Craig Browning Stein
Rancho Santa Margarita, CA 92688
949-***-**** (Home)
949-***-**** (Cell)
********@*****.***
Summary:
. Accomplished, and hands-on RF and Mixed Signal ASIC, FPGA and Systems
Engineering leader with many years designing complex products for cost
sensitive markets
. Experienced firmware/software manager and architecture lead
. Introduced and ramped more than 200 customer projects to high volume
production
. Achieved exceptional revenue growth by creative product definition and
precise engineering execution
. Increased prior company revenues from $500K per quarter to $200M per
quarter in 3.5 years
Work Experience:
11/11 to Present Knowles Electronics
Head of R&D
Products: Miniature Surface Mount MEM's and Electret Condenser Microphones
and Balanced Armature Receivers (transducers)
. Lead and manage full engineering team comprised of MEM's, Analog IC,
Electrical, Mechanical, and Eletro-Acoustic Researchers and Development
Engineers
. Develop design techniques and methodologies to improve overall transducer
product portfolio
. Lead RF design and debug efforts to address transducer susceptibility and
radiated challenges
. Lead and manage Program Management and Applications Engineering
. Own and drive full product development cycle through manufacturing and
sustaining
. Lead directors, managers, and engineers in innovating and refining
development, and sustaining processes that achieve maximum efficiency,
and scalability
. Work closely with the GM, marketing, and finance to establish the most
successful corporate strategies, product definition, and roadmaps
08/08 to 10/11 Symwave, Inc
Engineering Vice President
Products: High Speed Communication Transmitters and Receivers
. Lead and managed full engineering team comprised of 90+ USA/China R&D,
Analog/Digital ASIC, FPGA, System, and SW/FW
. Developed high speed (5Gps) mixed signal ASICs, FPGAs, and complete
customer systems for high volume Storage, PC, and Cell Phone Products
. Drove manufacturing, and back-end activity including fabrication,
packaging, test, and production
. Lead directors, managers, and engineers in innovating and refining
development, sustaining, and support processes that achieve maximum
efficiency, and scalability
. Served as one of the main technical customer interfaces and drove
solutions through the company
. Regularly prepared and presented technical proposals and presentations to
customers, partners, board members and other executives
. Architected current and next generation high speed solutions and products
. Drove technical innovation, and execution throughout the organization
. Worked closely with the CEO, marketing, and finance to establish the most
successful corporate strategies, product definition, and roadmaps
10/03 to 08/08 Broadcom Corporation
Engineering Director
Products: Bluetooth, FM, GPS, WLAN
. Grew a new engineering team from 8 to 125 engineers and managers
worldwide (USA, Taiwan, Korea, France, Japan, China)
. Lead 125 person team of HW/RF Engineers and Managers who designed
Bluetooth, and FM RF & Baseband Hardware, and Baseband/Host Stack
Firmware/Software
. Drove RF and Analog Signal Integrity initiatives throughout the
organization
. Guided customers in proper RF, and Antenna design and layout techniques
to fully optimize their systems
. Designed RF and Baseband ASIC test boards/systems and customer
reference/production systems for Cell Phones (GSM, GPRS, CDMA, & WCDMA),
Audio, PCs and HID Devices
. Generated test and qualification requirements for all system designs
. Drove cross functional team (Marketing, Engineering, Operations,
Manufacturing) in developing internal process improvements
. Created and drove cross organizational directives to increase company
competitive advantages
. Provided direction and technical guidance on difficult customer issues
that required advanced problem solving
. Represented company as the technical expert when attempting to win and
maintain business
. Worked closely with Contract Manufactures and ODMs to migrate our system
reference designs to volume manufacturing
. Worked closely with marketing and sales on product planning
. Owned and developed technical documentation and training collateral
including, but not limited to specifications, data sheets, application
notes, design guidelines, technical presentations, proposals,
reference/user manuals, etc.
. Owned all internal and external customer technical training
. Worked closely with Product Line Marketing and chip managers on future
architectural development
02/02 to 10/03 Broadcom Corporation
Engineering Manager
Products: Gigabit Ethernet MACs & Integrated PHYs/SERDES
. Lead a team of Digital, Analog Engineers who assisted customers with
designing Broadcom chips into their host servers, workstations, PCs and
Blades
. Provided direction and technical guidance on difficult customer issues
that require advanced problem solving
. Designed MAC and PHY customer and test boards using Cadence tools
. Guided customers on proper layout techniques for their mother boards to
achieve the best EMI and signal integrity results
. Drove Signal Integrity initiatives throughout the organization
. Developed customized SW and FW to meet specific customer requirements and
features
. Owned and developed technical documentation and training collateral
including, but not limited to Data Sheets, Application Notes, Design
Guidelines, technical presentations, proposals, reference/user manuals,
etc.
