Frederic Boutaud http://www.fboutaud.com
* ****** ****, *********, ** 02420 • 508-***-**** • ********@********.***
Director Engineering / VP Engineering / Director R&D / CTO / Fellow
Technical Leadership / New Product Development / Innovation & Technology Advocate /
Strategic Planning / Design for Manufacturability and Quality – High-Tech Products and Systems
Engineering Manager: Through my assignments at global semiconductor corporations I gained extensive
international experience in managing complex project and developing successful hi-tech products from concept
to production. I had the opportunity to collaborate with and manage multicultural multi-site teams in
Japan/France/USA, USA/Europe/China/Taiwan. I set-up and grew a robust and stable design team in Beijing. I
fulfilled all director duties including creation and negotiation of the engineering content of legal contracts and
policies, cost control and management of multi-million development budget, team and people development, IP
protection, relationship with customers vendors and partners, product and technology roadmap.
New Product Development: Over the last 15 years, I used my expertise to deliver business driven
contributions through technology and innovation. I am highly focused on work methods and processes that
enable development and manufacturing of high quality products, meeting market requirements and achieving
leadership position in hi-tech, high volume consumer space.
Technical Leader: By integrating the disciplines of system, algorithm and circuit design engineering, I led the
development of scalable, reconfigurable dual core architectures and SOC that became the foundation of Analog
Devices (ADI) wireless chip set business. While at Texas Instruments, I pioneered the development of low
power fixed point DSP processor chips for wireless applications from the inception of GSM in Europe, enabling
TI wireless handset business to get started with Ericson and then taking a leadership position with Nokia.
MSEE - Ecole Centrale de Lyon (France)
Selected Achievements and Skills
Developed product that achieved highest volume (>40Munits/Year), highest revenue in ADI history.
Developed large and recognized architecture and digital IC design work and IP in the low power/high
performance MCU, DSP and wireless processing technical field.
Improved gross margins through product cost reduction, yield improvement, reached profitability goals;
accomplished multi foundry sourcing.
Portfolio of 48 U.S. patents in the area of over-sampling data converters, CPU design, graphics and video
processing, and low- power DSP core design. Elected Analog Devices Fellow in 2006.
Skills: Strong technical leader, mentor and ambassador. Proficient in solving problems. Persistent and
excellent achiever. Highly personable and capable of working across multi-disciplinary organizations.
Extremely inventive and good at fostering innovation.
Career Overview / Professional Experience
MediaTek Inc. (formerly Analog Devices B.U.) – Engineering Director, Fellow 2008-2010
Analog Devices Inc. (Wireless Business Unit) – Engineering Director, Fellow 1996-2008
Texas Instruments France (Wireless Business Unit) – Design Manager, SMTS 1992-1996
Frederic Boutaud http://www.fboutaud.com
5 Fulton Road, Lexington, MA 02420 • 508-***-**** • ********@********.***
Texas Instruments, Houston TX (DSP Division) – DSP Core Architect, MGTS 1989-1992