Engineer Quality

MICHAEL W BECKMAN Phoenix, AZ ***** 503-***-**** ********@*****.***

PROFESSIONAL EXPERTISE

Materials Engineering Supplier Quality Engineering Business Development

Technical Project Management Manufacturing Engineering New Product Introductions

OBJECTIVE

To obtain a supplier quality, NPI manufacturing or technical project management position where I can use my demonstrated experience, broad range of competencies and strong commitment to excellence across the spectrum of product development.

ABILITIES/SKILLS/KNOWLEDGE: Design for Manufacturability, Assembly and Test (DFx) ● Total Quality Management; ISO9001 Quality Mgmt System ● Measurement Systems Analysis (MSA) ● Root Cause Failure Analysis, 8-D ● First Article quality inspection ● MRB process for defect disposition ● FMEA ● Product Yield Improvement ● SAS .jmp Data Analysis ● Quality methodology implementation in a manufacturing environment

● Supplier Management/Communication, Supplier Scorecard Implementation ● Supplier Audit and Corrective Action ● NPI to HVM Product Transfer ● Planning Strategies ● Configuration and Release Management ● Quality Business Reviews ● Meeting Facilitation ● Dash-board updates and Technical Presentations ● (ECO) Engineering Change Order Management ● RMA analysis ● Project Life Cycle Management ● Cross-functional Team Leadership

● Negotiation and Influencing ● Project Cost Benefit Analysis ● Service Level Agreements (SLA’s), Terms & Conditions (T&C’s) ● ASME Y 14.5 GD&T ● Design and development of electronics enclosures ● IPC Standards

● RoHs compliance ● Thru-Hole, Surface Mount (SMT) and Mixed Technology ● SAP AG proprietary application ERP/MRP (SPEED) ● Oracle EDPM Enterprise Data Process Management ERP/MRP ● Epicor Enterprise Resource Planning (ERP) ● Job Tracker (Project Management) ● MS Office suite: (Word, Excel, PowerPoint, Project, SharePoint, Outlook, Live Meeting, Visio) ● Electro/Mechanical CAD.

EDUCATION

AAS; Associate of Applied Sciences; Arizona Institute of Design, Glendale Arizona.

BSET; Undergraduate coursework; Phoenix Institute of Technology

Diploma, (Distance Learning) Cleveland Institute of Electronics and Technology

Continuing Education Intel University; >220 hours completed of technical and business studies.

PROFESSIONAL STUDIES

cAPM Associate in Project Management (Intel corporate business coursework)

● Project Management Fundamentals ● Leadership in a Project Team Environment

● Structured Problem Solving ● Constructive Confrontation

cSCP Supply Chain Management (Intel corporate business coursework)

● Supply Chain Fundamentals ● Supplier Relationship Management

● Manufacturing Resource Planning ● Source Selection and Fair Value Techniques

● Ethics in the Workplace / Business Practice Excellence

U.S. & INTERNATIONAL PATENTS

● Developed Three U.S. Patents, ten disclosures and eight company-protected publications.

U. S. Patent # 7,121,841 – Electrical Socket with Compressible Domed Contacts – Issued 10/17/2006

U. S. Patent # 7,234,947 – Optical Fibers Embedded in the Woven Glass Fabric – Issued 6/26/2007

U. S. Patent # 7,361,842 – Apparatus and Method for an Embedded Air Dielectric for a Package and Printed Circuit Board Applications – Issued 4/22/2008

HONORS

Received five (DRA) Divisional Recognition Awards for:

• “Outstanding performance to Intel values for delivery of customer support; developing a support model to align with the needs of the Optical Products Division business unit”.

• “Demonstrated success for the ability to analyze problems, recommend solutions and implement procedures to achieve operational objectives”.

• “Contribution of process development to the "First Intel mobile Pentium II processor with on die L2 cache”.

• “Contribution to the success of the pinned interposer configuration decision, leading to the development of the first 0.050” socketed processor technology”.

• “Contribution to the design of final inspection mechanism for the development of an Acuity Vision system Module, enabling the early launch of pinned interposers”.

• Received employee of the month; September 07' for outstanding performance and dedication.

Volt Technical Services (Intel Corporation)

AFFILIATIONS

• Allied Member of the IPC; Institute for Interconnecting and Packaging of Electronic Circuits

Michael W. Beckman Beaverton, OR 97006 503-***-**** ********@*****.***

WORK HISTORY

Wells-CTI Phoenix, Arizona – Apr 2012 to Present

Supplier of burn-in, thermal socket and contact resistance solutions for Silicon qualification and characterization.