. Resolved customer technical issues that could not be fully resolved by
field engineering
o Detailed Analog circuit and system signal integrity analysis including
intense lab investigation
o Detailed RTL code and/or gate level investigation and simulation
o Architectural investigation of state machine and flow analysis
o Software/Firmware code review and evaluation of register transactions
. Owned all internal and external customer technical training
. Represented Broadcom as the technical expert when attempting to win and
maintain business
. Worked closely with Product Line Marketing and chip managers on future
architectural development
02/99 to 02/02 Hewlett-Packard Company
R&D Manager
Products: Ethernet, Gigabit Ethernet, Fibre Channel (2 Gbps), ATM,
SONET, SCSI,
Managed a team of 15 people who designed, co-designed and qualified PCI
networking & mass Storage I/O HW & SW for UNIX Server Platforms
. Ranked as the top R&D Manager in a 200 person lab
. Worked Closely with Engineers in each step of the design and signal
integrity process
. Managed I/O hardware life cycle from the marketing requirements phase
through customer product release
. Designed, co-designed and qualified proprietary & PCI bused networking HW
. Integrated and fully qualify OEM I/O hardware on all supported UNIX
system platforms
. Served as hardware I/O consultant for the host platform back plane
designers
. Managed overall I/O card integration into our newly developed HPUX
servers
. Resolved all chip or board problems that are escalated back to the R&D
lab
. Worked closely with driver and firmware engineers to trouble shoot
problems and assure top quality board designs
. Owned all I/O regulatory and environmental certification
. Owned EMI, EMC, UL, CE, FCC Regulatory Compliance
06/97 to 02/99 Hewlett-Packard Company
Hardware Design Engineer
Products: Ethernet, Gigabit Ethernet, ATM, SONET (up to 0C48)
. Designed, co-designed and qualified proprietary & PCI bused networking HW
. Performed signal integrity analysis on all I/O cards and backplanes using
proprietary and industry software and hardware
. Wrote hardware portion of the product specifications and support plans
. Resolved all chip and board hardware problems that were escalated back to
the R&D lab
. Managed all field deployment strategies for releasing retrofitted or
reworked boards or chips
. Composed technical documentation to communicate hardware problem root
causes and resolutions
. Managed I/O hardware life cycle from the marketing requirements through
customer product release
. Served as the Hardware Consultant for OEM partners and our internal
software lab
06/96 - 06/97 VLSI Technology
ASIC Design & Verification Engineer
. Designed and verified specific blocks of a 10/100 Ethernet MAC using
Verilog
. Began Design on a 10/100/1000 (gigabit) Ethernet MAC
. Verified and characterized ATM SAR Chips
01/95 - 09/95 Bay Networks
Board Design & Test Engineer
. Designed and validated a 12 port Ethernet 10Mbps Repeater and management
module
03/91 to 12/94 Gannett Fleming Engineering (Transportation
Engineers & Consultants)
CAD Engineer & Project Manager
. Completed electrical power and lighting design using Computer Aided
Design
. Developed project schedule and managed sub consultants on a BART railway
extension and Caltrans road expansion
02/87 - 11/90 National Telephone Services
Senior Manager - Telecommunications
. Managed telecommunications engineers, technicians, and supervisors
. Mentored other managers and hired a 20 person staff
Hardware/RF & Software Tools:
Synopsys ASIC Tool Chain:
(Power compiler, Design Compiler Ultra, Formality, VCS, Primetime, HDL
compiler, DesignWare, Astro, HSIM)
Logic Vision Logic BIST and MBIST
AWR (Microwave Office)
Cadence Concept, Orcad (Capture CIS), Allegro
Cadence Verilog, Verilog-XL Simulator
Cadence Virtuoso Analog Tool Chain:
(Schematic/Layout Editor, Design Environment, Spectre Simulator)
Mentor Graphics:
Design Architect (Schematic Capture), Board Station (Layout), ICS (Signal
Integrity)
Hyperlynx (Signal Integrity), Pspice
UNIX (HPUX, SUN OS)
AutoCad
Oscilloscopes,
Logic, Network, & Spectrum Analyzers
C, C++, Assembly, Perl
EDUCATION:
MS Electrical Engineering
San Jose State University San Jose, CA
BS Economics
UC Berkeley Berkeley, CA
Patents:
1 issued #7514958
Several Pending