Hands-On Manufacturing Project Engineer
Resume:
JAMES D. COOKE
Phoenix, AZ *****
SUMMARY
Hands on Manufacturing Engineer with expertise in consistently achieving business, customer and profit objectives by improving manufacturing capabilities using Lean Manufacturing principles to drive results. Background includes both Process and Equipment Engineering roles using root cause analysis and troubleshooting to improve product yields and implement cost reductions within dynamic global organizations. Calm, stabilizing force that contributes accurate, intuitive decision making to team successes.
SELECTED ACHIEVEMENTS
• Cost Champion/Team Leader that achieved annual savings of $1.2M by reducing Spares spending by $4/wafer start.
• Achieved 17% increase in equipment availability by developing/implementing new Preventive Maintenance program.
• Met cost control objectives with 75% reduction in manpower by developing a new waste management system that significantly reduced risk of injury.
• Team Leader that reduced, by 40%, control wafer use with an annual savings of $621K.
• Root Cause Analysis Leader that eliminated a chronic high scrap rate issue, significantly increasing equipment availability while also developing a cleaning process with a new vendor and greatly reducing cost of ownership.
PROFESSIONAL EXPERIENCE
INTEL CORPORATION, Hudson, MA 2006-2007
Process & Equipment Engineer
Process & equipment engineer that successfully managed two Plasma Etch operations: Nitride Spacer Etch utilizing TEL Unity II DRM etchers and Nitride Pad Etch utilizing LRC 4420 etchers.
• Increased Pad Etch availability to 96% from 88%, with historic dog tool increased to 96% from 71%; and 30% increase in scheduled vs. unscheduled maintenance during nine month span using Preventive Maintenance –PM matching across shifts; troubleshooting (TS) historic RF issue and managing BOM to reduce waiting part downtime.
• Increased Spacer Etch availability to 94% (up 7% on a two of a kind toolset) by PM Matching across shifts; partnering with Inter-Module defectivity team to increase monitors efficiency, reducing unscheduled cleans by 60%; TS to root cause/resolving persistent intermittent particle failures.
• Drove efforts to reduce/eliminate worldwide TEL fleet ‘s historical SECS Communication Errors by partnering with IT to characterize issue, defining two separate reasons for error.
ON SEMICONDUCTOR (formerly Cherry Semiconductor), East Greenwich, RI 2000-2005
Functioned as Equipment Services Manager and Senior Engineer for this global supplier of advanced semiconductors for sophisticated electronics applications within the portable, wireless, computing, consumer, networking, automotive, and industrial end-product markets.
Equipment Services Manager 2005
Met FAB Decommissioning Project deliverables by effectively leading twenty technicians and two engineers that managed decontamination, decommissioning, breakdown, safety inspections, and global shipping processes.
Achieved accelerated time requirements by shipping last tool two weeks ahead of schedule, with zero reportable injuries and no damaged equipment.
Senior Equipment Engineer 2003-2005
Managed Photolithography, Etch, and Metal areas and functioned as FAB Emergency Response Team member.
• Gained 60 man-hours per week by reducing evacuations due to solvent smells (from 2/wk to <1/mo) as Cross-functional Team Leader that identified, isolated and remedied root-cause.
• Achieved smooth installations of two DNS60A Coat Systems, one SEMIX TRU6133 SOG Coat System, and three Ultratech 1500 Steppers.
• Developed PM Program that delivered 92% availability for DNS 60A systems by authoring ISO Specifications, launching Level I/II Training Courses and delivering on-the-job training/coaching of Maintenance/Process/Manufacturing team members in proper tool operation/ maintenance.
• Member FAB Decontamination & Decommissioning Team requested to remain, prepare for and execute FAB shutdown including preparation of tool specific checklists and protocols and construction of MS Access Database to track equipment during Shutdown operations.
Senior Process Engineer 2000-2003
Metal Deposition/Flip Chip/Backgrind Section Sustaining Engineer that managed day-to-day shift support throughout FAB including Statistical Process Control (SPC), ISO documentation maintenance, scrap reduction, and engineering projects.
• Two year project involving the qualification of a change in Al-Cu metallurgy across ALL product lines by comparing FAB measurements (Photo & Etch CDs) & Post-FAB measurements (Parametric, Probe, Packaging, Final, and Life tests).
• Installed and qualified new deposition tools (Varian 3290, TEL Eclipse Mark II)
• Converted Flip Chip metal deposition (Al-Cu & Under Bump Metal (UBM)) to Varian 3290
• Reduced 15:1 BOE acid use by 70% by implementing SPC charting.
• Converted from 4 inch to 6 inch plating system including designing a plating rack system and Periodic Plating Bath Maintenance procedures.
Process Engineer 2000
Technical Shift Leader that provided weekend/holiday engineering coverage for entire FAB including supervising all process/ maintenance technicians.
• Led Shift Scrap Response Team that achieved 66% reduction in FAB scrap rate & 85% reduction in scratched wafers by immediately evaluating, documenting and designing solutions to presenting issues.
• Achieved >25% decrease in Spray Metal Etch scrap/rework by combining detailed metal deposition and etch tool process controls with improved maintenance procedures & training.
ELECTRO-FILMS, INC (currently Vishay EFI), Warwick, RI 1998-2000
Thin Films Process Engineer
Managed diffusion, PECVD, and PVD processes and maintenance functions; installed and characterized sputter tool (TaN, NiCr, and Al) and PECVD tool.
UNIVERSITY OF RHODE ISLAND – Chemical Engineering, Kingston, RI 1996-1998
Graduate Research Assistant & Lab Manager
Designed, fabricated, and tested Metallic & Semiconductor sensors for Aerospace applications; performed corrosion research and produced data resulting in 4 publications as 2nd or 3rd author.
EDUCATION
University of Rhode Island, Kingston, RI
Graduate Study Ocean Engineering: Corrosion, Semiconductor Manufacturing and Acoustics
Worcester Polytechnic Institute, Worcester, MA,
BS in Mechanical Engineering with Materials Engineering Coursework
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