Engineer Mechanical

PRADIP SAIRAM PICHUMANI

Cell: 512-***-**** ************.*********@*****.***

Email: p ***********.*********@*****.***

P radip Cell: +1-512-***-****

LinkedIn:

Sairam h ttp://www.linkedin.com/pub/pradip-sairam-pichumani/38/471/828

Address: 408 S Oak Street, Apt 504, Arlington Texas – 76010

P ichumani

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P rofessional Synopsis

Graduate from The University of Texas at Arlington with qualitative experience in materials-level

characterization, semiconductor packaging, deprocessing & failure analysis. Proficient in FIB/SEM

(DualBeam/Single beam), Spectroscopy (EDS, WDS), AFM & optical microscopy. Well conversant with

surface metrology techniques. Experience with new product commercialization & equipment

evaluations. Sound verbal and writ ten communication skills with experience in team work and team

leading.

P rofessional Experience

Advanced M icro Devices (Austin – TX, USA) Jan 2012 – Aug 2012

Failu re Analysis Engineer (Co-op Engineer)

Accountable for the evaluation, development and characterization of semiconductor

deprocessing equipment (RKD Ultraprep and Allied X-mill)

Developed multistage polishing process to improve and optimize deprocessing of AMD

p rocessors

Silicon thinning for Fault Isolation & site specific silicon thinning for enabling FIB circuit edit

Delayering to aid in the creation of standards for Electro Optical Terahertz Pulse

Reflectometry (EOTPR)

Developed techniques for d ie-level root cause physical failure analysis on 32nm and

28nm semiconductor technologies

Instrumental in developing l ayer-by-layer etch back techniques for wet and dry

deprocessing of 3 D Stacked die technology

Isolated faults in processor units using R TX (Real Time X-Ray), SAM (Scanning Acoustic

M icroscopy) & LS M (Laser Scanning M icroscopy)

Performed d ie level wa rpage measurements to understand the change in die warpage over

t ime

Supported a number of test chip initiatives to drive development of new product, new

f ailure analysis and product evaluations such as CSAM & WDS (Wavelength Dispersive

S pectroscopy)

Played a k ey role i n test chip projects for t he upcoming two AMD microprocessor

p roducts i ncluding negotiating details specific to the f ailure analysis community for new tool

a nd technique development

Experience working with world-wide cross functional teams to improve yield by d ebugging

p rocess, assembly and test issues

Documented and updated t he results in the L ab Management System for various

f ailure analysis requests.

University of Texas at Arlington Dec 2010 – Dec 2012

Graduate Research Assistant

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PRADIP SAIRAM PICHUMANI

Cell: 512-***-**** ************.*********@*****.***

Developed protocols for experimental setup of t r ibofilm formation on ASTM E52100 steel

surface using the H igh F requency Reciprocating Rig (H FRR), Ball on Cylinder Lubricity

E valuator & Four-ball rota ry T r ibometer

Extensive literature study to comprehend principle mechanism of t ribofilm formation

Characterized t ribofilms using X ANES (X-ray Absorption near Edge Spectroscopy)

& other techniques to understand its structure and chemistry

F requent presentations & documentation of experiments, observations

demonstrating the progress in research work

Academic Credentials

Masters in Materials Science &

201 The University of Texas at Arlington, with

E ngineering

2 GPA 3.7/4.0

Bachelors in Polymer Engineering

201 Amrita Vishwa Vidyapeetham, with GPA

0 3.1/4.0

Key Skills/Training

Ma te rial Characterization & Failu re Analysis : DualBeam FIB ( Helios450), VPSEM ( FE I

Q uanta650), N oran EDX, M agnaray WDS, sample preparation (chip de-processing) using

mechanical cross-section, diamond wire cutter, chemical and mechanical decapsulation, D age 3D

R TX, CSAM (Sonoscan & OKOS SAM), L aser profiler, AFM, Nanoindentaiton, UV/Vis ( Keyence

V HX 2000, Keyence V HX 700), micro-probing, Curve Tracer, Microscopy specimen thin sectioning

(FIB, Tripod Polisher, Ion Mill, RKD Ultraprep, Allied X-mill), D OE, SPC & F M EA approach,

Spectroscopy analysis ( XANES – V LS PG M & DC M), Hot bonder ( Heatcon) for curing composite

panels.

Mechanical Testing: • Four Ball Rotary Tribometer • High Frequency Reciprocating Rig

Software skills: • P roficient in C adence, AutoCAD, P ro/ENG I N EER, ABAQUS, ANSYS,

O riginP ro, SP I P I mage Met rology

• Operating systems: W indows XP/Vista/7/8, Mac OS, Linux

• Packages: M icrosoft Office Tools

Achievements & Affiliations

• S ilver award w inner for poster presentation in 68th A nnual STLE (Society of T ribologist &

L ubrication Engineers) conference • Recipient of M aterials Science & Engineering

G raduate Scholarship • Member of Golden Key Honor Society & STLE • Member of ASM

I n te rnational & ACerS (American Ceramic Society) • Member of Society of Plastic

E ngineers • Member of G raduate Student Senate, UTA

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PRADIP SAIRAM PICHUMANI

Cell: 512-***-**** ************.*********@*****.***

Academic P rojects

Wear and T r ibofilm formation w ith Zinc-F ree Antiwea r Additives: T he main goal of this

study is to understand the mechanism of formation of t ribofilms from combining ashless additives,

t heir synergistic and antagonistic properties and wear performance with different blends of these

additives.

Ai rcraft Composite Repai r - Heatcon Composite T raining, Philippines: H ands on t raining in

t he preparation of aircraft composite laminates. The material loss in a damaged composite is studied

as different hole pattern and the damage is repaired by having a patch on the laminate (patch, scarf &

step sanded repair).

M echanical and Visco-elastic properties of silicone r ubber nanocomposites and its

a pplication in vibration damper (Sponsored by The Indian Space Research Organization – ISRO):

T his project involves theoretical (FEM analysis) & experimental evaluation of silicone nanocomposite

(with various levels of organic nanoclay loading) as a vibrational damper in launch vehicles

Conference P roceeding Papers

Pichumani, P radip Sairam; Bagi Sujay; Aswath, P ranesh B ; “Wear and Tribofilm

formation with Zinc-Free Antiwear Additives” S ilver award for the poster presentation a t

68th A nnual STLE Conference, May 2013.

Pi tchumani, P radip S; Chen, Xin; Elsenbaumer, Ronald L; Aswath, P ranesh B ; “Wear

and Tribofilm formation with Zinc-Free Antiwear Additives” 67th Annual STLE Conference, May

2012.

P radip P Sairam; Sreeja M R; Ajith Ramesh; Meera Balachandran ; “Mechanical And

V isco-Elastic Properties Of Silicone Rubber – Nanoclay Composites And I ts Application In

V ibration Damper”, Proceedings of International Conference on Manufacturing Science and

Technology (ICMST 2010), jointly organized by Indian Institute of Space Science and Technology

and Materials Research Society of India, Thiruvananthapuram on October 29-31, 2010

Additional I nformation

Sponsorship requi red for full time employment

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