Product Quality/Manufacturing Engineer

• Owned and managed all aspects of the RMA process from customer requests, coordination of receipt, initial product failure diagnosis to final reports. Performed failure isolation and defect analysis/characterization and trend analysis. Ensured analysis was completed per all protocol objectives. Documented projects in “Job Tracker” project management tool and EPICOR ERP system.

• Authored (8-D, R/C, C/A) reports for returned products. Advised internal and external customers regarding corrective actions based on the results of analysis. Provided accurate and crisp reporting, highlighting analysis to Sr. Management on a regular basis.

• Developed and implemented preventive and continuous improvement actions.

• Created work assignments, provided concise assembly instructions and technical assistance to production operations’ non-exempt personnel. Provided technical expertise and mentoring to team members. Established process metrics to evaluate process performance. Assisted with goal-setting and tracking for Continuous Improvement measures.

• Coordinated cross-functionally with internal stakeholders e.g. Planning, Customer Service, Sales, Design & Test Eng and Machine Shop to orchestrate efforts to ensure effective remediation of issues.

Adecco Engineering Services – Feb 2011 to Mar 2012

Under contract to Tektronix Corporation: Scopes, Signal Generators, Spectrum Analyzers, Bench Instruments, and Probes, Beaverton, OR.

Supplier Quality Engineer

• Engaged with domestic and APac suppliers to ensure all quality issues were resolved in a timely manner.

• Developed and executed material program plans, led supplier qualification activities, instituted supplier development e.g. performance measures (quality, support and delivery).

• Delivered results by key metrics; supplier yield, cost, defect rate, supplier quality plan effectiveness, and closed loop corrective & preventative action closure.

• Managed the MRB (Material Review Board), CAR/PARs (Corrective/Preventive Action Requests) and deviation waivers.

• Performed first article inspection review of all incoming material, turned approved material to controlled state through the execution of Oracle EDPM Enterprise Data Process Management ERP/MRP.

• Supported the engineering and manufacturing communities with technical expertise and testing.

• Consulted for design tradeoffs including Supplier Capability, Yield, Stability, Performance, and Quality/Reliability.

Technisource Technical Services – Oct 2010 to Jan 2011

Under contract to Intel Corporation; CPLG, Corporate Planning and Logistics Group, Hillsboro, OR.

Engineering Material Analyst

• Managed engineering material and supplier readiness through the execution of SPEED; (System Components, Products, Engineering and ECO Database) Intel’s proprietary MRP (Material and Resource Planning) Engineering Tool (SAP).

• Supported service level agreements between CLPG and Intel’s business units, Global Factories and Virtual Factories for product data management, factory excursion management, customer quality notifications, product documentation and environmental compliance (IPC-1752).

• Responsible for input, review and coordination of changes to engineering and product deliverables. Implemented change management policies throughout product development phases and onto production phases within product life cycle.

Fastlane Engineering –June 2008 to Sept 2010, Folsom, California

Product Development Engineer - Consultant

• Established/maintained working relationships with ODMs and CMs for the successful development, qualification and production of single board storage controllers for customer application development.

• Supported design validation, test, manufacturing and process management plans to ensure that manufactured products met company and customer requirements.

• Coordinated and monitored design and pre-production. Facilitated completion of internal & customer qualification/release & revision of specifications & production documentation.

• Supported the organization's Quality Assurance functions by conducting audits including process, compliance, supplier, system, ISO 9001-2008.

Michael W. Beckman Beaverton, OR 97006 503-***-**** ********@*****.***

Volt Technical Services – Apr 2007 to May 2008

Under Contract to Intel Corporation, DEG; Digital Enterprise Group, Design Validation, Hillsboro, OR

Technical Project Engineer – Supplier Quality Engineer

• Led product development projects through full life cycle; managing scope, schedule and budget from planning phase; to the launch of platforms within constraints of time, cost and performance.

• Assisted with supplier selection, audited their fabrication capability, quality management systems. Evaluated reliability, materials, influenced design direction/configuration, made recommendations to management resulting in increased capability and yields at reduced costs.

• Developed a cost benefit analysis and negotiated reduction of validation collaterals purchased, resulting in savings of ~$120K of a $500K project budget.

Intel Corporation

Apr 2003 to Dec 2006 Intel Corporation SMO; Systems Materials Operations, Hillsboro, OR

Materials Engineer – Supplier Quality Engineer

• Audited Suppliers and provided input regarding manufacturing operations, original design requirements and supplier quality to assure compliance with quality requirements and quality systems.

• Developed and executed material program plans and supplier qualifications, managed corporate supply chain quality resulting in cost reductions & value-engineering strategies for offshore suppliers.

