Senior Process Engineer

Senior Process Engineer $160,000–$190,000 + Equity Hybrid San Diego, CA

A rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications .

We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes, particularly Flip Chip and Thermo-Compression Bonding (TCB) .

What you’ll be doing:

Develop and optimise optoelectronic assembly processes

Lead Flip Chip and TCB process development

Support 2.5D/3D packaging integration

Work with suppliers and manufacturing partners to scale processes

Design and execute DOE to improve yield and performance

Monitor process health, including yield and failure Pareto trends

Develop SOWs and project plans for new process development

What we’re looking for:

5+ years' experience in manufacturing/process engineering

Strong expertise in Flip Chip and Thermo-Compression Bonding

Experience with 2.5D/3D packaging and reliability challenges

Experience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similar

Experience with FMEA

Understanding of optoelectronic devices and packaging reliability

Knowledge of microelectronics/photonics packaging processes

Bachelor's degree in Engineering, Physics or a related discipline

Comfortable working in a fast-paced, high-growth environment

This is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.

Location: San Diego, CA – Hybrid

Salary: $160,000–$190,000 + Equity + Full Benefits Package