Excellent Mechanical Engineer with specities in MEMS system.

Kuan-Lin Chen

EDUCATION

****~present Stanford University California, USA

Ph.D. candidate in Mechanical Engineering (expected Sep. 2009)

Advisor: Prof. Thomas W. Kenny; Co-advisor: Prof. Roger T. Howe

2004~2006 Stanford University California, USA

Master of Science in Mechanical Engineering

1999~2003 National Taiwan University (NTU) Taipei, Taiwan

Bachelor of Science in Mechanical Engineering

SKILLS

 MEMS related: MEMS design, Fabrication process development, Micro-fabrication, Semiconductor process

 Curriculum: Smart Product Design (ME218A, B & C), Mechatronics, Sensors, MEMS Systems, Dynamic Analysis and Simulation of Mechanical Systems, Biomedical Device Design, Orthopedic Bioengineering.

 Computer Programs: MATLAB, L-Edit, Solidworks, COMSOL Multi-physics.

 Languages: English, Chinese (Mandarin), Taiwanese

RESEARCH PROJECTS / EXPERIENCES

2006/9~present Encapsulated Radio Frequency MEMS Resonators and Filters, Research Assistant

• Led the development of encapsulated RF MEMS resonators that are the key technology for the portable radio system in DARPA Analog Spectral Processor project.

• Designed and fabricated a series of encapsulated resonators from 20-200 MHz for single-chip transceiver. The 200 MHz resonator has the highest f×Q product among MEMS resonators.

• Collaborated with Prof. Sunil Bhave in Cornell University to develop an encapsulated high-K dielectric internal-driven resonator.

• Developed an electrode integrated packaging process for out-of-plane MEMS devices.

• Evaluated the signal integrity of silicon interconnects.

• Sole representative from Stanford team for reviews with DARPA managers.

2005/9~2006/9 Navigation Grade Piezoresistive Accelerometer, Research Assistant

• Developed a wafer-level encapsulation process for MEMS devices that require large displacement.

2005/4~2005/9 Bio-Medical Applications for Miniature Piezoresistive Accelerometer, Research Assistant

• Developed a flexible Kepton® packaging of the sensor for bio-applications.

• Characterized and analyzed the sensor performance.

• Conducted the in-vivo experiment of using the miniature accelerometer as a sound detector for cochlear implant.

2003/9~2004/7 National Taiwan University Department of Mechanical Engineering, Teaching Assistant

• Responsible for classes including Product Design, Systematic Mechanical Design and Mechanism

RESEARCH INTERESTS

• Device: MEMS actuators, inertia sensors, pressure sensor, resonators.

• Process: MEMS packaging, Wafer-level packaging.

• Integration: Biomedical applications using MEMS sensors, On-chip components integration.

PUBLICATIONS

1. Kuan-Lin Chen, S.S. Wang, J. Salvia, R.T. Howe, T.W. Kenny, “Encapsulated out-of-plane differential square-plate resonator with integrated actuation electrodes,” The 15th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCER ’09), Denver.

2. Kuan-Lin Chen, H. Chandrahalim, A.B. Graham, S.A. Bhave, R.T. Howe, T.W. Kenny, “Epitaxial silicon microshell vacuum-encapsulated CMOS-compatible 200 MHz bulk-mode resonator,” IEEE International Conference MEMS 2009, Italy.

3. Kuan-Lin Chen, R. Melamud, S.S. Wang, T.W. Kenny, “An integrated solution for wafer-level packaging and electrostatic actuation of out-of-plane devices,” IEEE International Conference MEMS 2009, Italy.

4. S. Yoneoka, G. Bahl, J. Salvia, K. L. Chen, A. B. Graham, H. K. Lee, G. Yama, R. N. Candler, and T. W. Kenny, “Acceleration compensation of MEMS resonator using electrostatic tuning,” IEEE International Conference MEMS 2009, Italy.

5. Kuan-Lin Chen, S.S. Wang and T.W. Kenny , “An advanced wafer-level packaging method for electrostatic actuated out-of-plane MEMS devices,” IMAPS International Conference and Exhibition on Device Packaging, 2009, Arizona, USA (Best student paper award)

6. Chen, K-L; Silvia, J; Potter, RC, Howe, RT; Kenny, TW; “Performance Evaluation and Equivalent Model of Silicon Interconnects for Fully-Encapsulated RF MEMS Devices,” IEEE, Transactions on Advanced Packaging, In Press, 2008

7. B. Kim, M. Hopcroft, C. M. Jha, R. Melamud, S. Chandorkar, M. Agarwal, K. L. Chen, W. T. Park, R. Candler, G. Yama, A. Partridge, M. Lutz, T. W. Kenny, “Using MEMS to Build the Device and the Package,” Transducers / Eurosensors 2007, 2007.

8. Ayanoor Vitikkate, V; Chen, K-L; Park, WT; Kenny TW; “Development of a process for wafer scale encapsulation of devices with very wide trenches”. ASME IMECE 2006, Chicago, U.S.A.

9. Ayanoor Vitikkate, V; Chen, K-L (Presenter); Park, WT; Yama, G.; Kenny TW; “ Wafer Scale Encapsulation of Wide Gaps using oxidation of Sacrificial Beams”, IEEE IEMT 2006, Putrajaya, Malaysia.

10. W.-T. Park, K. N O'Connor, K.-L. Chen, J.R. Mallon Jr., T. Maetani, P. Dalal, R.N. Candler, V. Ayanoor-Vitikkate, J.B Roberson Jr., S. Puria, T.W. Kenny, “Ultraminiature encapsulated accelerometers as a fully implantable hearing aids,” Journal of Biomedical Microdevices, 2007

REFERNCES

Prof. Thomas W. Kenny: ******@********.*** ;

Prof. Roger T. Howe: ******@********.*** ;

Prof. Sunil Bhave: *****@***.*******.***

Contact this candidate