• Facilitated resolution of supplier related service and quality issues. Initiated incoming data collections and inspections, responsibility for MRB containment to prevent supplier defects from impacting production.

• Developed visual inspection criteria for builds of Intel’s 10GHz Optical Transponder at Contract Manufacturer resulting in (300 DPM 90 DPM) reduction.

• Developed and performed statistical analysis on (CTF) Critical to Function parameters resulting in launch readiness of Intel’s first 10 Gbps DWDM optical transceiver module.

Nov 2000 to Apr 2003 Intel Corporation PAE; Platform Applications Engineering, Folsom, California

Hardware Development Engineer – Supplier Quality Engineer

• Provided hardware project development support, concept development, specifications, and generation of related documentation.

• Performed Design for Manufacturability, Assembly and Test (DFx) for next gen platforms using Object Oriented ODB++ DFx Tool.

• Drove materials risk analysis, materials qualifications and cost reductions, through management of supplier quality activities. Executed excursion mitigation/prevention by driving initiatives such as: early supplier involvement in new product development and design for manufacturability rule implementation.

• Drove acquisition and analysis of supplier in-process data, including output yields and overall performance evaluation and assessment of process capability. Developed quality metrics to evaluate supplier performance.

• Developed and implemented resolution to supplier related quality issues, drove supplier corrective actions, performed benchmarking and other analysis to ensure process capability levels were achieved.

Mar 1997 to Nov 2000 Intel Corporation ATTD; Assembly Test Technology Development Group, Chandler, AZ

Package Integration Engineer - Design Team Lead

• Sr. Packaging engineer; focused on all aspects of chipset (MCH/PCH) Memory Control Hub/Platform Control Hub and (CPU) Central Processing Unit packaging for Intel desktop and enterprise server chipset packages.

• New product development Design Team Lead: team oversight of 6 design engineers for design process development, physical design, mechanical/thermal constraints, power delivery, signal integrity, laminate material and assembly of semiconductor packages. Responsibility for input to resources’ performance reviews.

• Formulated and published (PRDs) Product Requirements Documents for microprocessor products. These documents served as design for manufacturability guidelines.

• Represented manufacturing interests to substrate suppliers; obtained/maintained 1-3% qtr over qtr supplier cost reductions of a <$1.2M budget for interposer mechanical collaterals.

U.S. Robotics (3Com Corporation) Personal Communications Division, Skokie, Illinois – Feb 1994 to Mar 1997

Commodity Quality Engineer

• Participated as a member of commodity management team on material sourcing, qualification, and performance issues, set quality targets, monitored performance and defined supplier improvement initiatives.

• Co-developed detailed audit agendas tailored to focus on key requirements. Led supplier qualification audits.

• Supported commodity management with development of supplier strategies for long-range business direction.

• Worked with product manufacturing to solve functional problems or failures, reported status and issues to Product Engineering, Commodity Management and Procurement within the Telephony Products Group.

Michael W. Beckman Beaverton, OR 97006 503-***-**** ********@*****.***

• Was the primary escalation point between Quality and Manufacturing, supported new product introductions.

• Ensured corrective actions and improvements were implemented and monitored, evaluated supplier quality process controls for overall capability.

• Developed and implemented resolution to supplier related quality issues, drove supplier corrective actions, performed benchmarking and other analysis to ensure process capability levels were achieved.

• Spearheaded the implementation of keypad conductive ink in lieu of gold plating resulting in BOM savings of $0.78, translating to $410K over 3 yrs.

Barnes Engineering (EDO Corporation) Space Borne Products Div., Shelton, Connecticut – Mar 1990 to Feb 1994

Design Services Group Lead

• Managed, coached and motivated a diverse group of design professionals; implemented department objectives including resource allocation, project coordination, task definition, timeline and milestone development in a highly dynamic environment for hardware design activities of Space Shuttle qualified programs.

• Planned for and ensured appropriate resources, skills, and equipment were in place to meet design demand.

• Performed to and implemented provisions for National Aeronautical and Space Systems to ensure the required high quality of materials, parts, components and services and systems per NASA Handbook NHB 5300.4 (1A), (1B), and (1C).

• Implemented design review processes that increased efficiencies, accelerated throughput and reduced error rate.

• Worked closely with Q&R to ensure incoming and (FAI) First Article Inspections were to print, assisted with corrective action implementation.

• Worked with management for the procurement of a (Mitutoyo CMM) Coordinate Measuring Machine. Collaborated with quality technicians for the development of measurement user interface and training resulting in reduced inspection times of 75% over manual process.

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