Steven Senigla
• 607-***-**** • • http://www.linkedin.com/in/mechengsteve
Cornell Ave Apt 1, Lakewood,
CO ******.*******@*****.***
MECHANICAL ENGINEER SPECIALIZING IN ELECTRONICS PACKAGING
Adept with engineering designs, developing products, improving processes, and leading teams, I excel at bringing
value to new products, analyzing and solving problems, lowering cost with best engineering practice, using resources
effectively, and providing creative and robust solutions.
EXPERIENCE
Senior Mechanical Engineer, Lockheed Martin Space Systems Company, Denver, CO 10/09 – 8/12
• Designed solutions using Pro/ENGINEER Wildfire to successfully package the ORION program’s custom,
ruggedized, dense, and waterproof Power and Data Unit (PDU) assemblies; recognized for the ability to
integrate new technologies and innovative approaches to solve design challenges
• Developed and designed PDU circuit cards to meet the rigors of a space-flight environment, also in Pro/E
• Guided and analyzed testing and flight requirements for the ORION CEV’s avionics suite’s flight-test
instrumentation and secondary structure
• Incorporated Design for Manufacturing (DFM) and Assembly (DFMA) concepts wherever possible to ease
fabrication, while reducing cost and error
• Employed process improvement and tool capabilities to decrease design cycle time through reduced dimension
drawings and highly detailed MCAD models, lower printed wiring board design turn-around time by maximizing
MCAD/ECAD interoperability, and standardize drawing views and notes
• Ensured design details were accurately established by capturing assembly functional relationships with
Geometric Dimensioning & Tolerancing (GD&T) per ASME Y14.5 and by creating drawings per ASME Y14.100
• Facilitated MCAD model downstream usage by becoming proficient in model-centric design practices with
respect to ASME Y14.41, fully parametric models, and modeling best practices
• Supported manufacturing teams with product design knowledge and expertise to assure proper fabrication
Senior Mechanical Engineer, Lockheed Martin Systems Integration (formerly), Owego, NY 2/04 – 10/09
• Led mechanical engineering teams designing for multiple programs and customers to on-time, on-cost, results-
oriented conclusions; supervised space-level RF hybrid and circuit card product design development, custom &
VME form factor avionics electronics packaging, new technology insertion, and complex interconnect layouts
• Organized design team efforts via requirements management, skills assessment, and cross-functional integrated
product team-level communication; worked closely with program management and technical leadership to plan,
budget, and connect with suppliers to achieve results that engendered mission success
• Promoted for excellence in technical aptitude and ability to manage teams working on difficult designs
• Designed subassemblies and detailed parts for several programs in CATIA V4 and V5
• Crafted a Product Data Quality (PDQ) Guidelines process document, outlining MCAD best practices and
configuration management by leveraging corporate, sister divisions’, and industry resources
• Conducted finite element modeling (FEM) and analysis (FEA) of thermal & structural problems in ANSYS
EDUCATION
Master of Science, Mechanical Engineering, Applied Mechanics
State University of New York at Binghamton
Bachelor of Science, Mechanical Engineering, Aerospace Option, High Honors
Rochester Institute of Technology, Rochester, NY
Bachelor of Science, Physics
State University of New York College at Fredonia
PROFESSIONAL DEVELOPMENT, CERTIFICATIONS & AWARDS
Advanced Technical Leadership Program, Lockheed Martin Corporation
EIT, New York State
United States Patent # 7081000, Modular Daisy-Chain Flange Mount For Coaxial Connectors
SOFTWARE SKILLS
Pro/ENGINEER Wildfire, CATIA V4 & V5, ANSYS, I-DEAS Design and Simulation, Pro/MECHANICA, ADAMS, MS
Office, MATLAB, Visual Basic