher, Visio), HTML, CSS, Matlab, ADS, AutoCad, Ansys (MEMS),
H-Spice, Photoshop, Illustrator, Oscilloscope, Multimeter, Network
Analyzer
Languages Chinese, Taiwanese, English
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