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Engineer Mechanical

Location:
Arlington, TX, 76013
Posted:
November 02, 2010

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Resume:

ABHILASH R.MENON, E.I.T *** S Cooper St., Apt **,

Arlington, TX 76013

Mobile: 817-***-****

Email: ********.*.*****@*******.***

SUMMARY

. 4.5 years of professional experience in thermal/mechanical engineering

and manufacturing.

. 3 years experience in analytical/experimental methods for electronics

applications using CAD/FEA/CFD.

. 1.5 years experience in design and manufacturing of cranes, wireless

and utility transmission poles and NDT examination of heat exchangers,

boilers, pressure vessels, and storage tanks.

. Designed and developed a functional prototype of IGBT thermal tester

for the Product Development team at Siemens Industry Inc.

. Solid background in mechanical, thermal and structural analysis.

. Good understanding of materials, engineering theory, principles of

design and ANSI Y14.5 GD&T.

. Knowledge of DFMEA, Six Sigma, RCFA, lean manufacturing and common

machining techniques.

. Strong team player as depicted with collaborations and 5 papers,

attention to detail, and stress tolerance.

TECHNICAL EXPERTISE

. Engineering Software: Pro/E, AutoCAD, SolidWorks, CATIA,

ANSYS, Flotherm, Icepak, I-DEAS

. Programming and Computation: C/C++, Matlab

. Documentation: Microsoft Office Suite

. Experimental Testing: Air Flow Bench, Wind Tunnel Testing, LabView,

Environmental Chamber

. Made biweekly presentations at graduate student meetings and Siemens

Industry Inc.

EDUCATION

M.S (Mechanical Engineering) University of Texas - Arlington, TX, USA

May 2010 GPA: 3.5

B.E (Mechanical Engineering) University of Mumbai, Mumbai, India

July 2006 GPA: 3.5

PROFESSIONAL EXPERIENCE

* Siemens Industry Inc., Pittsburgh, PA Product Development

Intern Jan'10 - May'10

. Accomplished the design and development of IGBT thermal tester for the

Product Development team by appropriate selection of thermoelectric

coolers and heat sink-fan arrangement.

. Experimental results validated by computational modeling of the test

set up using Flotherm.

. Executed presentations and report detailing the product development

procedures and a tutorial listing the selection of thermoelectric

coolers, heat sinks and fans. A paper has been submitted for review.

* The University of Texas at Arlington, TX Research Assistant

Oct'07 - Dec'09

. Identified optimal location of power cells in the cabinet for energy

efficient operation of Siemens air cool drives. Experiments conducted

on Air Flow Bench and results validated by computational modeling using

Icepak. (Funded by Siemens Industry Inc., PA); Paper Published.

. Designed a hybrid cooling system for a telecommunication shelter to

replace the existing active cooling system using Flotherm. Performed

energy analysis to determine the percentage savings in energy when

implemented. (Funded by CommScope Inc., TX); Paper Published.

. Performed thermo-mechanical analysis of a 3D package in

microelectronics. Modeling and analysis was done using Pro/E and ANSYS;

Paper Published.

. Investigated the mechanical properties of components and joints in

microelectronic devices using Instron microtester.

. Developed numerical models and conducted heat transfer and fluid flow

analysis using Flotherm and Icepak for electronic packages and

mechanical systems such as HVAC equipment for datacenters and

telecommunication equipment.

. Performed reliability testing of board-level electronics by Accelerated

Thermal Cycling using Environmental chamber.

. Conducted Temperature Measurements to analyze thermal problems using

thermal lab equipments such as thermocouples, wind tunnels, flow

measurement devices, and data acquisition systems.

* Sabre Galvanizing, Alvarado, TX Mechanical

Engineer Intern Jan'09 - Feb'09

. Devised 4 different types of racks for lifting of wireless and utility

transmission poles, angles and other components thereby improving the

efficiency of the plant by about 7%.

. Conducted time study for 19 manufacturing processes leading in net time

reduction by 12-15%.

* Mukand Limited, India Product

Engineer Jul'06 - Jun'07

. Mechanical and structural design of EOT, ladle handling, power house,

gantry, and rotating trolley cranes.

. Collected and interpreted engineering data, performed CAD drawings and

calculations, and bill of materials for the different crane components.

. Interfaced with Shop personnel fabrication and testing to insure

product compliance with design formation and delivery requirements.

. Computed cost estimation for 6 crane projects and was involved in its

execution in co-ordination with the cross functional groups. Conversant

with the end user of ERP system (J D Edwards).

* TesTex NDT Private Limited, India Engineer Trainee

Jan'06 - Jun'06

. Detected & quantified flaws in heat exchangers, boilers, condensers,

pressure vessels, piping, and storage tanks used in thermal power

plants and refineries using non-destructive techniques like ECT, RFET &

LFET.

PROJECT WORK

. Performed stress analysis to test the effect of weight of different

heat sinks on the mechanical reliability of BGA packages using ANSYS.

. Modeling and thermo-mechanical analysis of electronic packages using

Pro/E, CATIA and ANSYS.

. Thermal analysis of various data center configurations using Flotherm

and Icepak.

. Computation of radiosity of a V-notch cavity by the Sparrow radiation

method using Matlab 2007b.

. 3D modeling and structural analysis of a gate valve to minimize the

stress at critical points using I-DEAS.

. Lathe, milling, shaping, planing, drilling, boring and tapping.

AFFILIATION / CERTIFICATION / HONORS

. Member, ASME (American Society of Mechanical Engineers).

. Certified E.I.T (Engineer-in-Training), Texas Board of Professional

Engineers, 2010.

. Certificate in Electronic Packaging, EMNSPC, UTA.

. Recipient of Center for Electronic Packaging Research Scholarship from

Fall 2008 to Spring 2010.

REFEREED CONFERENCE (SELECTED) PROCEEDINGS

. Thermal Design Optimization of a Package on Package, SEMITHERM-25

(2009), San Jose, California.

. Mechanical Design Optimization of a Package on Package, InterPACK '09,

San Francisco, California.



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