Long K. Tran
Milpitas, CA ****5
Telephone 408-***-****
Email: *********@*****.***
Summary of Qualifications
More than 15 years of experience in data, voice and video telecommunications product
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development. Expertise in both hardware and software design. Assumed a variety of roles in
including: detailed circuit design, system architecture and system bringing up.
Ability to design electronic circuit board for embedded systems with speeds ranging from
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audio to high data rate.
Ability to design FPGA using Verlog and VHDL language, Xilinx XDK and SDK.
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Ability to code and debug embedded software and firmware in Linux and UCOS operating
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system.
Professional Experience
MaxSonics, Santa Clara, CA 2004 – 2009
Design Engineer
Maxsonics is a privately owned company with a mission to provide engineering consulting services and to
license audio related software including Noise Reduction, Echo cancellation, and audio compressions.
My accomplishments included:
Integrated Maxsonics Echo cancellation software onto the CSR Bluetooth platform. Designed and
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brought up hand free speakerphone using the CSR Bluetooth IC.
Ported echo cancellation software onto the ZSP (LSI DSP processor).
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Integrated Maxsonics software onto the Behere video and audio conferencing system (ZSP
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platform), the Dash Navigation audio conferencing system (Analog Devices ADSP BF527 DSP
platform), and the CSR Bluetooth platform.
Designed Xilinx FPGA and brought up a number of boards for audio signal processing.
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Helped bring up the hardware for a Cisco video/audio distribution system. Worked with EDK and
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SDK tools on Xilinx Vertex 5 device.
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Independent Consultant 2000 2004
Provided engineering consultant service for a number of clients:
Emcosys and Nord Micro (Germany)
Full participation from concept to production in the development of the Airbus 380 Cabin Pressure
Control System (CPCS). Responsibilities included: circuit design, FPGA design and simulation
using VHDL language on Actel parts, firmware and diagnostics software (written in C) with
Infineon C167CS, and PowerPC MPC5554 processor.
Proxim (Santa Clara)
Designed and brought up a wireless VoIP prototype hardware with the TI TMS5409 and AMD
SLIC/SLAC on board. Completed verification of all the operations on supporting the telephony
firmware suite.
Onneta
Designed and brought up a digital control board for a fiber optic transmission system. The board
was built on MPC8260 and Xilinx Vertex 800.
Stanford Telecom Corporation
Participated in the development of a voice and data MMDS and LMDS cable modem network.
Responsible for the design and coding of the firmware that controls RF modulators and
demodulators. Programmed in C.
3M Corporation
Hardware and FPGA design of five versions and variants of an acoustic echo cancellation and
noise reduction speech processing subsystem for an intercom system. Hardware included the
Analog Devices ADSP 2181,A/D D/A, and the analog frontend.
Vivace Networks 1999 2000
Senior Engineer
Participated in the bringing up of Vivace’s first prototype high speed Multiservice IP Switch with
transmission rate 3.1Gbits on the backplane.
Samsung Telecommunications 1997 1999
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Hardware Manager
Managed a hardware team responsible for the development from concept to design and verification of
the Samsung Voice Over IP (VoIP) Cable Modem that supports Packet Cable and DOSCIS 1.1 standards.
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First Pacific Networks 1989 1996
Principal Engineer
Project leader of a design team responsible for the development of the company’s main product lines, a
hybrid fiber coax network, from design concept to production. The network allows voice, data and video to
share a common transmission medium.
Took full responsibility for product development, from specification to design and production. Provided
technical leadership to the development team. Interfaced with software and manufacturing team. Designed
circuit board, FPGA, also coded DSP firmware for the ADSP 2111, TMS320VC5409. Debugged and
modified system software.
Successfully developed and introduced to the market various products:
FPGA design: Implemented the core electronic components, and the the link layer IC with Xilinx
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X4000 and X5000.
Voice Interface Unit: This product allows telephone transmission via the broadband cable network.
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Patent granted for the invention that doubles the bandwidth capability, a major architectural
improvement that allowed the company to win a major contract.
Broadband Ethernet: This product allows Ethernet data to be transported onto a broadband cable
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network. Patent granted for the invention of this product.
T1/E1 Digital Trunk Interface: This unit provides the connection between the broadband cable
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network and the Central Office in T1 or E1 standard. The architectural design is cost effective and
flexible to operate in various protocol standards.
Compression Labs 1985 1989
Principal Engineer
Key engineer/project lead of development teams responsible for taking products from design concept to
production of a number of video/audio teleconferencing systems with transmission rates ranging from
56Kbps to T1/E1 rates. Designed complex boards and FPGA and implemented DSP algorithms for video
and audio compression.
EDUCATION
MSCS University of Santa Clara
MSEE San Diego State University
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