Laila Baniahmad
***** ******** **** *****: ***-593-
3073
Cupertino, CA 95014 Email:
*********@*****.***
Objective A career position in electrical / control or robotic system
engineering in semiconductor or other processing equipment.
Skills Automation System Design, Robots and Motion Control
Robot and Motion control programming
Sensors, Power Supplies and Actuators
Power and Signal Distribution
Measurement Instruments, Testing and Troubleshooting
CAD, ORKAD, PLC Programming
Semiconductor Processing Equipment (ECP, ECMD, ECMP, CMP, Etch)
Experience
04/2009 - Present
Consulting
Designed Automation and robotic systems architecture, hardware
Robotic& details and motion control programming.
Automation
Engineer
02/2008 - 04/2009
Asyst Technologies, Inc. Fremont, CA
Managed the process of defining and linking a complete set of
requirements for wafer transport robotic systems.
Developed architecture for wafer transport robotic systems or major
Sr. System subsystems.
Engineer
Managed the project and coordinated the activities of mechanical,
Electrical and software engineers.
Led a test beginning with a test plan and ending with a test report
including tracing and resolution of test issues.
Created documentation, procedures and system manuals.
03/2006 - 01/2008
Intevac, Inc. (Lean Etch Systems) Santa Clara, CA
Managed robot project and coordinated the activities of mechanical,
electrical and software engineers.
Designed the motion control system architecture for a 4-axis robot
arm wafer transferring system in a 6-chamber etch equipment with a
throughput of 240 wafers per hour.
Developed the motion control software for a 32-axis motion
Control controller including single and coordinated motions for calculated
system/ geometric paths, robot teaching methods, errors recovery,
& Robotic changeable PID parameters on the fly, changeable motion profiles on
the fly and safety software interlocks.
Engineer
(And Designed an intelligent wafer detecting system for vacuum
Project conditions using laser beam and high speed counter.
manager)
Developed wafer centering method on the fly ( OTF ).
Developed a robot teaching method using teach pendant ( Real time
position - speed control )
Designed hardware safety interlock circuits.
Created documentation, procedures and robot manuals.
04/2002 - 02/2006
ASM NuTool, Inc. (Copper Interconnect Systems) Fremont, CA
Developed motion control hardware for electrochemical plating and
electrochemical-mechanical planarization process modules up to 8
axes. Motions included spindle rotary motion between 20-1600 rpm,
planarization linear motion with speed of up to 500 mm/s and
acceleration up to 4000 mm/s2, reciprocating rotary pad
conditioning arm motion up to 2 sweeps/s and with torque up to 200
lb-in. Selected motors and drivers for all motions, optimized (PID)
control parameters for each application, and programmed the motion
control board and the drivers.
Designed hardware safety interlock system for chemical dispenses
and motions for plating and planarization tools.
Designed the control system for the wafer clean module which
included a megasonic pie array to prevent wafer damage up to 200 w.
Electrical
/
Control Designed the control system for plating and planarization tools
system including power and signal distribution, fluid and gas control and
Engineer all motions.
Designed a highly reliable fault-tolerant level sensing and
electrical control circuit for a chemical-tank pump (patent
pending).
Designed a patented dual-source power system for electroplating in
order to prevent hot spots during wafer entry.
Developed endpoint for copper CMP.
Assisted process group with extensive testing and measurement of
electrical characteristics of electroplating during wafer entry and
with measurement of applied pressure during planarization.
Created documentation including BOMs, schematics, interconnection
diagrams, testing and programming procedures and initiated or
approved ECOs.
02/1999 - 05/2001
Tamam Tadbir, Inc.
Tehran-Iran
Designed digital board for gas and fluid temperature control
system used in medical equipment.
Designed pressure control system for oil pipes.
Designed test fixture for boards manufacturing quality check.
Created documentation and procedures for test and troubleshooting,
Installation support and supervised assemblers and test engineers.
- BSEE, Tehran-Azad University, 1999
- "Principles, Fabrications & Designs of Semiconductor Memory
Devices." and "Engineering Communication" courses in San Francisco
State University.
Electrical
-"Reduction of Defects in conductive Layers during Electroplating"
Engineer
US Patent No 200********
-"System for Fault-Tolerant-Fluid conductive Layers during
Electroplating"
US Patent No 200********
- "Semiconductor wafer Detection for processing suitability"
Education
Patents