Manufacturing Design
Resume:
Edward J. Boldt, Jr.
**** ******** ****, ***. ***, Middleton,
WI, USA 53562
************@**.*******.***
http://www.linkedin.com/in/ejboldtjr
UNDERGRADUATE
EDUCATION________________________________________________________
Cumulative GPA (3.09/4.00)
University of Wisconsin, Stout** (College of Science, Technology,
Engineering, & Mathematics) Menomonie, WI, USA B.S. Packaging -
Packaging Design/Research & Development
(Fall 2007/Spring 2008)
GPA Major (3.23/4.00)
University of Wisconsin, Stout** (College of Science, Technology,
Engineering, & Mathematics) Menomonie, WI, USA
B.S. Engineering Technology - Mechanical Design
(Fall 2004)
GPA Major (3.06/4.00)
EMPLOYMENT__________________________________________________________________
______
Uniek, Incorporated (A Pyle Group Company)
Waunakee, WI, USA
Product Engineering & Packaging Design/Development
(August 2009 - Present)
. Maintained packaging standards for the Wal-Mart Packaging Scorecard
program.
. Conducted ISTA distribution testing and sample prototyping at the Menasha
Packaging: Madison Design Center.
. Responsible for creating new packaging display designs utilizing
ArtiosCAD, AutoCAD, & TOPS software.
. Utilized ERP software to create and maintain manufactured BOMs, routings,
& reworks for all domestic products.
. Set packaging standards and material specifications for domestic and
international packaging, communicated with overseas manufacturing to
resolve packaging issues.
. Worked close with Marketing and Product Development to create/implement
new packaging designs.
. Estimated/quoted costs for new domestically manufactured products.
. Redesigned shipping packaging, decreasing product damage and improving
manufacturing efficiency.
American-3 Fab, Incorporated
Green Bay, WI, USA
Mechanical Design/CNC Laser Programming
(August 2008 - August 2009)
. Design drafting of sheet metal for fabrication, machining, and other
manufacturing processes.
. Programmed CNC machinery for laser cutting and press brake operations,
troubleshot problems with press brake tooling and other manufacturing
systems.
University of Wisconsin, Stout (Packaging Science Department)
Menomonie, WI, USA
Undergraduate Teaching Assistant/Lab Assistant
(Fall Semester 2007)
. Assisted faculty with course preparation and instruction/demo of lab
assignments.
. Provided assistance to students during class and in the lab with
equipment.
Nercon Engineering & Manufacturing, Incorporated
Oshkosh & Oconto, WI, USA
Mechanical Design
(May 2005 - August 2006)
. Design/drafting of conveyors, accumulators, and other material/packaging
handling machinery
for the food & beverage industries.
. Improved manufacturing and assembly processes by troubleshooting problems
with CNC programmers and manufacturing to ensure accuracy and efficiency.
INTERNSHIPS/CO-
OPS__________________________________________________________________
Kimberly-Clark, Corporation (KC South & KCPX: RFID Solution Center
Laboratory) Neenah, WI, USA
Packaging RFID/Supply Chain Intern
(January 2008 - June 2008)
. Conducted testing/research with RFID technology and performed data
analysis to improve current
processes while developing new packaging solutions.
. Assisted scientists/engineers with RF testing for packaging applications
to use for internal and external customers looking to implement RFID
technology.
. Researched and tested new emerging RFID technology for current and future
applications.
Green Bay Packaging, Incorporated (Shipping Container Division)
Green Bay, WI, USA
Production/Manufacturing Supervisor Intern
(June 2007 - August 2007)
. Production Supervision overseeing 10-20 production employees during
converting/manufacturing
operations.
. Performed regular quality control measurements/tests to meet
specifications during production.
. Monitored production from corrugators, re-routing material, ensuring
minimal downtime on converting machinery.
CONTINUING
EDUCATION_____________________________________________________________
Pack Expo
Chicago, IL, USA
Weyerhaeuser Corrugate Packaging Workshop/Clinic
Aurora/Naperville, IL, USA (May 20th, 2008)
Wal-Mart (Canada) Packaging Scorecard Seminar
Toronto, Ontario, CN (September 29th, 2009)
CERTIFICATIONS/AWARDS
. 2007 Italian Packaging Technology Award
(Spring Semester 2007)
. Publication: DEStech, Journal of Applied Packaging Research
(June 2007)
. CPP (Certified Packaging Professional) Certification: Phase 1 (CPIT)
(October 2007)
PROFESSIONAL
ORGANIZATIONS______________________________________________________
. Member of IoPP (Institute of Packaging Professionals)
(Fall 2006 - Present)
RESEARCH____________________________________________________________________
________
. Boldt, Jr., E. J., 2007, "Smart Packaging": Radio Frequency
Identification (RFID), The Future of Packaging Tracking & Identification,
DEStech: Journal of Applied Packaging Research, vol. 1, #3
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