Assistant Electrical

Dr. Ping (Cerina) Zhang

*** ******* ***, *** ***, SAN MATEO, CA 94401 . 650-***-**** .

********@*****.***

PROFILE

. Self-motivated and goal driven professional with 8 years

experience of design, fabrication, assembly, packaging and testing

MicroElectroMechanical systems (MEMS) for optical and biomedical

applications.

. Ph.D in Electrical Engineering with 20 publications including

publications on J. Micromechanics and Microengineering.

. Extensive research experience in 3-D integration (assembly and

packaging) at chip/wafer level using various technologies.

. Hands-on cleanroom experience of fabrication and device/material

characterization.

. Six Sigma Green Belt

. Fluent in Chinese (Mandarin).

EXPERIENCE

MEMS Assembly/Packaging Engineer, Glimmerglass, Hayward, CA

July 2007-Present

(Glimmerglass is the world's leader in developing and marketing MEMS

based Intelligence Optical Switching solutions. A startup company

financed by seven institutional investors.)

. A Conducted research in the field of microassembly and integration

for low cost and highly reliable MEMS optical swtich systems.

Improved alignment accuracy for 80% using new fiducial.

. A Worked with vendor scientists to develop new adhesive material

formula used for flip-chip bonding. Performed material

characterizations through electrical, mechanical and thermal

studies.

. Initiated and launched Data collection using LabView programs and

Access database.

. Conducted data analysis, complex problem solving and FMEA

activities in multi-disciplines in relation to operation with

improved yield and reduced cycle time.

. A Researched and identified advanced processing techniques for

next generation MEMS pressure sensors to reduce product cost

resulting in a successful prototype.

. Managed technical specifications and prototype verifications with

international suppliers to achieve improved product performance

and reduced cost through technology transfer. Successfully

implemented two MEMS designs into prototypes followed by

production within 16 months.

. Led design and product verification efforts towards successful

launch of MEMS sensor products for automotive applications.

Research Assistant, Automation & Robotics Research Institute, Fort

Worth, TX 2005-2007

(Project was funded by Office of Naval Research and collaborated

with Bennington Microtechnology Center)

. Developed a novel active joining mechanism for integrating complex

3-D Microsystems. It provides a simple mechanical and electrical

interface for components made from different materials and

geometry to be assembled in the same substrate with self-alignment

feature and zero insertion force requirement.

. Coordinated and debug the design mask layout of several projects

for the whole group.

. Developed fabrication processes for several projects and

fabricated devices in Stanford Nanofabrication Facility at

Stanford University.

Research Assistant, University of Texas at Arlington, Arlington, TX

2002-2005

. Developed a polymer based Fabry-Perot thin film filter with 3-D

self-assembled microstructures using POLYMUMPs process. It

significantly reduced the optical loss caused by polysilicon and

eliminated the traditional labor intensive and time consuming

manual assembly effort.

. Participated in projects collaborated with UT Southwestern Medical

Center to develop micro tools, including micro endoscope for

Parkinson's disease and micro pump for drug delivery.

Teaching Assistant, University of Texas at Arlington, Arlington, TX

2002-2005

. Assistant for six courses including both undergrad and graduate

level.

. Present lectures at Random Signal and Advanced MEMS (graduate

level) course and supervised 31 students in MEMS design projects.

Teaching Assistant, Physics, University of Massachusetts, North

Dartmouth, MA 2001-2002

. Lab instructor and grade exams.

SKILLS

. MEMS Design and Analysis (Software: L-Edit, MEMSPro, Intellisuite)

. Optical Thin Film Analysis (Software: ThimFilm Wizard, TFCalc)

. Process Development & Integration: Metal/Dielectric thin film

deposition (Evaporation/ Sputtering/Plasma); Photolithography;

DRIE; Flip-chip bonding and wafer bonding

(Eutectic/Fusion/Anodic); Fluxless soldering (AuSn); Wafer dicing

(Wafer Saw/Laser); Wire bonding.

. Device Testing and Characterization: SEM, Probe station,

Ellipsometer, 2-D and 3-D profilometer, MEMS force sensor, Robotic

3-D microassembly station, Data acquisition, Laser, Optical

spectrum analyzer, Oscilloscope, etc.

. Software: MathCAD, Mathematica, Origins, Access, MS Office, etc.

. Programming: Fortran, C, C++, VHDL, MatLab.

. Graphics Design: XARAX, Sketch-Up, Camtasia Studio.

EDUCATION

University of Texas, Arlington, TX

PhD in Electrical Engineering May 2007

Honor: University STEM Doctoral Research Assistant Fellowship (Full

Tuition).

Activity: Chair Person, UTA Mandarin Chinese Student Fellowship

University of Massachusetts, North Dartmouth, MA

MS in Physics August 2002

Tianjin University, Tianjin, China

BS in Electrical Engineering June 2000

Honor: Excellent Student Scholarship, 1996-2000

Activity: Editor in Chief, Campus Newspaper

AWARDS AND RECOGNITION

. Won the SPIE 2007 Educational Scholarship in Optical Science and

Engineering among 136 awards recognized globally.

. Travel Grant awarded in Photonics West Symposium, Micromachining

and Microfabrication Process Technology Conference, San Jose, Jan.

21-26, 2006.

. Co-authored the Best Student Paper in TEXMEMS VII International

Conference on MEMS, El Paso, TX, Sept. 2005.

SELECTED PUBLICATIONS

. "Performance and reliability assessment of a dielectric charging

guard in MEMS optical switch systems", Ping Zhang, Emily J. Carr,

Doug Keebaugh, Kelvin Chau, Glimmerglass Networks, Inc, Photonics

West Symposium, San Francisco, Jan. 23-28, 2010.

. "An Active Micro Joining Mechanism for 3-D Assembly," M. Mayyas,

Ping Zhang, W. H. Lee, D. Popa and J.C. Chiao, J. Micromech.

Microeng. 19 035012 (12pp), 2009.

. "Optical Micro-Assembly with Automatic Alignment Using MEMS Active

Interconnects," Ping Zhang, Lun-Chen Hsu, Kevin Le, and J. C.

Chiao, International Journal of Optomechatronics, Vol. 1.4, Oct.

2007, pp425-432.

. "An Active Locking Mechanism for Assembling 3D Micro Structures,"

Ping Zhang, Mohammad Mayyas, Woo Ho Lee, Dan Popa, Panos

Shiakolas, Harry Stephanou, and J. C. Chiao, SPIE International

Smart Materials, Nano- & Micro-Smart Systems Symposium, Adelaide,

Australia, Dec.10-13 2006.

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